200946418 六、發明說明 【發明所屬之技術領域】 本發明是關於用來搬運或保管半導體晶圓之晶圓收納 容器。 【先前技術】 關於半導體晶圓的尺寸，現在已開始討論最大 © 450mm的晶圓規格，其口徑是越做越大，但半導體晶圓 的厚度並不厚，因此，在半導體晶圓的製作過程中之半導 體晶圓的處理，特別是在用來保管半導體晶圓的晶圓收納 容器內必須謹慎的處理。另外，半導體元件的最小圖案也 開始進入50nm以下。隨著如此般微細化的進展，在裝載 著1 OOnm以下的設計規則的元件之半導體晶圓，製程中 產生的粒子的存在，會對晶圓上的圖案造成致命的缺陷。 因此，在用來保持半導體晶圓的環境氣氛內，即使是非常 〇 微小且微量的粒子也必須完全防止。特別是在晶圓收納容 器內，必須儘量避免讓半導體晶圓和晶圓收納容器內發生 接觸。以防止因接觸而產生粒子。在以往所提出或使用的 晶圓收納容器，是將半導體晶圓的周緣部用V形溝槽或ϋ 形溝槽來支承（專利文獻1 )，或是將半導體晶圓的邊緣側 面部及半導體晶圓的背面周緣部予以支承（專利文獻2)。 專利文獻1:日本特開2002-353301 專利文獻2:日本實登3020287 200946418 【發明內容】 在專利文獻1之晶圓收納容器的晶圓支承部是形成V 形溝槽的情況，是用V形溝槽來支承晶圓周邊，且晶圓 支承部是與要形成元件之半導體晶圓的表面的晶圓周緣部 接觸。結果，在晶圓周緣部之形成於半導體晶圓的薄膜 (氧化膜、氮化膜、或金屬膜等）會稍微剝離而飛揚，以粒 胃 子的形式附著在比晶圓周緣部更內側的形成有元件（或是 要形成元件）的表面上。或是，與晶圓周緣部接觸的晶圓 © 支承部（材質爲高分子材料）之些微剝離等，也會產生前述 問題。再者，晶圓表面側僅在晶圓周緣部受到支承是當然 的，而在晶圓背面也是僅在晶圓周緣部受到支承，因此， 特別是在晶圓變得大口徑化的情況，因晶圓本身的重量會 造成晶圓發生撓曲，而使晶圓的穩定度變差。特別是在晶 圓從收納容器取出或放入時’晶圓可能會傾斜而造成晶圓 破損。另外，保管於收納容器的晶圓，受到反覆的晶圓撓 曲振動，也可能會造成晶圓破壞。再者’晶圓彼此也可能 〇 在晶圓收納容器內接觸而造成元件損傷’或因接觸而產生 粒子等。 _ 專利文獻2所示之半導體晶圓的支承方法’由於半導 體背面周緣部與收納容器接觸’因接觸所產生的粒子等會 繞行到半導體表面而附著在半導體表面。或是’會附著在 載置於下方之其他半導體晶圓的表面。結果會產生圖案缺 陷而使半導體晶圓的良率和特性變差。 本發明的目的是爲了提供一種晶圓收納容器’除了可 -6- 200946418 防止搬運中的衝擊等所造成的半導體晶圓的破損，且在取 出半導體晶圓時，能將半導體晶圓以無破損的狀態進行安 全且容易的取出。另外是爲了提供一種能使晶圓收納容器 內產生的粒子等降低至最少的晶圓收納容器。 爲了達成上述目的，本發明之晶圓收納容器，係具 備：至少具有1個開口之收納容器本體、閉合前述開口的 蓋體、在將前述收納容器本體用前述蓋體閉合時使前述收 © 納容器本體的內部和外部環境氣密地隔離的密封構件、形 成於前述收納容器本體的內部且將晶圓以整齊排列的狀態 支承之晶圓保持具；其特徵在於： 晶圓保持具係具備：將複數個晶圓以隔既定間隔沿軸 方向整齊排列的狀態支承之複數個層架、用來支承前述層 架的支承板部、用來將前述支承板部安裝於前述收納容器 本體的內部之支承板安裝部、形成於前述支承板部而將前 述複數個晶圓在徑方向施以限制的限制部；又在層架內側 Ο 穿設1個或複數個孔。另外，層架具有：形成於層架的上 面（載置晶圓時的上側，與晶圓背面接觸的側）而用來支承 並載置上述晶圓背面的1個或複數個載置突起。 另外，上述限制部，僅在半導體晶圓的側端頂部、或 是僅在半導體晶圓的側端頂部和半導體晶圓的斜面部與半 導體晶圓接觸。再者，限制部和層架的邊界，是形成傾斜 (與半導體晶圓背面的斜面下部接觸的部分是形成傾斜）。 晶圓保持具，是在晶圓收納容器內，形成以二側基準面爲 對稱面而呈相對置的一對鏡像體構造。 -7- 200946418 藉由採用本發明的晶圓保持具，能以不接觸晶圓背面 的晶圓周緣部分的方式，在比晶圓背面的晶圓周緣部分更 內側的微小部分支承晶圓。因此，從半導體晶圓背面側繞 行到半導體晶圓表面側的粒子等變得非常少。再者，在晶 圓背面之比其周緣部更內側，用載置突起來支承，如此可 將晶圓的撓曲量抑制成最小。特別是在大口徑的晶圓的情 況，由於晶圓的撓曲量大，故本發明的晶圓保持具的效果 顯著。而且，由於撓曲量變小，積層於晶圓收納容器的晶 © 圓間距可縮小，結果可增加晶圓收納容器可保管的晶圓數 量。再者，在將半導體晶圓取出放入時，由於是將半導體 晶圓載置於複數個載置突起上，故能將半導體晶圓穩定地 設置成水平。結果半導體晶圓就不會發生破損。 再者，限制部的構造，是僅在晶圓側端頂部或者晶圓 側端頂部和晶圓的斜面部與晶圓接觸，如此對於形成有半 導體元件的半導體晶圓表面，包含半導體晶圓的周緣部完 全都不會接觸，而能以此狀態將半導體晶圓收納保管於半 © 導體晶圓收納容器。半導體晶圓的背面，是在形成於收納 容器本體的內部且用來將晶圓以整齊排列的狀態支承的晶 圓保持具，載置於形成在複數個層架（連接於安裝部，用 來將複數個晶圓以隔既定的間隔沿軸方向整齊排列的狀態 支承）上的複數個載置突起，而且半導體晶圓的晶圓側端 頂部或晶圓側端頂部和斜面部是被限制部按壓，藉此將半 導體晶圓固定住。限制部對半導體晶圓的按壓力，是強力 作用於從半導體晶圓的周邊往中心的方向，亦即與半導體 -8 - 200946418 晶圓的平面平行的方向’因此半導體晶圓不會破損’而且 能確實地進行半導體晶圓的固定。 層架是朝收納容器的中心伸出但在中心側未受到固 定，但在層架的內側（內部）具有1個或複數個孔（形成穿 孔狀態的環狀構造），且至少由兩側的臂部（桿件）來支 承，因此能減輕層架本身的重量，同時能抑制支承強度的 減少，而能儘量減少層架因本身重量所造成的撓曲。再 © 者，該層架，在將晶圓收納容器縱向置放（開口朝上）時， 具備將半導體晶圓筆直豎起之導件作用。 半導體晶圓是位於層架和層架之間，但僅半導體晶圓 的側端頂部、或是半導體晶圓的側端頂部和半導體晶圓的 背面側（特別是斜面下部）與限制部接觸，半導體晶圓表面 之晶圓半導體周緣部的內側則不會與限制部接觸，如此起 因於接觸而產生的粒子等就不會產生。結果，在半導體晶 圓表面的元件上（或是將來要形成的區域）不會發生缺陷。 ❹ 因此，在半導體晶圓的周緣部和斜面上部，由於難以防止 熱氧化、CVD(化學氣相沉積）法、PVD(物理氣相沉積）法 等所沉積之絕緣膜、導電體膜、半導體膜，以往必須附加 用來將附著於周緣部之該等膜除去的步驟，但在採用本發 明的晶圓收納容器的情況’則不一定要附加這種薄膜除去 步驟。再者，在將光阻塗布於半導體表面的情況也是，可 省略將半導體晶圓的表面側之晶圓周緣部的光阻除去的步 驟（邊緣清洗，edge rinse)。 再者，對應於使半導體晶圓儘量薄的要求，或是對於 -9- 200946418 厚度不厚但大口徑化的晶圓’在支承背面的層架不存在的 情況，在僅半導體晶圓的側端頂部、或是僅半導體晶圓的 側端頂部和半導體晶圓的背面側（特別是斜面下部）與限制 部接觸的狀態下，要固定半導體晶圓非常困難’但依本發 明的晶圓收納容器，由於半導體晶圓背面也被層架支承’ 故能將半導體晶圓固定住。 再者，可能會要求，連在半導體晶圓的背面周緣部也 不與晶圓收納容器的任何一部分接觸。其理由是爲了防 © 止：在半導體晶圓背面之半導體晶圓與晶圓收納容器（例 如支承部）的接觸部產生的粒子等，從背面繞行而附著於 半導體晶圓表面。以往的支承半導體晶圓背面的情況’由 於是支承半導體晶圓背面的周緣部，並無法克服上述問題 點。本發明的晶圓收納容器的層架，由於在層架內側具有 1個或複數個孔（或是形成穿孔狀態的環狀構造），可減輕 層架重量而朝晶圓收納容器的中心部側延伸。例如’由於 層架內側形成穿孔狀態，可分散施加於層架和支承板部的 © 根部的荷重而使其變小，因此能使層架的前端部延伸至遠 離根部的地方。結果，藉由將晶圓載置於離開晶圓周緣部 一定程度的載置突起上，能以不接觸晶圓周緣部的方式來 固定晶圓。 【實施方式】 本發明提供一種用來收納複數片的半導體晶圓之晶圓 收納容器，其完全不接觸形成有半導體元件之半導體晶圓 -10- 200946418 的表面側’而僅與半導體晶圓的側端頂部或是僅與半導體 晶圓的側端頂部及半導體晶圓的斜面部接觸，且連半導體 晶圓的背面周緣部也不接觸。 關於半導體晶圓的尺寸’現在已開始討論最大 450mm的晶圓規格，其口徑是越做越大。另外，半導體 元件的最小圖案也開始進入50nm以下。在如此般超微小 的圖案，連用來保持半導體晶圓的環境氣氛內的非常微小 © 的粒子和釋氣（outgas)也必須完全防止。特別是在始終保 管著半導體晶圓的晶圓收納容器內，必須儘量減少半導體 晶圓與晶圓收納容器的接觸，以防止因接觸而產生粒子。 第12圖是將半導體晶圓的端緣（端）周邊部放大的示 意圖。半導體晶圓101的表面105側，是由平坦區域X 及邊緣區域 Y所構成。在平坦區域X形成有半導體元 件。然而，一般而言，包含電晶體等的主動元件和電阻等 的被動元件之半導體元件，是形成在從X和Y的邊界起 © 算一定距離w的內側（元件形成區域107)。這是除了受到 薄膜形成、蝕刻製程、光微影等的製程條件的限制以外， 還考慮到爲了防止前述粒子等所造成的缺陷。通常W爲 3〜7mm ’隨著近年來製程技術的進步以及半導體裝置的高 性能化，W變得越來越小。邊緣區域Y，是由傾斜部！ 03 和晶圓邊緣最外部之晶圓側端頂部1 02所構成。由於傾斜 部被稱爲斜面（bevel)，在本說明書，將半導體表面側的傾 斜部1 0 3稱爲斜面上部，將半導體背面側的傾斜部丨〇 4稱 爲斜面下部。如上述般，在近年來的超微細製程，對晶圓 -11 - 200946418 收納容器是要求著，與半導體晶圓表面側，亦即X部或 斜面上部103完全不接觸。 爲了將半導體晶圓支承固定於收納容器，一定要在某 個部位讓半導體晶圓與晶圓收納容器接觸，因此不得不在 晶圓邊緣Y最外部之側端頂部102進行最低限度的接 觸。再者，在連接於側端頂部102之半導體背面側的斜面 下部104，也不得不進行一定程度的接觸（在無法與斜面 上部103接觸的情況，是與斜面下部104接觸）。若半導 體晶圓爲小口徑且厚度夠厚而具有充分的強度，僅藉由側 端頂部及斜面下部的接觸，就能將半導體晶圓從邊緣側用 力按壓，而支承固定於收納容器。然而，在半導體晶圓口 徑變大但半導體晶圓的厚度不厚之現在的狀況下（將來應 該也會維持這種傾向），以及將半導體晶圓硏磨變薄後使 半導體晶圓的強度變得更小的狀況下，僅藉由半導體晶圓 的側端頂部102及斜面下部104與晶圓收納容器的接觸， 對於收納容器內之半導體晶圓的支承固定並不充分，在將 晶圓從晶圓收納容器取出或放入時，在晶圓搬運中及收納 容器的移送中可能發生半導體晶圓的破損。於是，不得不 容許其接觸半導體晶圓的背面1 06側，但如前述般會發 生：在半導體晶圓的背面周緣部與晶圓收納容器的接觸部 產生的粒子等繞行到半導體晶圓表面側的現象。於是，變 成必須使半導體晶圓背面周緣部Z(例如，半導體晶圓的 側端頂部102及斜面下部104除外之距離晶圓側端頂部 2〜l〇mm處）完全不接觸晶圓收納容器的任何部分（在晶圓 200946418 厚0.8~1.0mm之450mm晶圓的情況，邊緣區域Y的尺寸 約 0·4〜1 ·0mm)。 本發明的晶圓收納容器，爲了確實地因應這種要求， 係具備：至少具有1個開口之收納容器本體、閉合前述開 口的蓋體、在將前述收納容器本體用前述蓋體閉合時使前 述收納容器本體的內部和外部環境氣密地隔離的密封構 件、形成於前述收納容器本體的內部且將晶圓以整齊排列 © 的狀態支承之晶圓保持具；其特徵在於：晶圓保持具係具 備：將複數個晶圓以隔既定間隔沿軸方向整齊排列的狀態 支承之複數個層架、用來支承前述層架的支承板部、用來 將前述支承板部安裝於前述收納容器本體的內部之支承板 安裝部、形成於前述支承板部而將前述複數個晶圓在徑方 向施以限制的限制部；又在層架內側穿設1個或複數個 孔。在本說明書記載的「在層架內側穿孔的構造」或「穿 孔狀態的環狀構造」，除了層架內側的孔完全被層架及支 〇 承板包圍的構造（例如，層架及支承板狀呈環狀或框狀而 周圍是完全連在一起的構造）以外，還包含層架內側的孔 不完全被層架及支承板包圍的構造（例如，環狀或框狀的 一部分缺口的構造，構成環狀或框狀的支承板狀的一部分 或全部不存在的構造）。前者的例子，可列舉後述的B字 形、D字形的層架、大致等邊三角形的層架。後者的例 子，可列舉後述第22圖所示之E字形、D字形或B字形 的無縱棒的形狀的層架。另外，層架具有：形成於層架上 面（載置晶圓時的上側，與晶圓背面接觸的側）且用來支承 -13- 200946418 載置上述晶圓背面之1個或複數個載置突起。 第1圖及第2圖係顯示本發明的晶圓收納容器的例 子。第2圖係將容器本體2用蓋體4閉合的狀態之晶圓收 納容器1的立體圖。第1圖，是爲了充分掌握本發明’而 將第2圖所示的晶圓收納容器1切成一半以觀察其內部的 立體圖。其具備：分別設置於用來收納複數片的半導體晶 圓S之容器本體2的對置側壁，將收納於內部的半導體晶 圓S僅從一側（半導體晶圓S的背面）支承之晶圓保持具 〇 3;用來閉合容器本體2的開口 2F之蓋體4»另外還具 備：供搬運裝置（未圖示）的臂部把持之頂突緣5、在作業 員用手搬運晶圓收納容器1時供其握持搬運用的把手6。 在第1圖及第2圖，容器本體2整體是形成大致立方 體形。該容器本體2，通常是以縱向置放狀態（底板部2E 朝下的狀態）來進行搬運，而在要將半導體晶圓S取出放 入的情況，則橫向置放成半導體晶圓的表面朝上。另外， 該容器本體2，是由周圍壁部之4片的側壁部2A、2B、 © 2C、2D和底板部2E所構成，在其上部設置開口 2F。在 各側壁部2A、2B、2C、2D設置補強用肋9等。該容器本 體2,在半導體晶圓S的生產線上等和晶圓搬運用機器人 (未圖示）呈對置時，是在載置台上進行正確的定位且形成 橫向置放狀態（第2圖的狀態）。在橫向置放狀態下，在構 成頂部的側壁部2B的外側，藉由拆裝機構12將頂突緣5 安裝於拆裝自如。在橫向置放狀態下，在構成橫壁部之側 壁部2C、2D的外側，藉由拆裝機構12將搬運用的把手6 -14- 200946418 安裝成拆裝自如。 在容器本體2的上端部，如第1圖所示，設置用來嵌 合蓋體4之蓋體收容段部47。該蓋體收容段部47，是將 容器本體2的上端部擴展成蓋體4的尺寸。藉此，蓋體4 可嵌合於蓋體收容段部47的垂直板部47A的內側並抵接 於水平板部47B，藉此安裝於蓋體收容段部47。再者，安 裝於蓋體4下面側的密封構件（未圖示）是抵接於水平板部 〇 47B，藉此將晶圓收納容器1的內部施以密封。在蓋體收 容段部47的垂直板部47A的內側設置嵌合孔48，以將在 半導體製造過程專用的蓋體（未圖示）固定於容器本體2 側。該嵌合孔48設置於蓋體收容段部47的四角部。另 外，嵌合孔48的位置及形狀，是對應於半導體製造過程 專用的蓋體來做適當的設定。 晶圓保持具3，如第1圖及第3圖所示，是分別設置 於容器本體2內之相對置的側壁部2C、2D，用來將收納 © 於內部的半導體晶圓S從兩側支承。晶圓保持具3是在容 器本體2內的內側安裝成拆裝自如，在晶圓收納容器內， 形成以二側基準面爲對稱面而呈相對置的一對鏡像體構造 (二側基準面，是SEMI規格所制定的，指通過晶圓中心 而將晶圓收納容器的開口分成左右兩個的基準面）。晶圓 保持具3主要具備：將多數個隔著一定間隔排列的各半導 體晶圓S逐一分開支承的層架50、將各層架50以隔著一 定間隔排列的狀態實施一體地支承之（晶圓保持具）支承板 部51。此外，支承板部51具有：將半導體晶圓S在晶圓 -15- 200946418 徑方向施以限制之限制部20 1 (第4圖至第9圖）。 如第3圖所不，層架50在內側具有1個大孔。亦即 是形成：內側爲穿孔狀態的環狀構造，在至少兩處（M及 N)被支承板部51支承之橋形。亦可將其稱爲D字形層 架。層架50是被支承板部51支承，是由從支承板部51 延伸出的2個臂部34以及連結兩臂部的帶狀部分33所構 成，由其等包圍的部分36成爲內側穿孔狀態。亦即，是 被支承板部51、2個臂部34以及帶狀部分33所包圍，而 _ 形成層架內側爲穿孔狀態的環狀構造（以下稱「環狀」或 「環狀構造」）。在第3圖雖顯示支承板部51爲一體物（1 片彎曲的板狀物），但如第13圖所示’將支承板分割成用 來支承層架50的支承板35、用來支承該支承板35的（縱 向）支承板37 (第13圖有2片）亦可。這種分割的支承板， 有減輕支承板重量的好處。另外’由於可調整2片支承板 37的寬度，可在2片支承板37之間形成充分的空間’而 能從外側（晶圓收納容器爲透明的情況’從晶圓收納容器 〇 的外側）觀察晶圓的配置狀況。第13圖雖顯示支承板37 在支承板35上進行支承，但也能挾持在支承板35彼此之 間，或是將其等成形爲一體物。 在層架50的既定位置設置用來支承載置半導體晶圓 背面之載置突起52。第4圖至第8圖係具有各種形狀之 本發明的層架50和支承板部51及半導體晶圓的狀態之說 明圖。是從晶圓保持具3的橫側觀察，在容器本體2內的 相對置的側壁部2C或2D配置晶圓保持具3的狀態。晶 -16- 200946418 圓保持具3 ’是在晶圓收納容器內，形成以二側基準面爲 對稱面而呈相對置的一對鏡像體構造，因此在第4圖至第 8圖僅顯示其單側（二側基準面，是與圖中的通過晶圓中 心的縱向中心線（一點鏈線）一致。第4圖用符號Η表 示）。第4圖係顯示半圓弧狀的環狀層架的例子（第4圖的 層架在內側有一個大孔，可視爲D字形層架的一種）。在 晶圓保持具3的支承板部51設置層架50，層架50是由 〇 支承板部51的兩處（圖中的Μ、Ν)來支承。層架50，是 從Μ及Ν延伸成圓弧狀的帶狀，層架50的內側（內部）成 爲環狀構造。由於層架50是成爲環狀構造，可減輕層架 50的重量，而能抑制層架50本身重量所造成之撓曲。 另外，由於層架50是在Μ及Ν兩處被支承板部51 支承，故能更強固地支承層架50。因此，層架50可朝半 導體晶圓的徑向伸出，而使其位置（支承半導體晶圓背面 的位置）的調整自由度變大。由於在層架50上載置半導體 © 晶圓，爲了維持層架50不變形的狀態，除了在Μ及Ν之 支承板部的支承強度加大、或將層架本身的強度加大以 外，減輕層架本身的重量也是有效的，因此除了形成環狀 構造以外，隨著離開支承部Μ、Ν而使層架50變薄變細 的構造也是有效的。另外，藉由形成環狀構造，能使層架 往晶圓中心延伸，而能支承更廣區域的晶圓背面，如此可 增大晶圓背面的支承位置（亦即載置突起52的位置）之自 由度。 在層架50的三處（圖中的P、Q、R)設置載置突起 -17- 200946418 52，其與半導體晶圓的背面的既定部分接觸以將半導體晶 圓從背面側支承。半導體晶圓，在晶圓保持具3的（¾¾ 板部51)的限制部201，使半導體晶圓的周緣部與晶圓保 持具3接觸而在徑方向施以限制。亦即，在將半導體晶Μ 從晶圓收納容器取出放入時，是以半導體晶圓的背面朝下 的方式來配置晶圓收納容器1(層架50的載置突起52朝 上）。打開蓋體4，將晶圓插入晶圓收納容器本體2(例如 將晶圓背面載置於叉構件），而載置在層架50的載置突起 〇 52上。由於層架50是在晶圓收納容器本體2內形成1對 (亦即兩處，載置突起52也是在層架50設置複數個）’因 此將半導體晶圓載置於載置突起52上之後，即使移去叉 構件，半導體晶圓也不會移動（當然必須使載置突起52的 高度一致以讓半導體晶圓形成水平）。在將期望片數的半 導體晶圓放入晶圓收納容器後，閉合蓋體4。在蓋體4安 裝有：與晶圓周緣部接觸，且具備用來將晶圓在徑方向施 以限制的限制部之晶圓按壓構件94(第1 0圖）。如此，半 ❹ 導體晶圓，是藉由從設置於晶圓收納容器本體的1對晶圓 保持具3的限制部201及安裝於蓋體4的晶圓按壓構件 94朝半導體晶圓徑方向的施力，而被按壓固定住。 在此，根據第9圖來說明本發明的晶圓保持具3的限 制部201。第9圖是將在晶圚保持具設置半導體晶圓的狀 態從晶圓厚度方向觀察的圖。S代表半導體晶圓，5 0代表 層架，52代表載置突起，201代表限制部。限制部201是 晶圓邊緣部與晶圓保持具3的支承板部51接觸的區域， -18- 200946418 用來將晶圓在徑方向施以限制。圖中，雖顯示限制部和層 架位在相同位置，但晶圓邊緣與限制部接觸的位置，有時 也會和層架的位置不同。又從第4圖至第7圖可看出，限 制部201不一定要和層架50形成連續的（也是有連續的情 況。亦即，可在L、Μ、N部設置限制部）。限制部201較 佳爲設置在可固定半導體晶圓之最佳位置。在期望儘量減 少與半導體晶圓接觸的部分的情況，只要儘量減少與晶圓 © 接觸的部分即可。然而，在因接觸所產生的粒子等非常少 的情況，或因接觸所產生的粒子等不致構成問題的情況， 若增大限制部20 1之與晶圓接觸的區域，則可更強固地固 定住晶圓。 第9(a)圖係顯示限制部201具有V形溝槽（或U形溝 槽）的情況。半導體晶圓S的邊緣被限制部的V形溝槽 202挾持，而且半導體晶圓S背面被層架50的載置突起 52支承固定著。在如此般使用V形溝槽或U形溝槽作爲 © 限制部201的情況，由於半導體晶圓邊緣部Υ的斜面上 部103也會接觸限制部201，故從接觸部產生的粒子等容 易附著於半導體晶圓表面的元件區域而發生問題。 第9(b)圖係顯示具有大致垂直壁狀的側壁之限制部 201的圖。僅半導體晶圓S的邊緣前端，亦即僅半導體晶 圓S的側端頂部102與限制部201的側壁203接觸，半導 體晶圓S的斜面上部1〇3和斜面下部1〇4都沒有接觸。半 導體晶圓S的背面被載置突起52支承。在此情況，由於 半導體晶圓邊緣部的斜面上部並未接觸限制部201，故不 200946418 會發生如第9(a)圖所示之從接觸部產生的粒子等容易附著 於半導體晶圓表面的元件區域的問題。 第9(c)圖係顯示限制部201的下部204(與半導體晶圓 S的背面側接觸的部分）呈傾斜的情況。半導體晶圓S的 邊緣當中的斜面下部104會與該傾斜面204接觸。藉由調 整載置突起52的高度，能使限制部201的傾斜面204接 觸半導體晶圓S的斜面下部1 04且使半導體晶圓s的側端 頂部102接觸限制部201的垂直側壁203。相較於第9(b) © 圖的情況，由於半導體晶圓S和限制部201的接觸面積增 大，晶圓收納容器內之半導體晶圓的穩定度變佳。在此情 況也是，由於半導體晶圓邊緣部的斜面上部103未接觸限 制部201，故不會發生如第9(a)圖所示之從接觸部產生的 粒子等容易附著於半導體晶圓表面的元件區域的問題。 載置突起（52(P)、52(Q)、52(R))，在本發明，是以晶 圓中心爲中心，從上述晶圓收納容器的面部（facial)基準 面朝前述開口側及底側（相對於開口側之裏側，以開口側 〇 朝上的方式置放收納容器時是收納容器的下側，或是與開 口側相對置的側）方向以〇度〜(5度配置（ά爲30〜70的數 値）。面部基準面是指，將收納於收納容器本體的晶圓二 等分，而與收納容器的前面（晶圓取出放入的地方，亦即 開口面）平行的垂直面。在第4圖，面部基準面，是包含 通過晶圓中心的中心線G且與紙面垂直的面。在第4 圖，載置突起52(Ρ)是以晶圓中心0爲中心而從面部基準 面G朝開口側（第4圖的上側）方向形成角度rl;載置突起 -20- 200946418 5 2(R)是以晶圓中心0爲中心而從面部基準面G朝底側（第 4圖的下側）方向形成角度及r2是在0度〜<5度（5 =30~70)的範圍，藉此能穩定地載置晶圓。再者，在ri和 r2大致相等的情況，晶圓的穩定性更佳。另外，在超出 上述範圍的情況，特別是rl超過70度的情況，層架和載 置突起會成爲阻礙，也可能會造成把持部（end effector)無 法進入。特別是，若所載置的晶圓間的間距小，其阻礙會 〇 變大。52(Q)是在52(P)和52(R)之間，其角度比Γ1和r2 更小。不管載置突起是1個的情況或載置突起是多數個的 情況，載置突起的位置都是以〇度度（(5爲30〜70的數 値）爲佳。 在第4圖雖是顯示，載置突起是以面部基準面爲邊界 而在其上下及基準面附近分別設置1個的情況，但只要考 慮附設在其他晶圓保持具的層架上的載置突起的關係而能 將晶圓穩定地載置於層架上，將載置突起偏置於其中任一 〇 方亦可。載置突起爲1個或2個的情況也是同樣的，能以 面部基準面爲邊界而偏置於其上下或基準面附近。又具有 4個以上的載置突起的情況也是，載置突起能以面部基準 面爲邊界而偏置於其上下或基準面附近，或是可分散配置 於該等區域。另外，如上述般載置突起雖以〇度〜<5度（5 爲3 0〜70的數値）的範圍爲佳，但在不致妨礙晶圓的出入 或不致影響晶圓穩定性的情況下，也能在偏離前述角度的 位置設置載置突起。特別是在底側，如後述第8圖所示一 方的晶圓保持具的層架和另一方的晶圓保持具的層架互相 -21 - 200946418 連結的情況，亦可在該連結部分等設置載置突起。 若考慮到與收納於收納容器的晶圓中心隔著大致一定 距離的晶圓背面可接觸的區域（亦即載置突起的位置）’而 針對晶圓從收納容器的出入容易性及晶圓的撓曲性等進行 探討，該距離爲晶圓直徑的0.3倍~〇.5倍。再者，在晶圓 收納容器1中，如上述般用來取出放入晶圓的叉構件和臂 構件等會進入，因此從晶圓收納容器1的中心部起算的某 個範圍內可能無法配置層架50。亦即’在設計層架50的 © 配置及大小時，必須避開晶圓的操作區域。又由於在層架 50內的載置突起52上載置半導體晶圓，爲了防止半導體 晶圓發生轉動或移動，必須計算整體的均衡而算出層架 50內的載置突起52的位置。例如，如第4圖所示，以rl 和r2大致相等且5 2 (Q)位於其中間（亦即面部面附近）的方 式在三處設置載置突起 52，藉此形成穩定的狀態。另 外，藉由採用微小形狀的載置突起52，可減少與半導體 晶圓背面的接觸面積，而能減少接觸部產生的影響，但若 © 過於微小，單位面積的荷重變大，因此也要考慮磨耗程度 來算出最佳的形狀。另外，載置突起52的數目並不限於 上述三處，也可以更多。或者，考慮到晶圓保持具有1對 且進一步安裝後述後層架的情況，只要晶圓穩定，載置突 起52爲1或2個亦可。因此，載置突起52能在上述角度 〇度~ (5度（5爲30~70的數値）內設置1處以上。 再者，層架50，爲了符合半導體工業的規格，在半 導體晶圓的背面位置，宜形成在以晶圓中心爲中心而具有 -22- 200946418 60~ 140度的視角r的位置（第7圖）。在此的視角，從第7 圖可看出，從晶圓中心觀察層架時，是相當於晶圓圓周方 向的層架所佔範圍的中心角。因此，例如佔全圓周的層架 的情況，視角爲360度；佔圓周一半的層架的情況，視角 爲180度。若考慮到與二側（bilateral)面隔著大致一定距 離的晶圓背面可接觸的區域，而針對晶圓從收納容器的出 入容易性及晶圓的撓曲性等進行探討，該距離爲晶圓直徑 Q 的0.3倍〜0.5倍，且可接觸區域的視角r最大爲約140 度。又爲了穩定地載置晶圓，視角r必須爲60度左右（晶 圓保持具的層架爲1個的情況）。 再者，在晶圓收納容器1中，如上述般用來取出放入 晶圓的叉構件和臂構件等會進入，因此從晶圓收納容器1 的中心部起算的某個範圍內可能無法配置層架50。亦 即，在設計層架50的配置及大小時，必須避開晶圓的操 作區域。又由於在層架50內的載置突起52上載置半導體 ❹ 晶圓，爲了防止半導體晶圓發生轉動或移動，必須計算整 體的均衡而算出層架50內的載置突起52的位置。例如， 若在形成上述視角r之層架50的帶狀部分33上’在將視 角大致二等分的位置共三處設置載置突起52，會成爲穩 定的狀態，再者，藉由採用微小形狀的載置突起52，可 減少與半導體晶圓背面的接觸面積，而能減少接觸部產生 的影響，但若過於微小，單位面積的荷重變大’因此也要 考慮磨耗程度來算出最佳的形狀。另外，載置突起52的 數目並不限於上述三處，也可以更多。或者’只要晶圓穩 -23- 200946418 定，載置突起52爲1或2個亦可。基於以上說明，載置 突起52，可在形成上述視角r之層架50的帶狀部分33 上，以將視角大致二等分的位置爲中心而設置1處以上。 在禁止半導體晶圓的背面周緣部與晶圓收納容器接觸 的情況，也能使用本發明的層架50。亦即，在層架50的 臂部34或帶狀部分33 (第4圖的層架呈圓弧狀，故臂部 和帶狀部一致）中，只要在相當於晶圓周緣部的部分（通常 爲臂部34的場所）不設置載置突起，即可輕易地實現。 © 第5圖係顯示其他的層架50的例子。在晶圓保持具 3的支承板部51附設層架50，層架50是被支承板部51 的兩處（圖中的Μ及N)所支承。層架50，是從Μ及N延 伸而在中途彎曲，沿半導體晶圓的圓周方向呈帶狀延伸而 連結在一起。層架50的內側當然是形成環狀構造。在第 5圖，載置突起52是在圓周方向的帶狀部分33設置於三 處（P、Q、R)。這個狀態，也是取半導體晶圓的力矩的平 衡（晶圓載置位置，相對於晶圓中心位於大致等距離的位 © 置），因此半導體晶圓的穩定性佳。又同時顯示限制部 201。另外，第5圖的層架也是，在層架內側的1個大孔 是被臂部及帶狀部分所包圍，因此也能視爲是D字形層 架。 第6圖係顯示其他的層架50的例子。在晶圓保持具 3的支承板部51附設層架50，層架50是被支承板部51 的兩處（圖中的Μ及Ν)所支承。層架5〇是形成內側爲環 狀構造之長方形帶狀。在第6圖’載置突起52是在長方 -24- 200946418 向的帶狀部分33設置於三處（P、Q、r)。載置突起52, 在僅在一處載置晶圓時不穩定的情況，是如此般設置二處 以上’亦即設置複數個（第5圖、第6圖的情況是同樣 的）。另外’在第6圖的層架也是屬於d字形的1種。 第7圖係層架5〇在支承板部51的三處（圖中的L、 Μ、N)被支承的情況，是形狀和第4圖相同的內側爲環狀 構造之圓弧狀層架50。也受到支承板部51的正中央的支 〇 承以補強帶狀部分33。在第7圖，載置突起52是在圓周 方向的帶狀部分33設置三處（P、Q、R)。第5圖及第6圖 的形狀的層架50也是同樣的，可在正中央附近受支承板 部51的支承以補強帶狀部分33。第7圖所示的層架在內 側具有2個孔，可稱爲Β字形層架。 本發明的層架，也能具有比第7圖所示的Β字形層架 (內側具有2個孔的層架）更多的孔。例如，以臂部或帶狀 部作爲框架來形成網狀。在該網狀框架部分的1或複數部 〇 位設置載置突起，而在其上方載置晶圓。依據這種構造， 可將載置突起上所載置的晶圓重量分散於多數個框架。如 以上所說明，本發明的層架，藉由在內側具有1個或複數 個孔，可減輕層架重量，可減少施加於層架和支承板部的 根部的力量，即使在層架的載置突起上載置晶圓，層架也 不會發生過度撓曲。 第8圖係顯示，在容器本體2內的相對置的側壁部 2C及2D設有1對層架50之2個晶圓保持具3的層架相 連結的狀態。第8圖所示的晶圓保持具3的形狀’是和第 -25- 200946418 5圖所示的類似，層架50的帶狀部分33沿圓周方向（下 方）延伸，和另一方的晶圓保持具3的層架50的帶狀部分 連結。本發明也能使用這種連續的晶圓保持具3° 如前述說明般，層架50的作用’是將複數個晶圓以 隔既定的間隔沿（半導體晶圓的）軸方向整齊排列的狀態予 以支承。半導體晶圓的厚度，雖依晶圓尺寸而定，但在進 行背面磨削前爲約 〇.4|11111~約 1.2mm(直徑 100mm~600mm 的晶圓）。另外，層架厚度爲約〇.2mm〜約2.0mm。若考慮 © 到載置突起的高度、層架和晶圓的間隙，收納容器之層架 間的間距爲約5mm〜25mm。 如第3圖所示，在晶圓保持具3的上部設置2個把手 54。該把手54,是抬起晶圓保持具3時供握持的部分。 可用手指或機械握持2個把手54而往上抬起。上述支承 板部51，是將各層架及限制部以一體的方式支承著。晶 圓保持具3，係藉由上部嵌合部55、下部嵌合部56而以 可拆裝的方式固定於容器本體2之相對置的各側壁部 〇 2C、2D。該上部嵌合部55及下部嵌合部56是構成晶圓 保持具3的安裝部。 第1圖係顯示晶圓保持具3安裝於晶圓收納容器本體 的側壁部2D的狀態。關於將晶圓保持具3固定在晶圓收 納容器的方法，例如是詳細記載於日本特開2004-2 14269 號。在將蓋體4(用來閉合收納容器本體4的開口 2F)蓋合 於收納容器本體4時，藉由設置於收納容器本體側及/或 蓋體側的密封構件，使收納容器本體2的內部和外部環境 -26- 200946418 氣密地隔離。 第ίο圖係顯示配合蓋體而按壓晶圓之晶圓按壓構件 的立體圖，第1 1圖係其俯視圖。晶圓按壓構件94如第 10圖及第11圖所示，是形成大致長方形。該晶圓按壓構 件94的長邊方向兩端部和中央部是固定在蓋體4的背 面，在其間構成按壓部95。按壓部95，是將半導體晶圓 S從其上部施以彈性按壓以進行支承的構件，是由多數個 〇 並排的按壓帶96所構成。按壓帶96是有彈性的構件，是 形成向下彎曲。再者，按壓帶96的平面形狀（第1〇圖的 狀態的形狀），是沿著半導體晶圓S的周緣彎曲成波形， 而使半導體晶圓S不致進入按壓帶96的間隙。 按壓帶96的側面形狀，是形成朝下側的山形。在該 山形部分的2個頂點位置設置：將半導體晶圓S逐一嵌合 而隔著一定間隔予以支承之嵌合溝槽97。嵌合溝槽97是 形成銳角以挾持半導體晶圓S的周緣。 Ο 晶圓按壓構件94，可在收納容器本體裝設晶圓後， 放入收納容器本體，然後再將蓋體4對準收納容器本體2 而蓋合。或是，將晶圓按壓構件94預先安裝於蓋體4’ 在將蓋體4蓋合於收納容器本體2時，使其對準裝設在收 納容器本體2內的晶圓。後者的情況適用於自動化。嵌合 於晶圓按壓構件94的嵌合溝槽97之半導體晶圓S，是被 形成銳角的嵌合溝槽97所挾持而受支承。在此嵌合溝槽 97雖是形成銳角，但一般而言，是將嵌合溝槽97的角度 最佳化以適當地進行晶圓的取出和保持。換言之’嵌合溝 -27- 200946418 槽97不一定要是銳角，也可以是鈍角或以大致垂直面來 支承之u字形。藉此，即使是對晶圓支承容器1施加強 力衝擊的情況，嵌合溝槽97仍能挾持半導體晶圓s的周 緣而抑制旋轉及移動，以進行確實的支承。另外’由於按 壓帶96沿著半導體晶圓S的周緣而形成波形，即使半導 體晶圓S脫離嵌合溝槽97仍不會進入各按壓帶96之間。 嵌合溝槽97，可如第9(a)圖所示般形成V形溝槽（或 U形溝槽）。這時，可獲得和嵌合溝槽97形成銳角的情況 © 相同的效果。或是如第9(b)圖或第9(c)圖所示般形成：僅 半導體晶圓的側端頂部、或是僅半導體晶圓的側端頂部和 晶圓的斜面下部與晶圓接觸的構造。這時，雖沒有挾持晶 圓的效果，但利用從半導體晶圓的側端頂部朝半導體晶圓 徑方向的按壓力，可藉由晶圓保持具3的限制部（1對）和 晶圓按壓構件94來固定半導體晶圓。 晶圓按壓構件94，可具有和第9圖所示相同的層架 及載置突起，以支承半導體晶圓的背面。如此般藉由具備 〇 層架等，可更穩定地固定半導體晶圓。 若晶圓大口徑化成300mm以上，若維持晶圓厚度不 變其撓曲量會變大，爲了抑制撓曲量則必須增大其厚度， 隨著晶圓的體積變大，晶圓重量也會變大。因此在本發明 的層架呈水平的情況，若晶圓變得大口徑化，在載置晶圓 時，依層架的強度可能造成層架向下撓曲。若該撓曲量變 大，在用載置突起來支承晶圓背面的情況，晶圓周緣部會 和層架接觸’起因於該接觸會產生粒子。爲防止此現象， -28- 200946418 在本發明的層架，是從（晶圓保持具）支承板部的根部朝層 架的前端，亦即朝所載置的晶圓徑方向的晶圓中心而形成 往晶圓中心軸側上方傾斜，也就是從所載置的晶圓的背面 側朝表面側方向傾斜。而且，層架的最上部，就是形成於 該層架的載置突起的最上部。 第14圖係前述呈傾斜的層架之示意圖，是將晶圓收 納容器的蓋體卸下，從載置晶圓的方向、亦即晶圓徑方向 〇 觀察的圖（第1圖的側壁部2A朝下的狀態）。圖中之下方 爲晶圓背面側，圖中之上方爲晶圓表面側。在收納容器本 體311的兩側壁部（左右的側壁部，第1圖及第2圖的 2C、2D)安裝（晶圓保持具）支承板部312。如第14圖所 示’（晶圓保持具）支承板部312，是在三處的安裝部（上部 315、中央316、下部317)大致垂直地安裝於收納容器本 體311的側壁部（2C、2D)。另外，（晶圓保持具）支承板部 312是大致對稱地安裝於收納容器本體311的側壁部 © (2C、2D)。層架313是以朝上方傾斜的方式安裝於（晶圓 保持具）支承板部3 1 2。沿晶圓軸方向配置的層架3 1 3數 目’是和收納於晶圓收納容器的晶圓數目相同，傾斜角爲 一定（0)且層架313的間距也是一定的。傾斜角，可以是 呈傾斜的層架的中心軸和晶圓背面的夾角，也可以是呈傾 斜的層架所支承的晶圓背面和該層架之與該晶圓背面相對 置的側面的的夾角。在層架313的前端部附設載置突起 319’該載置突起319的最上部是在層架313當中最高的 部分。如第14圖所示，晶圓S背面被載置在該層架上， -29- 200946418 並收納於晶圓收納容器。如前述般，晶圓S周緣部是與用 來將晶圓S在徑方向施以限制的限制部3 1 4接觸’其接觸 狀態是和第9圖的說明相同。 晶圓S背面是與層架313當中最高的部分，亦即載置 突起319接觸。若晶圓S僅在周緣部受支承而在晶圓S的 背面呈自由狀態（未受支承），其重量會造成晶圓S撓曲’ 且如前述般隨著晶圓S的大口徑化，其撓曲量變大。只要 在本發明的層架上載置晶圓S，由於晶圓S是連背面也受 ® 到支承，故能抑制晶圓撓曲。然而，在水平層架的情況’ 晶圓S的重量可能造成層架往下沉。特別是在厚度薄的層 架或由低強度的材料構成的層架的情況，由於往下方的變 形量變大，可能會導致晶圓S彼此接觸或層架與晶圓表面 接觸。又爲了防止該等的接觸，必須將層架間距加大而使 收納容器變大。再者，若層架往下方變形’晶圓背面可能 會接觸層架的根部附近。 於是，藉由採用第14圖所示之往上傾斜的層架 〇 3 1 9，可抑制往下方的傾斜，可縮小層架的間距而使晶圓 收納容器小型化，或能在晶圓收納容器內收納更多數的晶 圓。此外，由於晶圓S的背面不會與載置突起319以外的 層架313部分接觸，從晶圓表面繞到晶圓背面周緣部的薄 膜不會剝離而產生粒子，因此不致污染晶圓’如此可將晶 圓收納容器內保持在極清淨的狀態。再者，也能使層架變 薄或寬度變窄，而能謀求層架的輕量化。 在第14圖雖僅顯示1個載置突起319，但只要載置 -30- 200946418 突起319的高度一致，也能設置複數個載置突起319。在 具有複數個載置突起3 1 9的情況，由於層架呈傾斜，必須 使該等載置突起319的最上部的高度一致而和晶圓背面同 時接觸。晶圓背面是載置於該等的載置突起319上，若載 置突起319最上部的高度不一致，晶圓會發生傾斜，或存 在著無法與晶圓背面接觸的載置突起319，並不理想。在 層架313之高度相等的複數場所設置載置突起319的情 ❹ 況’可設置相同大小（單體的載置突起的高度相同）之載置 突起319。但在層架313的高度不同的複數場所設置載置 突起319的情況，必須調整載置突起319的大小（單體的 載置突起的高度），以使完成時（或安裝於晶圓收納容器時） 的層架最上部的高度相同。 在讓層架傾斜的情況也是，從晶圓的中心軸上方（亦 即晶圓面的上方）觀察的圖，是例如和第4圖至第8圖相 同。層架的形狀爲第4圖所示的圓弧形的情況，圓弧狀的 〇 層架的中央附近在層架中最高。若僅在該部分設置1個載 置突起（第4圖的52(Q))時，只要考慮該載置突起的高度 即可’若在其他部分也要設置載置突起（第4圖的52 (P)、 52(R))時，則必須加高52(P)、52(R)(單體）載置突起的高 度而使其和52(Q)的高度相等。 第5圖的形狀的情況會變得稍微複雜。層架的臂部 34當然是往上傾斜，層架的帶狀部分33可爲整體的高度 相同’該帶狀部分33亦可進一步往上方或下方傾斜。在 帶狀部分33高度相同的情況，可設置高度相同的載置突 200946418 起52(P)、52(Q)、52(R)。在呈傾斜的情況，必須調整單 體的載置突起52(P)、52(Q)、52(R)的高度，而使其全部 成爲相同尚度。 第6圖的形狀的情況也是變得稍微複雜。層架的臂部 34當然是往上傾斜，層架的帶狀部分33可爲整體的高度 相同’該帶狀部分33亦可進一步往上方或下方傾斜。在 帶狀部分33高度相同的情況，可設置高度相同的載置突 起52(P)、52(Q)、5 2(R)。在呈傾斜的情況，必須調整單 _ 體的載置突起52(P)、52(Q)、52(R)的高度，而使其全部 成爲相同高度。 在第7圖的形狀的情況，是和第4圖所示的情況類 似。圓弧狀部分34、33往上傾斜，補強部分也往上傾 斜。圓弧狀的層架的中央附近是在層架當中最高。若僅在 該部分設置1個載置突起（第7圖的52(Q))時，只要考慮 該載置突起的高度即可，若在其他部分也設置載置突起 (第7圖的52(P)、52(R))時，則必須將52(P)、52(R)(單體） 〇 載置突起的高度增高成和52(Q)的高度相等。 第8圖的形狀的情況也是變得稍微複雜。層架的臂部 34當然是往上傾斜，層架的帶狀部分33可爲整體的高度 相同，該帶狀部分33亦可進一步往上方或下方傾斜。在 帶狀部分33高度相同的情況，可設置高度相同的載置突 起52(P)、52(Q)、52(R)。在呈傾斜的情況，必須調整單 體的載置突起52(P)、52(Q)、52(R)的高度，而使其全部 成爲相同高度。再者，在與另一側的層架相連結的部分， -32- 200946418 可爲高度相同，亦可爲進一步往上或往下傾斜。在該連結 部分設置載置突起的情況，其高度必須和其他的載置突起 (52(P)、52(Q)、52(R))相同。 第15圖係顯示形狀和第4圖〜第8圖不同的層架的例 子，晶圓收納容器本體331是處於通常設置的狀態，亦 即，晶圓收納容器本體33 1的底部（第1圖的2E)朝下，晶 圓出入側（開口側）（第1圖的2F)朝上，是在正面看得到晶 〇 圓面的方向的截面圖（未顯示晶圓面）。第15圖所示的晶 圓保持具，是和第4圖〜第8圖同樣的，呈對稱地分別安 裝於容器本體331內的相對置的側壁部2C及2D。形成於 晶圓保持具的層架仍是呈環狀構造，複數個層架是鄰接於 —側的（晶圓保持具）支承板部332或333，藉此可謀求層 架的輕量化和強度提昇。 第1 5圖所示的層架，是呈底邊位於收納容器本體側 (側壁部2C側或2D側）之大致等邊三角形（底邊部沿晶圓 〇 外周呈大致圓弧狀，二個子層架（爲了和到此爲止所敘述 的配置在收納於收納容器的晶圓的軸方向之層架區別而稱 爲「子層架」）爲等邊且在前端部交會的形狀）的環狀構 造，是將同大小且同形狀的二個大致等邊三角形的子層架 334(第1子層架3 34- 1、第2子層架334-2)形成於一方的 晶圓保持具。另外，在安裝於相對置的側壁部之晶圓保持 具也是，以大致對稱的方式形成二個同樣的子層架 335 (3 35-1、335-2)。1組子層架之2個等邊子層架交會的 前端部（也稱爲頂點（部））是大致朝向晶圓中心。在這種懸 -33- 200946418 臂式的子層架的情況，在以相同材料和相同重量來做比較 時’等邊三角形的形狀是強度最強的形狀之一，因此是最 適用於本發明的晶圓保持具的形狀。而且由於具備複數個 同樣的等邊三角形形狀，即使支承大口徑晶圓，也能使撓 曲和扭曲成爲最小。在第15圖由於晶圓保持具有2個， 晶圓是由4個等邊三角形的子層架來支承。一般而言，子 層架的個數的最大數目是取決於：1個大致等邊三角形的 前端部之交角（頂角）、等邊長度以及（晶圓保持具）支承板 ❹ 部的尺寸。 第 15圖所示的載置突起 336(336-1、336-2)及 337(337-1、337-2)，是形成於等邊三角形的子層架的和底 邊相對置的頂點附近。亦即，在第1子層架3 34- 1的頂點 附近設置第1載置突起336-1，在第2子層架334-2的頂 點附近設置第2載置突起33 6-2。另外，在對稱位置之子 層架335-1的頂點附近設置第1載置突起337-1，在子層 架335-2的頂點附近設置第2載置突起337-2。第15圖所 ❹ 示的4個等邊三角形由於具有同程度的大小，形成於各頂 點之載置突起的位置，是將載置於其上方的晶圓之與周緣 部隔著大致等距離的位置的背面予以支承。因此，晶圓重 量是同程度地分配於載置突起，晶圓本身重量所造成的撓 曲變得更均一。層架（子層架也是同樣的）呈水平的情況， 如前述般，依層架強度及層架重量可能發生層架往下變 形，但圖示之等邊三角形的形狀是變形量最少的形狀之 一。爲了進一步減少變形量，如第14圖所示，相對於晶 -34- 200946418 圓面，使層架形成往上傾斜的構造。亦即，層架是形成： 從層架和（晶圓保持具）支承板部的根部朝層架前端部往晶 圓中心（軸）側上方傾斜。如此般將層架設計成複數個大致 等邊三角形且讓層架傾斜，可在確實地抑制層架變形的狀 態下僅藉由載置突起來支承晶圓。結果，晶圓本身的揍曲 也會變得非常少。 層架及載置突起，由於通常是使用樹脂來成形，可製 Ο 作出對應於其等的形狀之模具，將樹脂注入模具（例如射 出成形）而製作成層架及載置突起。 第19圖係將第14圖所示的晶圓保持具（支承板部及 層架）放大的示意圖。層架513，相對於（晶圓保持具）支承 板部5 1 1是以前述角度0傾斜。如前述般（晶圓保持具）支 承板部511在安裝於收納容器的狀態下，在載置晶圓時， 相對於水平面（晶圓面）呈垂直狀態，因此這時角度0是相 對於水平面爲鉛垂方向的角度。在層架513的前端部附設 〇 載置突起514，在其上方以接觸晶圓S背面的方式載置晶 圓S。角度0，是層架513所支承的晶圓背面和層架513 的與晶圓背面相對置的側面的夾角。若層架513與水平的 夾角爲α，則α=90 - 0。另外，如前述般，晶圓S的邊 緣部與（晶圓保持具）支承板部5 1 1的限制部5 1 2接觸。角 度α只要爲0.1度以上即可，但在載置晶圓S時，受到晶 圓重量使層架513往下變形而使層架變得比水平位置更低 的情況，是比0.1度更大。若加大該角度α ，當然層架 513的間隔（間距）會變大。另外，依層架513長度的不 -35- 200946418 同，其間隔也會改變。在晶圓收納容器雖希望能收納多數 的晶圓，但由於受到晶圓收納容器大小的限制，角度α宜 爲0.1〜3.5度。另外，由於（晶圓保持具）支承板部也可能 發生彎曲的情況，角度0有時宜視爲：在層架載置晶圓 時，相對於晶圓面（水平面）的鉛垂方向和層架的夾角。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer container for transporting or storing a semiconductor wafer. [Prior Art] With regard to the size of semiconductor wafers, wafer specifications up to 450 mm have been discussed. The diameter of the wafer is larger and larger, but the thickness of the semiconductor wafer is not thick. Therefore, in the fabrication process of the semiconductor wafer. The handling of semiconductor wafers in China must be handled with caution, especially in wafer storage containers used to store semiconductor wafers. In addition, the minimum pattern of the semiconductor element also begins to enter below 50 nm. With such progress in miniaturization, the presence of particles generated in the process of semiconductor wafers loaded with components of design rules of less than 100 nm causes fatal defects on the pattern on the wafer. Therefore, even in the ambient atmosphere for holding the semiconductor wafer, even very small and minute particles must be completely prevented. In particular, in a wafer storage container, contact between the semiconductor wafer and the wafer container must be avoided as much as possible. To prevent particles from being generated by contact. In the wafer storage container proposed or used in the past, the peripheral portion of the semiconductor wafer is supported by a V-shaped groove or a meandering groove (Patent Document 1), or the edge side portion of the semiconductor wafer and the semiconductor are used. The peripheral edge portion of the back surface of the wafer is supported (Patent Document 2). Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-353301 Patent Document 2: Japanese Patent Application No. 3020287 200946418 [Invention] The wafer support portion of the wafer storage container of Patent Document 1 is a V-shaped groove, and is formed in a V shape. The trench supports the periphery of the wafer, and the wafer support is in contact with the peripheral portion of the wafer of the surface of the semiconductor wafer on which the component is to be formed. As a result, a thin film (an oxide film, a nitride film, or a metal film) formed on the semiconductor wafer at the peripheral portion of the wafer is slightly peeled off and flies, and adheres to the inner side of the peripheral portion of the wafer in the form of a granular stomach. Formed on the surface of the component (or the component to be formed). Or, the micro-peeling of the wafer © the support portion (material is a polymer material) in contact with the peripheral portion of the wafer may cause the above problems. Further, it is a matter of course that the wafer surface side is supported only at the peripheral edge portion of the wafer, and the wafer back surface is supported only at the peripheral edge portion of the wafer. Therefore, in particular, when the wafer is enlarged in diameter, The weight of the wafer itself causes the wafer to flex, which deteriorates the stability of the wafer. In particular, when the wafer is taken out or placed in the container, the wafer may be tilted and the wafer may be damaged. In addition, the wafer stored in the storage container is oscillated by the repetitive wafer, and the wafer may be damaged. Furthermore, the wafers may be in contact with each other in the wafer storage container to cause damage to the components or to generate particles or the like due to contact. The method of supporting the semiconductor wafer shown in Patent Document 2 is because the peripheral edge portion of the back surface of the semiconductor body is in contact with the container, and particles or the like generated by the contact are wound around the semiconductor surface to adhere to the surface of the semiconductor. Or 'will adhere to the surface of other semiconductor wafers placed below. As a result, pattern defects are generated to deteriorate the yield and characteristics of the semiconductor wafer. An object of the present invention is to provide a wafer storage container that can be damaged by a semiconductor wafer in addition to the impact of the collision, and can be used to remove the semiconductor wafer without damage. The state is safe and easy to remove. Further, in order to provide a wafer storage container capable of minimizing particles and the like generated in the wafer storage container. In order to achieve the above object, a wafer storage container according to the present invention includes: a container body having at least one opening; and a lid body that closes the opening; and when the container body is closed by the lid body, the receiving container is provided a sealing member that is hermetically sealed inside and outside the container body, a wafer holder that is formed inside the container body and supports the wafer in a neatly arranged state; and the wafer holder has: a plurality of shelves supported by the plurality of wafers in a state of being aligned in the axial direction at predetermined intervals, a support plate portion for supporting the shelf, and a support plate portion for attaching the support plate portion to the inside of the storage container body The support plate mounting portion is formed in the support plate portion to restrict the plurality of wafers in the radial direction, and one or a plurality of holes are bored in the inner side of the shelf. Further, the shelf has one or a plurality of mounting projections formed on the upper surface of the shelf (on the upper side when the wafer is placed and on the side in contact with the wafer back surface) for supporting and placing the wafer back surface. Further, the restricting portion is in contact with the semiconductor wafer only at the top of the side end of the semiconductor wafer or only at the top of the side end of the semiconductor wafer and the inclined surface of the semiconductor wafer. Further, the boundary between the restricting portion and the shelf is formed to be inclined (the portion which is in contact with the lower portion of the slope of the back surface of the semiconductor wafer is inclined). The wafer holder has a pair of mirror image structures that face each other in a wafer storage container with a symmetrical plane on both side reference surfaces. -7- 200946418 By using the wafer holder of the present invention, the wafer can be supported on a smaller inner side than the peripheral portion of the wafer on the back surface of the wafer so as not to contact the peripheral portion of the wafer on the back surface of the wafer. Therefore, particles or the like which are wound from the back side of the semiconductor wafer to the surface side of the semiconductor wafer are extremely small. Further, the back surface of the wafer is supported by the mounting protrusions on the inner side of the peripheral portion thereof, so that the amount of deflection of the wafer can be minimized. In particular, in the case of a large-diameter wafer, since the amount of deflection of the wafer is large, the effect of the wafer holder of the present invention is remarkable. Further, since the amount of deflection is small, the pitch of the crystals of the wafer storage container can be reduced, and as a result, the number of wafers that can be stored in the wafer storage container can be increased. Further, when the semiconductor wafer is taken out, the semiconductor wafer is placed on a plurality of mounting projections, so that the semiconductor wafer can be stably set horizontally. As a result, the semiconductor wafer will not be damaged. Furthermore, the structure of the limiting portion is such that only the top side of the wafer side or the top of the wafer side end and the bevel portion of the wafer are in contact with the wafer, so that the surface of the semiconductor wafer on which the semiconductor element is formed includes the semiconductor wafer. The peripheral portion is completely out of contact, and the semiconductor wafer can be stored and stored in the semi-conductor wafer storage container in this state. The back surface of the semiconductor wafer is a wafer holder that is formed inside the container body and is used to support the wafers in a neatly arranged state, and is placed on a plurality of shelves (connected to the mounting portion for use) a plurality of mounting protrusions on a plurality of wafers supported in a state in which the plurality of wafers are aligned in the axial direction at regular intervals, and the wafer side end top or the wafer side end top and the slope portion of the semiconductor wafer are restricted portions Pressing to hold the semiconductor wafer. The pressing force of the limiting portion on the semiconductor wafer is strongly applied to the direction from the periphery of the semiconductor wafer to the center, that is, the direction parallel to the plane of the semiconductor -8 - 200946418 wafer, so the semiconductor wafer is not damaged. The semiconductor wafer can be reliably fixed. The shelf protrudes toward the center of the storage container but is not fixed on the center side, but has one or a plurality of holes (annular structure forming a perforated state) on the inner side (inside) of the shelf, and at least The arm (rod) is supported, so that the weight of the shelf itself can be reduced, and the reduction of the support strength can be suppressed, and the deflection of the shelf due to its own weight can be minimized. Further, the shelf has a guide for vertically erecting the semiconductor wafer when the wafer storage container is placed longitudinally (opening upward). The semiconductor wafer is located between the shelf and the shelf, but only the top end of the semiconductor wafer, or the side end of the semiconductor wafer and the back side of the semiconductor wafer (especially the lower portion of the slope) are in contact with the limiting portion, The inside of the peripheral portion of the wafer semiconductor on the surface of the semiconductor wafer does not come into contact with the regulating portion, and thus particles or the like which are caused by the contact do not occur. As a result, defects do not occur on the elements on the surface of the semiconductor wafer (or areas to be formed in the future). Therefore, it is difficult to prevent the insulating film, the conductor film, and the semiconductor film deposited by thermal oxidation, CVD (Chemical Vapor Deposition) method, PVD (Physical Vapor Deposition) method, etc. at the peripheral portion and the inclined surface portion of the semiconductor wafer. In the past, it was necessary to add a step for removing the films attached to the peripheral portion. However, in the case of using the wafer storage container of the present invention, it is not necessary to add such a film removing step. Further, in the case where the photoresist is applied to the surface of the semiconductor, the step of removing the photoresist of the peripheral portion of the wafer on the surface side of the semiconductor wafer (edge rinse) can be omitted. Furthermore, it corresponds to the requirement to make the semiconductor wafer as thin as possible, or the case where the thickness of the wafer which is not thick but large in diameter is not present in the back-supported wafer shelf on the side of the semiconductor wafer. In the state in which the top of the terminal, or only the side end of the semiconductor wafer and the back side of the semiconductor wafer (especially the lower portion of the bevel) are in contact with the restriction portion, it is very difficult to fix the semiconductor wafer. However, the wafer storage according to the present invention is difficult. The container, because the back side of the semiconductor wafer is also supported by the shelf, can hold the semiconductor wafer. Furthermore, it may be required that the peripheral portion of the back surface of the semiconductor wafer is not in contact with any portion of the wafer container. The reason for this is that the particles generated in the contact portion between the semiconductor wafer on the back surface of the semiconductor wafer and the wafer storage container (for example, the support portion) are wound from the back surface and adhered to the surface of the semiconductor wafer. In the conventional case of supporting the back surface of a semiconductor wafer, the peripheral portion of the back surface of the semiconductor wafer is supported, and the above problem cannot be overcome. In the shelf of the wafer container of the present invention, since one or a plurality of holes (or an annular structure in a perforated state) are provided inside the shelf, the weight of the shelf can be reduced and the center side of the wafer storage container can be reduced. extend. For example, since the inner side of the shelf is formed in a perforated state, the load applied to the root portion of the shelf and the support plate portion can be dispersed to be small, so that the front end portion of the shelf can be extended to a position far away from the root portion. As a result, by placing the wafer on the mounting projections which are spaced apart from the peripheral edge portion of the wafer, the wafer can be fixed without contacting the peripheral edge portion of the wafer. [Embodiment] The present invention provides a wafer storage container for accommodating a plurality of semiconductor wafers that does not contact the surface side of the semiconductor wafer -10-200946418 on which the semiconductor element is formed, and only with the semiconductor wafer. The top end of the side end is only in contact with the side end top of the semiconductor wafer and the sloped surface of the semiconductor wafer, and the peripheral edge portion of the back surface of the semiconductor wafer is not in contact. Regarding the size of semiconductor wafers, it has now begun to discuss wafer specifications up to 450 mm, and the caliber is getting bigger and bigger. In addition, the minimum pattern of the semiconductor element also begins to enter below 50 nm. In such an ultra-small pattern, even the very small particles and outgas in the ambient atmosphere used to keep the semiconductor wafer must be completely prevented. In particular, in a wafer storage container in which a semiconductor wafer is always protected, it is necessary to minimize contact between the semiconductor wafer and the wafer storage container to prevent particles from being generated by contact. Fig. 12 is a view showing an enlarged view of a peripheral portion (end) of a semiconductor wafer. The surface 105 side of the semiconductor wafer 101 is composed of a flat region X and an edge region Y. A semiconductor element is formed in the flat region X. However, in general, a semiconductor element including an active element such as a transistor or a passive element such as a resistor is formed on the inner side (the element forming region 107) which is a predetermined distance w from the boundary between X and Y. This is in addition to the process conditions such as film formation, etching process, and photolithography, and is also considered to prevent defects caused by the particles or the like. Usually W is 3 to 7 mm. With the advancement of process technology in recent years and the high performance of semiconductor devices, W has become smaller and smaller. The edge area Y is made up of the slope! 03 and the outermost wafer side end top 102 of the wafer edge. Since the inclined portion is referred to as a bevel, in the present specification, the inclined portion 1 0 3 on the semiconductor surface side is referred to as a sloped portion, and the inclined portion 丨〇 4 on the semiconductor back side is referred to as a lower portion of the slope. As described above, in the ultrafine process in recent years, it is required for the wafer -11 - 200946418 storage container to be completely out of contact with the surface side of the semiconductor wafer, that is, the X portion or the inclined portion 103. In order to support and fix the semiconductor wafer to the container, the semiconductor wafer must be brought into contact with the wafer container at a certain location. Therefore, it is necessary to make the minimum contact at the side 102 of the outermost side of the wafer edge Y. Further, the lower portion 104 of the slope connected to the back side of the semiconductor of the side end portion 102 also has to be contacted to some extent (in the case where it is not in contact with the upper portion 103 of the slope, it is in contact with the lower portion 104 of the slope). If the semiconductor wafer is small in diameter and thick enough to have sufficient strength, the semiconductor wafer can be pressed from the edge side only by the contact between the top end portion and the lower portion of the slope, and the semiconductor wafer can be supported and fixed to the storage container. However, in the current situation where the diameter of the semiconductor wafer becomes large but the thickness of the semiconductor wafer is not thick (this tendency should be maintained in the future), and the semiconductor wafer is thinned and thinned, the intensity of the semiconductor wafer is changed. In a smaller case, only by the contact between the side end top 102 of the semiconductor wafer and the lower portion 104 of the semiconductor wafer and the wafer storage container, the support for fixing the semiconductor wafer in the container is not sufficient, and the wafer is removed from the wafer. When the wafer storage container is taken out or placed, breakage of the semiconductor wafer may occur during wafer transfer and transfer of the storage container. Therefore, it is necessary to allow it to contact the back surface 106 side of the semiconductor wafer, but as described above, particles or the like generated at the contact portion of the back surface of the semiconductor wafer and the wafer storage container are bypassed to the surface of the semiconductor wafer. Side phenomenon. Therefore, it becomes necessary to make the semiconductor wafer back surface peripheral portion Z (for example, the side end top portion 102 and the slope lower portion 104 of the semiconductor wafer are separated from the top side of the wafer side end 2 to 10 mm) completely without contacting the wafer storage container. Any part (in the case of a wafer of 200946418 with a thickness of 0.8 to 1.0 mm of 450 mm wafer, the size of the edge region Y is about 0·4 to 1 · 0 mm). In order to reliably meet such a request, the wafer storage container of the present invention includes a container body having at least one opening, a lid body that closes the opening, and the above-described container body when the lid body is closed by the lid body a sealing member that is hermetically insulated from the inside and the outside of the container body, and a wafer holder that is formed inside the container body and that supports the wafer in a neatly arranged state. The wafer holder is characterized by a wafer holder system. a plurality of shelves supported by a plurality of wafers in a state of being aligned in an axial direction at predetermined intervals, a support plate portion for supporting the shelf, and a support plate portion for attaching the support plate portion to the storage container body The inner support plate mounting portion is formed in the support plate portion to restrict the plurality of wafers in the radial direction, and one or a plurality of holes are bored inside the shelf. In the "structure that is perforated inside the shelf" or "annular structure in the perforated state" described in this specification, the structure in which the hole inside the shelf is completely surrounded by the shelf and the support plate (for example, the shelf and the support plate) In addition to the structure in which the ring shape or the frame shape is completely connected, the hole inside the shelf is not completely surrounded by the shelf and the support plate (for example, a ring-shaped or frame-shaped partial notch structure) A structure in which part or all of the annular or frame-shaped support plate shape does not exist. Examples of the former include a B-shaped shape, a D-shaped shelf, and a substantially equilateral triangle. Examples of the latter include a shelf having no shape of a vertical bar of an E-shape, a D-shape or a B-shape as shown in Fig. 22 which will be described later. In addition, the shelf has: formed on the upper surface of the shelf (on the upper side when the wafer is placed, the side in contact with the back surface of the wafer), and is used to support one or a plurality of mountings on the back surface of the wafer. Protrusion. Fig. 1 and Fig. 2 show an example of the wafer container of the present invention. Fig. 2 is a perspective view of the wafer receiving container 1 in a state in which the container body 2 is closed by the lid 4. In the first embodiment, in order to fully grasp the present invention, the wafer storage container 1 shown in Fig. 2 is cut in half to observe the inside thereof. It is provided with wafers respectively provided on the opposite side walls of the container body 2 for accommodating the plurality of semiconductor wafers S, and the semiconductor wafer S accommodated therein is supported from only one side (the back surface of the semiconductor wafer S) The holding cover 3; the lid body 4» for closing the opening 2F of the container body 2 is further provided with a top flange 5 for gripping the arm portion of the conveying device (not shown), and the worker carries the wafer storage by hand. The container 1 is provided with a handle 6 for carrying it. In Figs. 1 and 2, the entire container body 2 is formed in a substantially cubic shape. The container body 2 is usually conveyed in a longitudinally placed state (a state in which the bottom plate portion 2E faces downward), and when the semiconductor wafer S is to be taken out, the surface of the semiconductor wafer is laterally placed toward on. Further, the container body 2 is composed of four side wall portions 2A, 2B, © 2C, 2D and a bottom plate portion 2E of the surrounding wall portion, and an opening 2F is provided in the upper portion thereof. Reinforcing ribs 9 and the like are provided in the side wall portions 2A, 2B, 2C, and 2D. When the container body 2 and the wafer transfer robot (not shown) face each other on the production line of the semiconductor wafer S, the container body 2 is accurately positioned on the mounting table and is placed in a laterally placed state (Fig. 2). status). In the laterally placed state, the top flange 5 is detachably attached to the outside of the side wall portion 2B constituting the top portion by the detaching mechanism 12. In the laterally placed state, the handling handles 6-14-200946418 are detachably attached to the outside of the side wall portions 2C and 2D constituting the lateral wall portion by the detaching mechanism 12. At the upper end portion of the container body 2, as shown in Fig. 1, a lid receiving section portion 47 for fitting the lid body 4 is provided. The lid housing section 47 is a size that expands the upper end portion of the container body 2 into the lid body 4. Thereby, the lid body 4 can be fitted to the inside of the vertical plate portion 47A of the lid body storage section portion 47 and abuts against the horizontal plate portion 47B, thereby being attached to the lid body receiving section portion 47. Further, a sealing member (not shown) mounted on the lower surface side of the lid body 4 abuts against the horizontal plate portion B 47B, thereby sealing the inside of the wafer storage container 1. A fitting hole 48 is provided inside the vertical plate portion 47A of the lid receiving section 47 to fix a lid (not shown) dedicated to the semiconductor manufacturing process to the container body 2 side. The fitting holes 48 are provided at the four corners of the lid housing section 47. Further, the position and shape of the fitting hole 48 are appropriately set corresponding to the cover body dedicated to the semiconductor manufacturing process. The wafer holder 3, as shown in Figs. 1 and 3, is an opposite side wall portion 2C, 2D provided in the container body 2, for accommodating the semiconductor wafer S inside from both sides. Support. The wafer holder 3 is attached to the inside of the container body 2 so as to be detachable. In the wafer storage container, a pair of mirror images are formed so as to face each other with the two reference planes being symmetrical. It is defined by the SEMI standard, which means that the opening of the wafer storage container is divided into two reference surfaces by the center of the wafer. The wafer holder 3 mainly includes a shelf 50 in which a plurality of semiconductor wafers S arranged at a predetermined interval are supported one by one, and the shelf 50 is integrally supported in a state of being arranged at regular intervals (wafer) The holder has a support plate portion 51. Further, the support plate portion 51 has a regulating portion 20 1 (Figs. 4 to 9) for restricting the semiconductor wafer S in the radial direction of the wafer -15 - 200946418. As shown in Fig. 3, the shelf 50 has one large hole on the inner side. That is, an annular structure in which the inner side is in a perforated state is formed, and at least two places (M and N) are supported by the support plate portion 51 in a bridge shape. It can also be called a D-shaped shelf. The shelf 50 is supported by the support plate portion 51, and is composed of two arm portions 34 extending from the support plate portion 51 and a band portion 33 that connects the two arm portions, and the portion 36 surrounded by the same is in the inner perforated state. . In other words, the support plate portion 51, the two arm portions 34, and the band portion 33 are surrounded by each other, and the inner side of the shelf is formed into a perforated state (hereinafter referred to as "annular" or "annular structure"). . In Fig. 3, the support plate portion 51 is shown as a single body (a plate-shaped curved plate), but as shown in Fig. 13, the support plate is divided into support plates 35 for supporting the shelf 50 for supporting The (longitudinal) support plate 37 of the support plate 35 (two in the FIG. 13) may also be used. This split support plate has the benefit of reducing the weight of the support plate. In addition, since the width of the two support plates 37 can be adjusted, a sufficient space can be formed between the two support plates 37, and the outer side can be opened from the outside (the wafer storage container is transparent) from the outside of the wafer storage container ) Observe the configuration of the wafer. Fig. 13 shows that the support plate 37 is supported on the support plate 35, but it can also be held between the support plates 35 or formed into a single body. A mounting protrusion 52 for supporting the back surface on which the semiconductor wafer is placed is provided at a predetermined position of the shelf 50. Fig. 4 to Fig. 8 are views showing the state of the shelf 50, the support plate portion 51, and the semiconductor wafer of the present invention having various shapes. The wafer holder 3 is placed in the opposite side wall portion 2C or 2D of the container body 2 as viewed from the lateral side of the wafer holder 3. Crystal-16-200946418 The round holder 3' is a pair of mirror image structures that are opposed to each other in the wafer storage container with the two side reference surfaces as the plane of symmetry. Therefore, only the figures are shown in Figs. 4 to 8 One side (two side reference planes, which is consistent with the longitudinal centerline (a little chain line) passing through the center of the wafer in the figure. Figure 4 is indicated by the symbol Η). Fig. 4 shows an example of a semi-arc-shaped annular shelf (the shelf of Fig. 4 has a large hole on the inner side, which can be regarded as one of the D-shaped shelves). A shelf 50 is provided on the support plate portion 51 of the wafer holder 3, and the shelf 50 is supported by two places (Μ, Ν in the figure) of the 支承 support plate portion 51. The shelf 50 is formed in a strip shape extending from the cymbal and the cymbal, and the inner side (inside) of the shelf 50 has an annular structure. Since the shelf 50 has an annular structure, the weight of the shelf 50 can be reduced, and the deflection caused by the weight of the shelf 50 itself can be suppressed. Further, since the shelf 50 is supported by the support plate portion 51 at both the cymbal and the cymbal, the shelf 50 can be supported more strongly. Therefore, the shelf 50 can protrude in the radial direction of the semiconductor wafer, and the degree of freedom in adjusting the position (the position at which the back surface of the semiconductor wafer is supported) becomes large. Since the semiconductor © wafer is placed on the shelf 50, in order to maintain the state in which the shelf 50 is not deformed, the support layer is increased in strength in addition to the support plate portion of the crucible and the crucible, or the strength of the shelf itself is increased. The weight of the rack itself is also effective, and therefore, in addition to the formation of the annular structure, it is effective to make the shelf 50 thin and thin as it leaves the support portion. In addition, by forming the annular structure, the shelf can be extended toward the center of the wafer, and the back surface of the wafer can be supported in a wider area, so that the support position of the back surface of the wafer (that is, the position at which the protrusion 52 is placed) can be increased. The degree of freedom. Mounting projections -17-200946418 52 are provided at three places (P, Q, R in the drawing) of the shelf 50, which are in contact with a predetermined portion of the back surface of the semiconductor wafer to support the semiconductor wafer from the back side. The semiconductor wafer is placed in the regulating portion 201 of the wafer holder 3 (3⁄4⁄4 plate portion 51) so that the peripheral portion of the semiconductor wafer is in contact with the wafer holder 3 and is restricted in the radial direction. In other words, when the semiconductor wafer is taken out from the wafer container, the wafer container 1 is placed such that the back surface of the semiconductor wafer faces downward (the mounting protrusion 52 of the shelf 50 faces upward). The lid body 4 is opened, and the wafer is inserted into the wafer container body 2 (for example, the wafer back surface is placed on the fork member), and placed on the mounting projections 52 of the shelf 50. Since the shelf 50 is formed in the wafer housing body 2 in a pair (that is, two places, the placement protrusions 52 are also provided in the plurality of shelves 50)", after the semiconductor wafer is placed on the mounting protrusions 52, Even if the fork member is removed, the semiconductor wafer does not move (of course, the height of the mounting protrusions 52 must be made uniform to make the semiconductor wafer horizontal). After the desired number of semiconductor wafers are placed in the wafer container, the lid 4 is closed. The lid body 4 is provided with a wafer pressing member 94 (Fig. 10) that is in contact with the peripheral edge portion of the wafer and has a regulating portion for restricting the wafer in the radial direction. As described above, the semiconductor wafer of the semiconductor wafer is formed by the regulating portion 201 of the pair of wafer holders 3 provided in the wafer housing body and the wafer pressing member 94 attached to the lid 4 in the radial direction of the semiconductor wafer. Apply force and be pressed and fixed. Here, the restriction portion 201 of the wafer holder 3 of the present invention will be described based on Fig. 9. Fig. 9 is a view in which the state in which the semiconductor wafer is placed in the wafer holder is viewed from the wafer thickness direction. S represents a semiconductor wafer, 50 represents a shelf, 52 represents a placement protrusion, and 201 represents a restriction. The restricting portion 201 is a region where the wafer edge portion is in contact with the support plate portion 51 of the wafer holder 3, and -18-200946418 is used to limit the wafer in the radial direction. In the figure, although the restriction portion and the shelf position are at the same position, the position at which the edge of the wafer contacts the restriction portion may be different from the position of the shelf. Further, as can be seen from Fig. 4 to Fig. 7, the restriction portion 201 does not have to be continuous with the shelf 50 (it is also continuous). That is, the restriction portion can be provided in the L, Μ, and N portions. The limiting portion 201 is preferably disposed at an optimum position at which the semiconductor wafer can be fixed. In the case where it is desired to minimize the portion in contact with the semiconductor wafer, it is only necessary to minimize the portion in contact with the wafer ©. However, when the particles or the like generated by the contact are extremely small, or the particles generated by the contact do not constitute a problem, if the region of the restricting portion 20 1 in contact with the wafer is increased, the reinforcing portion 20 1 can be more firmly fixed. Live the wafer. Fig. 9(a) shows a case where the restricting portion 201 has a V-shaped groove (or a U-shaped groove). The edge of the semiconductor wafer S is held by the V-shaped groove 202 of the regulating portion, and the back surface of the semiconductor wafer S is supported and fixed by the mounting protrusion 52 of the shelf 50. When the V-shaped groove or the U-shaped groove is used as the © restricting portion 201 as described above, since the inclined surface portion 103 of the edge portion of the semiconductor wafer is also in contact with the regulating portion 201, particles or the like generated from the contact portion are likely to adhere to There is a problem with the component area of the surface of the semiconductor wafer. Fig. 9(b) is a view showing a restricting portion 201 having a substantially vertical wall-shaped side wall. Only the edge front end of the semiconductor wafer S, that is, only the side end top 102 of the semiconductor wafer S is in contact with the side wall 203 of the restriction portion 201, and the inclined surface portion 1〇3 and the lower slope portion 1〇4 of the semiconductor wafer S are not in contact. The back surface of the semiconductor wafer S is supported by the mounting protrusions 52. In this case, since the inclined portion of the edge portion of the semiconductor wafer does not contact the regulating portion 201, particles such as those generated from the contact portion as shown in Fig. 9(a) are likely to adhere to the surface of the semiconductor wafer. The problem with the component area. The figure 9(c) shows a case where the lower portion 204 (the portion in contact with the back side of the semiconductor wafer S) of the regulating portion 201 is inclined. The lower portion 104 of the slope among the edges of the semiconductor wafer S is in contact with the inclined surface 204. By adjusting the height of the placement protrusions 52, the inclined surface 204 of the restriction portion 201 can contact the lower surface portion 104 of the semiconductor wafer S and the side end top portion 102 of the semiconductor wafer s can contact the vertical side wall 203 of the restriction portion 201. As compared with the case of the ninth (b) © figure, since the contact area of the semiconductor wafer S and the regulating portion 201 is increased, the stability of the semiconductor wafer in the wafer housing container is improved. In this case as well, since the inclined surface portion 103 of the edge portion of the semiconductor wafer does not contact the regulating portion 201, particles or the like generated from the contact portion as shown in Fig. 9(a) do not easily adhere to the surface of the semiconductor wafer. The problem with the component area. Mounting protrusions (52 (P), 52 (Q), 52 (R)), in the present invention, centering on the wafer center, from the face reference surface of the wafer storage container toward the opening side and The bottom side (with respect to the inner side of the opening side, when the storage container is placed such that the opening side is facing upward is the lower side of the storage container or the side facing the opening side) is oriented at a degree of 5 degrees (5 degrees ( ά is a number of 30 to 70.) The face reference surface means that the wafer stored in the main body of the storage container is equally divided into two parts, and is parallel to the front surface of the storage container (where the wafer is taken out, that is, the opening surface) In Fig. 4, the face reference surface is a plane including the center line G passing through the center of the wafer and perpendicular to the plane of the paper. In Fig. 4, the placement protrusion 52 (Ρ) is centered on the center 0 of the wafer. On the other hand, the angle rl is formed from the face reference surface G toward the opening side (upper side in FIG. 4); the mounting protrusion -20-200946418 5 2(R) is from the face reference surface G toward the bottom side centering on the wafer center 0 (lower side of Fig. 4) direction forming angle and r2 is at 0 degrees ~ <5 degrees (5 = 30 to 70), whereby the wafer can be stably placed. Furthermore, in the case where ri and r2 are substantially equal, the stability of the wafer is better. Further, in the case where the above range is exceeded, particularly in the case where rl exceeds 70 degrees, the shelf and the mounting projection may become an obstacle, and the end effector may not be allowed to enter. In particular, if the pitch between the wafers placed is small, the barrier will become large. 52(Q) is between 52(P) and 52(R), and its angle is smaller than Γ1 and r2. Regardless of the case where one of the placement projections is one or the case where the placement projections are plural, the positions at which the projections are placed are preferably 〇 degrees ((5 is a number of 30 to 70 値). In the display, the mounting protrusions are provided on the upper side of the face reference surface and the vicinity of the reference surface, but the relationship between the mounting protrusions attached to the shelves of the other wafer holders can be considered. The wafer is stably placed on the shelf, and the mounting protrusions are biased to either one of them. The same applies to the case where the mounting protrusions are one or two, and the surface reference plane can be used as a boundary. In the case of having four or more placement protrusions, the placement protrusions may be offset from the upper and lower sides or the reference plane by the surface reference surface, or may be dispersedly disposed. In addition, as in the above, the projections are placed with a twist~ <5 degrees (5 is a number of 30 to 70) is preferable, but it can be placed at a position deviating from the aforementioned angle without hindering the entry or exit of the wafer or affecting the stability of the wafer. Protrusion. In particular, on the bottom side, if the shelf of one wafer holder and the shelf of the other wafer holder are connected to each other as shown in FIG. 8 to be described later, the connection may be set in the connection portion or the like. Place the protrusions. Considering the area (ie, the position at which the protrusion is placed) that is accessible to the back surface of the wafer at a substantially constant distance from the center of the wafer stored in the container, the ease of entry and exit of the wafer from the container and the wafer are considered. The flexibility is discussed, and the distance is 0.3 times to 5. 5 times the diameter of the wafer. In the wafer storage container 1, as described above, the fork member and the arm member for taking out the wafer are taken in. Therefore, the wafer storage container 1 may not be disposed within a certain range from the center of the wafer storage container 1. Shelf 50. That is, when designing the layout and size of the shelf 50, it is necessary to avoid the operating area of the wafer. Further, since the semiconductor wafer is placed on the mounting protrusion 52 in the shelf 50, in order to prevent the semiconductor wafer from rotating or moving, it is necessary to calculate the overall balance and calculate the position of the mounting projection 52 in the shelf 50. For example, as shown in Fig. 4, the placement protrusions 52 are provided at three places in such a manner that rl and r2 are substantially equal and 5 2 (Q) is located in the middle (i.e., in the vicinity of the face), thereby forming a stable state. Further, by using the projections 52 having a small shape, the contact area with the back surface of the semiconductor wafer can be reduced, and the influence of the contact portion can be reduced. However, if the thickness is too small, the load per unit area becomes large, so it is also considered. The degree of wear is used to calculate the best shape. Further, the number of the placement protrusions 52 is not limited to the above three places, and may be more. Alternatively, in consideration of the fact that the wafer holding has one pair and the rear shelf described later is further mounted, the number of the mounting protrusions 52 may be one or two as long as the wafer is stable. Therefore, the mounting protrusions 52 can be provided in one or more places at the above-described angle ~ degrees (5 degrees (5 is 30 to 70 値). Further, the shelf 50 is in accordance with semiconductor industry specifications in the semiconductor wafer. The position of the back side should be at a position of the viewing angle r centered on the center of the wafer and having a viewing angle r of -22-200946418 60 to 140 degrees (Fig. 7). From this point of view, it can be seen from Fig. 7 that the wafer is from the wafer. When the center observes the shelf, it is the central angle corresponding to the range occupied by the shelf in the circumferential direction of the wafer. Therefore, for example, in the case of a shelf of the full circumference, the viewing angle is 360 degrees; in the case of a shelf occupying half of the circumference, the viewing angle It is 180 degrees. Considering the area accessible from the back side of the wafer at a certain distance from the bilateral side, the ease of access of the wafer from the container and the flexibility of the wafer are discussed. The distance is 0.3 to 0.5 times the wafer diameter Q, and the viewing angle r of the contactable region is at most about 140. In order to stably mount the wafer, the viewing angle r must be about 60 degrees (the layer of the wafer holder) In the case of one rack, in the wafer storage container 1, Since the fork member, the arm member, and the like for taking out the wafer are taken in as described above, the shelf 50 may not be disposed in a certain range from the center portion of the wafer storage container 1. That is, the shelf 50 is designed. In the arrangement and size, it is necessary to avoid the operating area of the wafer. Since the semiconductor wafer is placed on the mounting protrusions 52 in the shelf 50, in order to prevent the semiconductor wafer from rotating or moving, it is necessary to calculate the overall balance. The position of the placement protrusion 52 in the shelf 50 is calculated. For example, if the placement protrusion 52 is provided in three places at a position where the viewing angle is substantially halved, on the belt-shaped portion 33 of the shelf 50 forming the viewing angle r, Further, by using the fine-shaped mounting protrusions 52, the contact area with the back surface of the semiconductor wafer can be reduced, and the influence of the contact portion can be reduced. However, if the contact area is too small, the load per unit area becomes small. Therefore, the degree of wear is also taken into account to calculate the optimum shape. In addition, the number of placement protrusions 52 is not limited to the above three, and may be more. Or 'as long as the wafer is stable -23- 200946418 The placement protrusions 52 may be one or two. Based on the above description, the placement protrusions 52 may be centered on the strip-shaped portion 33 of the shelf 50 on which the viewing angle r is formed, with the viewing angle being substantially equally divided. One or more places are provided. When the peripheral edge portion of the back surface of the semiconductor wafer is prohibited from coming into contact with the wafer storage container, the shelf 50 of the present invention can be used. That is, the arm portion 34 or the strip portion 33 of the shelf 50 ( In the case where the shelf of the fourth figure has an arc shape, the arm portion and the band portion are identical, it is easy to provide a projection on the portion corresponding to the peripheral edge portion of the wafer (usually the position of the arm portion 34). Fig. 5 shows an example of another shelf 50. A shelf 50 is attached to the support plate portion 51 of the wafer holder 3, and the shelf 50 is two places of the supported plate portion 51 (( in the figure) And N) supported. The shelf 50 is extended from Μ and N and bent in the middle, and is stretched in a strip shape along the circumferential direction of the semiconductor wafer. The inside of the shelf 50 is of course formed in an annular configuration. In Fig. 5, the placement projections 52 are provided at three places (P, Q, R) in the circumferential direction of the strip portion 33. This state is also a balance of the torque of the semiconductor wafer (the wafer placement position is substantially equidistant from the center of the wafer), so the stability of the semiconductor wafer is good. The restriction unit 201 is also displayed at the same time. Further, in the shelf of Fig. 5, since one large hole inside the shelf is surrounded by the arm portion and the band portion, it can also be regarded as a D-shaped shelf. Fig. 6 shows an example of another shelf 50. A shelf 50 is attached to the support plate portion 51 of the wafer holder 3, and the shelf 50 is supported by two places (Μ and 图 in the figure) of the support plate portion 51. The shelf 5 is formed into a rectangular strip shape having a ring-shaped inner structure. In the sixth drawing, the mounting projections 52 are provided at three places (P, Q, r) in the strip-shaped portion 33 in the direction of the rectangular -24-200946418. When the mounting protrusions 52 are unstable when the wafer is placed at one place, two or more places are provided in the same manner, that is, a plurality of them are provided (the same applies to the case of the fifth and sixth figures). In addition, the shelf in Fig. 6 also has one type of d-shape. Fig. 7 is a case where the frame 5 is supported at three places (L, Μ, N in the figure) of the support plate portion 51, and is an arc-shaped shelf having the same shape as that of the fourth figure. 50. The reinforcing strip portion 33 is also received by the support of the center of the support plate portion 51. In Fig. 7, the placement projection 52 is provided in three places (P, Q, R) in the strip portion 33 in the circumferential direction. The stack 50 of the shape of Figs. 5 and 6 is also the same, and can be supported by the support plate portion 51 in the vicinity of the center to reinforce the strip portion 33. The shelf shown in Fig. 7 has two holes on the inner side and can be called a U-shaped shelf. The shelf of the present invention can also have more holes than the U-shaped shelf (the shelf having two holes on the inside) as shown in Fig. 7. For example, a mesh shape is formed by using an arm or a belt as a frame. A mounting protrusion is provided in one or a plurality of portions of the mesh frame portion, and a wafer is placed thereon. According to this configuration, the weight of the wafer placed on the mounting protrusion can be dispersed in a plurality of frames. As explained above, the shelf of the present invention can reduce the weight of the shelf by having one or a plurality of holes on the inner side, and can reduce the force applied to the roots of the shelf and the support plate portion even when the shelf is loaded. The protrusions are placed on the wafer, and the shelves are not excessively deflected. Fig. 8 is a view showing a state in which the shelves of the two wafer holders 3 of the pair of shelves 50 are connected to each other in the opposing side wall portions 2C and 2D in the container body 2. The shape of the wafer holder 3 shown in Fig. 8 is similar to that shown in Fig. 25-200946418 5, the strip portion 33 of the shelf 50 extends in the circumferential direction (downward), and the other wafer The strip portions of the shelf 50 of the holder 3 are joined. The present invention can also use such a continuous wafer holder 3°. As described above, the function of the shelf 50 is to arrange a plurality of wafers in a line along the axial direction (semiconductor wafer) at regular intervals. Supported. The thickness of the semiconductor wafer depends on the wafer size, but it is about 4.4|11111~about 1.2mm (wafer with a diameter of 100mm~600mm) before back grinding. In addition, the shelf thickness is about 〇2. 2 mm to about 2.0 mm. Considering the height of the mounting protrusion, the gap between the shelf and the wafer, the pitch between the shelves of the storage container is about 5 mm to 25 mm. As shown in Fig. 3, two handles 54 are provided on the upper portion of the wafer holder 3. The handle 54 is a portion for holding the wafer holder 3 when it is lifted. Hold the two handles 54 with your fingers or mechanically and lift them up. The support plate portion 51 is integrally supported by the respective shelf and the regulating portion. The wafer holder 3 is detachably fixed to the opposing side wall portions 〇 2C and 2D of the container body 2 by the upper fitting portion 55 and the lower fitting portion 56. The upper fitting portion 55 and the lower fitting portion 56 are mounting portions constituting the wafer holder 3. Fig. 1 shows a state in which the wafer holder 3 is attached to the side wall portion 2D of the wafer container body. A method of fixing the wafer holder 3 to the wafer receiving container is described in detail in Japanese Patent Laid-Open No. 2004-2 14269. When the lid body 4 (opening 2F for closing the container body 4) is placed on the container body 4, the container body 2 is housed by a sealing member provided on the container body side and/or the lid body side. Internal and external environment -26- 200946418 is airtightly isolated. Fig. 1 is a perspective view showing a wafer pressing member for pressing a wafer in cooperation with a lid, and Fig. 1 is a plan view thereof. The wafer pressing member 94 is formed in a substantially rectangular shape as shown in Figs. 10 and 11. Both end portions and a central portion of the wafer pressing member 94 in the longitudinal direction are fixed to the back surface of the lid body 4, and a pressing portion 95 is formed therebetween. The pressing portion 95 is a member that elastically presses and holds the semiconductor wafer S from the upper portion thereof, and is composed of a plurality of pressing belts 96 that are arranged side by side. The pressing belt 96 is a resilient member that is formed to bend downward. Further, the planar shape of the pressing belt 96 (the shape of the state of the first drawing) is curved along the periphery of the semiconductor wafer S so that the semiconductor wafer S does not enter the gap of the pressing belt 96. The side shape of the pressing belt 96 is formed in a mountain shape toward the lower side. At the two vertex positions of the chevron portion, fitting grooves 97 for supporting the semiconductor wafers S one by one and supporting them at regular intervals are provided. The fitting groove 97 is formed at an acute angle to hold the periphery of the semiconductor wafer S.晶圆 The wafer pressing member 94 can be placed in the container body after the wafer is mounted on the container body, and then the lid body 4 can be aligned with the container body 2 to be covered. Alternatively, the wafer pressing member 94 is attached to the lid body 4' in advance. When the lid body 4 is placed on the container body 2, the wafer is placed in the container body 2 in the receiving container body 2. The latter case applies to automation. The semiconductor wafer S fitted to the fitting groove 97 of the wafer pressing member 94 is held by the fitting groove 97 formed at an acute angle and supported. Although the fitting groove 97 forms an acute angle, in general, the angle of the fitting groove 97 is optimized to appropriately take out and hold the wafer. In other words, the 'fitting groove -27-200946418 groove 97 does not have to be an acute angle, and may be an obtuse angle or a u-shape supported by a substantially vertical surface. Thereby, even when a strong impact is applied to the wafer supporting container 1, the fitting groove 97 can hold the periphery of the semiconductor wafer s and suppress rotation and movement for reliable support. Further, since the pressing belt 96 is formed along the circumference of the semiconductor wafer S, even if the semiconductor wafer S is separated from the fitting groove 97, it does not enter between the pressing belts 96. The fitting groove 97 can be formed into a V-shaped groove (or a U-shaped groove) as shown in Fig. 9(a). At this time, the same effect as the case where the fitting groove 97 forms an acute angle can be obtained. Or as shown in Figure 9(b) or Figure 9(c): only the side of the side of the semiconductor wafer, or only the top of the side of the semiconductor wafer and the lower part of the wafer are in contact with the wafer. Construction. At this time, although the effect of holding the wafer is not maintained, the pressing portion from the top end of the semiconductor wafer toward the radial direction of the semiconductor wafer can be used by the regulating portion (1 pair) of the wafer holder 3 and the wafer pressing member. 94 to fix the semiconductor wafer. The wafer pressing member 94 may have the same shelf and mounting projection as shown in Fig. 9 to support the back surface of the semiconductor wafer. As a result, the semiconductor wafer can be more stably fixed by having a ruthenium shelf or the like. If the wafer has a large diameter of 300 mm or more, the amount of deflection will increase as the thickness of the wafer is maintained. In order to suppress the amount of deflection, the thickness must be increased. As the volume of the wafer becomes larger, the wafer weight will increase. Become bigger. Therefore, in the case where the shelf of the present invention is horizontal, if the wafer becomes large in diameter, the shelf may be deflected downward depending on the strength of the shelf when the wafer is placed. When the amount of deflection is increased, when the back surface of the wafer is supported by the mounting protrusion, the peripheral edge portion of the wafer comes into contact with the shelf, and particles are generated due to the contact. In order to prevent this, -28-200946418 is a shelf of the present invention, from the root of the (wafer holder) support plate portion toward the front end of the shelf, that is, toward the wafer center in the direction of the wafer being placed. The formation is inclined upward toward the center axis side of the wafer, that is, from the back side of the wafer to be placed toward the surface side. Further, the uppermost portion of the shelf is formed at the uppermost portion of the mounting projection of the shelf. Fig. 14 is a schematic view showing the above-described inclined shelf, which is a view in which the lid of the wafer storage container is removed and viewed from the direction in which the wafer is placed, that is, in the direction of the wafer diameter (the side wall portion of Fig. 1) 2A down state). Below the figure is the back side of the wafer, and the top of the figure is the wafer surface side. The (wafer holder) support plate portion 312 is attached to both side wall portions (left and right side wall portions, 2C and 2D of Fig. 1 and Fig. 2) of the storage container body 311. As shown in Fig. 14, the (wafer holder) support plate portion 312 is attached to the side wall portion (2C, which is substantially perpendicularly attached to the mounting portion (the upper portion 315, the center portion 316, and the lower portion 317) at three places. 2D). Further, the (wafer holder) support plate portion 312 is attached to the side wall portion © (2C, 2D) of the container body 311 substantially symmetrically. The shelf 313 is attached to the (wafer holder) support plate portion 31 1 so as to be inclined upward. The number of shelves 3 1 3 disposed along the wafer axis direction is the same as the number of wafers accommodated in the wafer storage container, the inclination angle is constant (0), and the pitch of the shelf 313 is also constant. The tilt angle may be an angle between a central axis of the inclined shelf and the back surface of the wafer, or may be a back surface of the wafer supported by the inclined shelf and a side of the shelf opposite to the back surface of the wafer. Angle. A mounting protrusion 319' is attached to the front end portion of the shelf 313. The uppermost portion of the mounting protrusion 319 is the highest portion among the shelves 313. As shown in Fig. 14, the back surface of the wafer S is placed on the shelf, -29-200946418 and stored in the wafer storage container. As described above, the peripheral portion of the wafer S is in contact with the regulating portion 3 1 4 for restricting the radial direction of the wafer S. The contact state is the same as that described in Fig. 9. The back side of the wafer S is in contact with the highest portion of the shelf 313, that is, the mounting protrusion 319. If the wafer S is supported only at the peripheral portion and is free (unsupported) on the back surface of the wafer S, the weight thereof causes the wafer S to flex, and as the wafer S is larger in diameter as described above, The amount of deflection becomes large. As long as the wafer S is placed on the shelf of the present invention, the wafer S is supported by the back surface of the wafer S, so that the wafer deflection can be suppressed. However, in the case of a horizontal shelf, the weight of the wafer S may cause the shelf to sink. Particularly in the case of a thin-layered shelf or a shelf composed of a low-strength material, since the amount of deformation to the lower side becomes large, the wafers S may be brought into contact with each other or the shelves may be in contact with the wafer surface. Further, in order to prevent such contact, it is necessary to increase the pitch of the shelves to increase the size of the storage container. Furthermore, if the shelf is deformed downwards, the back of the wafer may contact the vicinity of the root of the shelf. Therefore, by using the upwardly inclined shelf 〇3 1 9 shown in Fig. 14, the tilting downward can be suppressed, the pitch of the shelves can be reduced, and the wafer storage container can be miniaturized or can be accommodated in the wafer. A larger number of wafers are contained in the container. Further, since the back surface of the wafer S does not partially contact the shelf 313 other than the placement protrusion 319, the film wound from the wafer surface to the peripheral edge portion of the wafer back surface is not peeled off to generate particles, so that the wafer is not contaminated. The wafer storage container can be kept in a very clean state. Further, the shelf can be made thinner or narrower, and the shelf can be made lighter. Although only one mounting projection 319 is shown in Fig. 14, a plurality of mounting projections 319 can be provided as long as the heights of the projections 319 of -30-200946418 are matched. In the case of having a plurality of placement projections 3 1 9 , since the shelf is inclined, it is necessary to make the heights of the uppermost portions of the placement projections 319 coincide with each other and to contact the wafer back surface at the same time. The back surface of the wafer is placed on the mounting protrusions 319. If the height of the uppermost portion of the mounting protrusions 319 does not match, the wafer may be tilted or the mounting protrusions 319 may not be in contact with the back surface of the wafer. ideal. In the case where the mounting protrusions 319 are provided at a plurality of places where the heights of the shelves 313 are equal, the mounting protrusions 319 of the same size (the height of the single mounting protrusions are the same) can be set. However, when the mounting protrusions 319 are provided in a plurality of places having different heights of the shelf 313, it is necessary to adjust the size of the mounting protrusions 319 (the height of the single mounting protrusions) so as to be completed (or mounted on the wafer storage container). The height of the top of the shelf is the same. The case where the shelf is tilted is also the same as viewed from Fig. 4 to Fig. 8 as viewed from above the central axis of the wafer (i.e., above the wafer surface). The shape of the shelf is the arc shape shown in Fig. 4, and the vicinity of the center of the arc-shaped truss shelf is the highest in the shelf. When only one mounting projection is provided in this portion (52 (Q) in Fig. 4), the height of the mounting projection can be considered. "If the mounting projection is provided in other portions (52 of Fig. 4) In the case of (P) and 52 (R), it is necessary to increase the height of the projections 52 (P) and 52 (R) (single) to be equal to the height of 52 (Q). The shape of the shape of Fig. 5 becomes slightly complicated. The arm portion 34 of the shelf is of course inclined upward, and the strip portion 33 of the shelf may have the same overall height. The strip portion 33 may be further inclined upward or downward. In the case where the heights of the strip portions 33 are the same, the mounting protrusions of the same height 200946418 can be set to 52 (P), 52 (Q), and 52 (R). In the case of being inclined, it is necessary to adjust the heights of the mounting projections 52 (P), 52 (Q), and 52 (R) of the single body so that all of them are the same. The shape of the shape of Fig. 6 also becomes a little complicated. The arm portion 34 of the shelf is of course inclined upward, and the strip portion 33 of the shelf may have the same overall height. The strip portion 33 may be further inclined upward or downward. In the case where the strip portions 33 have the same height, the placement projections 52 (P), 52 (Q), and 52 (R) having the same height can be provided. In the case of being inclined, it is necessary to adjust the heights of the mounting projections 52 (P), 52 (Q), and 52 (R) of the single body so as to have the same height. The case of the shape of Fig. 7 is similar to the case shown in Fig. 4. The arcuate portions 34, 33 are inclined upward, and the reinforcing portion is also inclined upward. The center of the arc-shaped shelf is the highest in the shelf. When only one mounting projection is provided in this portion (52 (Q) in Fig. 7), the height of the mounting projection may be considered, and the mounting projection may be provided in other portions (52 of Fig. 7 ( In the case of P) and 52 (R), it is necessary to increase the height of the 52 (P) and 52 (R) (monomer) 〇 placement protrusions to be equal to the height of 52 (Q). The case of the shape of Fig. 8 also becomes a little complicated. The arm portion 34 of the shelf is of course inclined upward, and the strip portion 33 of the shelf may have the same overall height, and the strip portion 33 may be further inclined upward or downward. In the case where the strip portions 33 have the same height, the placement projections 52 (P), 52 (Q), and 52 (R) having the same height can be provided. In the case of being inclined, it is necessary to adjust the heights of the mounting projections 52 (P), 52 (Q), and 52 (R) of the single body so as to have the same height. Furthermore, in the portion connected to the shelf on the other side, -32-200946418 may be the same height, or may be further inclined upward or downward. In the case where the mounting protrusion is provided in the connecting portion, the height must be the same as that of the other mounting projections (52 (P), 52 (Q), 52 (R)). Fig. 15 is a view showing an example of a different shelf shape from the fourth to eighth embodiments. The wafer storage container body 331 is in a normally installed state, that is, the bottom of the wafer storage container body 33 1 (Fig. 1) 2E) downward, the wafer entrance side (opening side) (2F in Fig. 1) faces upward, and is a cross-sectional view in the direction in which the wafer circular surface is viewed from the front side (the wafer surface is not shown). The crystal holder shown in Fig. 15 is the same as that of Figs. 4 to 8 and is symmetrically mounted on the opposite side wall portions 2C and 2D in the container body 331, respectively. The shelf formed on the wafer holder is still in a ring structure, and the plurality of shelves are adjacent to the (wafer holder) support plate portion 332 or 333, thereby reducing the weight and strength of the shelf. Upgrade. The shelf shown in Fig. 15 is a substantially equilateral triangle having a bottom edge on the side of the storage container body (side wall portion 2C side or 2D side) (the bottom edge portion is substantially arc-shaped along the outer circumference of the wafer cassette, and the two sub-frames The ring frame (in the shape of the "sub-layer frame" which is defined as the "sub-layer frame" in the axial direction of the wafer stored in the storage container in the axial direction of the storage container) The structure is formed by forming two sub-layers 334 (the first sub-frame 3 34-1 and the second sub-frame 334-2) of two substantially equilateral triangles of the same size and the same shape in one wafer holder. Further, in the wafer holder attached to the opposite side wall portions, two identical sub-shelves 335 (3 35-1, 335-2) are formed in a substantially symmetrical manner. The front end portion (also referred to as the apex portion) of the two equal-sided sub-layers of the one sub-layer shelf is oriented substantially toward the center of the wafer. In the case of the sub-frame of the suspension type -33-200946418 arm, the shape of the equilateral triangle is one of the strongest shapes when compared with the same material and the same weight, and thus is most suitable for the present invention. The shape of the wafer holder. Moreover, since it has a plurality of identical equilateral triangle shapes, it can minimize deflection and distortion even when supporting large-diameter wafers. In Fig. 15, since the wafer is held in two, the wafer is supported by four equilateral triangle sub-shelves. In general, the maximum number of sub-racks depends on the intersection angle (apex angle) of the front end portion of one substantially equilateral triangle, the length of the equilateral side, and the size of the support portion of the (wafer holder). The placement protrusions 336 (336-1, 336-2) and 337 (337-1, 337-2) shown in Fig. 15 are formed near the apex of the sub-layer of the equilateral triangle and the bottom side. . In other words, the first placement projection 336-1 is provided near the vertex of the first sub-rack 3 34-1, and the second placement projection 33 6-2 is provided in the vicinity of the vertex of the second sub-rack 334-2. Further, the first placement projections 337-1 are provided in the vicinity of the apex of the sub-story shelf 355-1 at the symmetrical position, and the second placement projections 337-2 are provided in the vicinity of the apex of the sub-slab 335-2. The four equilateral triangles shown in Fig. 15 have the same size and are formed at the positions of the projections at the apexes, and the wafers placed above them are substantially equidistant from the peripheral portion. The back of the position is supported. Therefore, the wafer weight is distributed to the placement projections to the same extent, and the deflection caused by the weight of the wafer itself becomes more uniform. The shelf (the same as the sub-shelf) is horizontal. As mentioned above, the shelf may be deformed downward according to the shelf strength and the shelf weight, but the shape of the equilateral triangle shown is the shape with the least amount of deformation. one. In order to further reduce the amount of deformation, as shown in Fig. 14, the frame is formed to be inclined upward with respect to the circular surface of the crystal - 34 - 200946418. That is, the shelf is formed by tilting from the root of the shelf and the (wafer holder) support plate portion toward the front end portion of the shelf toward the center (axis) side of the wafer. By designing the shelf into a plurality of substantially equilateral triangles and tilting the shelf as described above, the wafer can be supported only by the placement protrusions while suppressing the deformation of the shelf. As a result, the distortion of the wafer itself will become very small. The shelf and the placement projection are usually formed by using a resin, and a mold having a shape corresponding to the shape can be formed, and the resin can be injected into a mold (e.g., injection molding) to form a shelf and a placement projection. Fig. 19 is an enlarged schematic view showing the wafer holder (support plate portion and shelf) shown in Fig. 14. The shelf 513 is inclined with respect to the (wafer holder) support plate portion 51 1 at the aforementioned angle 0. As described above (the wafer holder), the support plate portion 511 is perpendicular to the horizontal plane (wafer surface) when the wafer is placed in the state of being mounted on the storage container. Therefore, the angle 0 is relative to the horizontal plane. The angle in the vertical direction. A 载 placement protrusion 514 is attached to the front end portion of the shelf 513, and a wafer S is placed thereon so as to contact the back surface of the wafer S. The angle 0 is the angle between the back surface of the wafer supported by the shelf 513 and the side of the shelf 513 facing the back surface of the wafer. If the angle between the shelf 513 and the horizontal is α, then α = 90 - 0. Further, as described above, the edge portion of the wafer S is in contact with the regulating portion 5 1 2 of the (wafer holder) supporting plate portion 51 1 . The angle α may be 0.1 degrees or more. However, when the wafer S is placed, the shelf 513 is deformed downward by the weight of the wafer, and the shelf is made lower than the horizontal position, which is larger than 0.1 degree. . If the angle α is increased, of course, the interval (pitch) of the shelf 513 becomes large. In addition, the interval of the shelf 513 is not -35-200946418, and the interval is also changed. Although it is desirable to accommodate a large number of wafers in the wafer storage container, the angle α is preferably 0.1 to 3.5 degrees due to the limitation of the size of the wafer storage container. In addition, since the (wafer holder) support plate portion may also be bent, the angle 0 is sometimes regarded as a vertical direction and a shelf with respect to the wafer surface (horizontal plane) when the wafer is placed on the shelf. The angle of the.
若層架513的間距爲a，（晶圓保持具）支承板部511 的限制部512至載置突起514的最上部（晶圓接觸位置）的 距離、亦即（晶圓保持具）支承板部511的根部至形成於層 Q 架513之載置突起514的最上部的連結線之晶圓徑方向成 分爲b，層架513的根部厚度爲c，層架513根部上端至 載置突起514的最上端部的距離爲d，載置突起514的最 上端部至層架513根部下端的距離爲e，貝!J a = c + d + e。另 外，若層架513長度（層架513的根部至載置突起514的 最上端部所在的層架位置的距離）爲m，則b = msin 0。 b只要比晶圓周緣部（從晶圓邊緣端起算1〜5mm的部 位）更內側即可，但在晶圓變得大口徑化的情況，由於晶 © 圓重量會造成晶圓本身撓曲，故不宜過短（晶圓之比b更 內側的部分發生撓曲）。在晶圓徑3 00-5 00 mm的情況，b 宜爲40〜100mm。具有上述b及α的層架，能以不致阻礙 晶圓出入且儘量減少晶圓重量所造成的晶圓撓曲的方式來 支承晶圓背面。例如，在載置4 5 0mm晶圓的情況，能以 儘量抑制晶圓撓曲的方式來支承晶圓背面，且能以樹脂毛 邊等（層架等的成形時發生在層架上）不致接觸晶圓的方式 來支承晶圓。 -36- 200946418 c =約 2.5mm、e =約 2mm 時，b =約 90mm、α=約 3.5 度時，層架間的間距a爲約10mm。然而，c、α會依層架 的材料強度而可能變得更小，e會依晶圓厚度和晶圓出入 收納容器的裕度而有增減。又關於b，會依層架本身重量 所造成的變形程度、晶圓出入時的困難程度等而改變。例 如，晶圓本身重量所造成的變形程度完全沒有問題且晶圓 出入時困難度小的情況，在大口徑晶圓的情況，可往比 〇 90mm更內側、亦即往晶圓中心側延伸，再者若在其間設 置1個以上的載置突起等，可進一步減少晶圓本身的撓 曲。 第15圖所示之大致等邊三角形的子層架，其頂角爲 15〜140度，較佳爲45〜75度，最佳爲大致60度。例如在 3 00mm的收納容器，1個晶圓保持具（相對於晶圓中心之 晶圓保持具部區域的視角爲約75度）所附設的子層架的數 目說明如下。在b = 4 0mm、頂角15度的情況，大致等邊 G 三角形的底邊長爲約11 mm、等邊長約41mm，因此是附 設最多約18個的等邊三角形子層架。在b = 4 0mm、頂角 45度的情況，大致等邊三角形的底邊長爲約3 4mm、等邊 長約44mm，因此是附設最多約6個的等邊三角形子層 架。在b = 40mm、頂角 60度的情況，是附設最多約4 個；在b = 40mm、頂角75度的情況，是附設最多約3 個；在b = 40mm、頂角140度的情況，是附設1個大致等 邊三角形子層架。 在3 0 0mm的收納容器，1個晶圓保持具（相對於晶圓 -37- 200946418 中心之晶圓保持具部區域的視角爲約75度）所附設的子層 架，在b = 90mm的情況其數目說明如下。在頂角15度 時，附設最多約8個的大致等邊三角形子層架。在頂角 45度時，附設最多2個的大致等邊三角形子層架。在頂 角60度時，附設約2個的大致等邊三角形子層架。在頂 角75度時，附設1個的大致等邊三角形子層架。 在45 0mm的收納容器，1個晶圓保持具（相對於晶圓 中心之晶圓保持具部區域的視角爲約75度）所附設的子層 ❹ 架，在b = 90mm的情況其數目說明如下。在頂角15度 時，附設最多約12個的大致等邊三角形子層架。在頂角 45度時，附設最多約4個的大致等邊三角形子層架。在 頂角60度時，附設2個的大致等邊三角形子層架。在頂 角75度時，附設約2個的大致等邊三角形子層架。 第16圖係顯示本發明之具有呈傾斜的層架之其他實 施例。第16圖所示的層架343，是和第14圖所示的層架 同樣的，相對於（晶圓保持具）支承板部呈傾斜，亦即如前 〇 述般在載置晶圓時’相對於水平面（或晶圓面）呈傾斜。且 進一步具備層架補強肋350。層架補強肋350，是形成在 與層架所支承的晶圓相對置的側之層架面和（晶圓保持具） 支承板部之間’從層架的根部延伸到層架中段，可將層架 予以補強。藉由該層架補強肋350’在載置晶圓時，可將 晶圓重量所造成之層架撓曲抑制成最小，且能防止層架的 間距變大，結果可增加容器內之晶圓收納數目。 第19圖也顯示層架補強肋515。層架補強肋515，是 -38- 200946418 在（晶圓保持具）支承板部511和層架513的根部，以厚實 且水平的狀態往晶圓徑方向延伸，藉此來補強層架513。 該根部的受力最大。亦即，除了承受層架整體的重量以 外’在將晶圓載置於層架時還承受晶圓重量。因此，根部 之肋高度（厚度）大。由於層架側的層架補強肋的重量也會 負荷於根部，隨著遠離根部，逐漸使其高度變小，以避免 發生應力集中部分。換言之’層架補強肋是從層架（和支 〇 承板部）的根部延伸至層架中段，層架補強肋的晶圓軸方 向的尺寸，在根部最大’而隨著接近層架中段逐漸變小。 另外，取代這種層架補強肋，使層架具有厚度，且使根部 的厚度較厚’而隨著接近層架前端使其厚度變薄，如此也 能有效地強化層架。另外，上述層架的補強，不僅是適用 於呈傾斜的層架，也適用於未傾斜而呈水平的層架。例 如’可將層架局部增厚（但在將晶圓載置於載置突起時， 不致接觸晶圓表面及背面的程度），或配合不同材料來使 © 用等，以將層架施以補強。 第17圖係顯示’和第15圖同樣的大致等邊三角形形 狀的複數個子層架之層架補強肋，是從晶圓面側觀察的截 面圖。在大致等邊三角形的各子層架362、363、3 65、 366 的 2 個等邊（362-1 和 362-2 ' 363-1 和 363-2、365-1 和365-2、366-1和366-2)的內側附設：從子層架和（晶圓 保持具）支承板部（361、3 64)的根部延伸至各等邊的中段 之層架補強肋 371(371-1、 371-2)、 372(372-1、 372-2)、 373(373-1、 373-2)、 374(374-1、 374-2)。另外，在子層架 -39- 200946418 362、363、365、366的頂角部分別附設載置突起367、 3 68、369、370，這 4 個載置突起 367、3 68、369、370 最 上部的高度相等，在載置晶圓S時，由於這4個載置突起 是均一地與晶圓S背面接觸，故晶圓S不會傾斜。 第20圖係顯示，在和第17圖同樣的層架（子層架）上 載置晶圓的狀態之立體圖。層架522，是相對於（晶圓保 持具）支承板部521呈傾斜安裝，且具備：以（晶圓保持具） 支承板部521爲底邊之大致等邊三角形的2個等邊（522-1、522-2)。在2個等邊的交會部分之頂角附近附設載置 突起523，晶圓S背面載置於該載置突起523上。從層架 5 22的根部至2個等邊的的中央附近附設有層架補強肋 524(524-1、5 24-2)。由於是在層架5 22上載置晶圓S，層 架522會受到晶圓S重量所產生之往下的力。層架522是 呈懸臂樑狀，在（晶圓保持具）支承板部521和層架5 22的 根部承受著晶圓S重量及層架5 22本身的重量。因此，若 根部的強度不足，層架5 22在根部附近可能發生變形。層 架補強肋524也附設在（晶圓保持具）支承板部521，層架 補強肋524可在根部將層架522施以補強，以抑制根部的 變形。另外，雖然層架5 22本身也有往下變形的可能性， 但藉由層架補強肋524可儘量減少其變形發生。特別是由 於層架補強肋5 24是在根部較厚而往前端部逐漸變薄，因 此可進一步強化其補強程度。 另外，層架522的2個等邊（5 22- 1、522-2)大致相等 且在頂角部附設載置突起523，因此往下的力是均等地負 200946418 荷於各等邊，不致使一方承受較大的力量。如此也能儘量 減少層架的變形。再者，如前述般，晶圓S雖與（晶圓保 持具）支承板部的限制部525接觸，但層架522的根部之 (晶圓保持具）支承板部部分521不一定會與晶圓S接觸。 亦即，晶圓S雖是呈圓形，但（晶圓保持具）支承板部不一 定是呈圓形。然而，層架底邊側之（晶圓保持具）支承板部 的一部分（或全部）是與晶圓邊緣接觸，該接觸部分成爲在 © 徑方向限制晶圓之限制部。在層架底邊側之（晶圓保持具） 支承板部全部都與晶圓邊緣接觸的情況，限制部（亦即， (晶圓保持具）支承板部之與晶圓邊緣接觸的部分）成爲直 徑和晶圓徑大致相等的圓弧狀。 第1 8圖係顯示本發明的其他實施形態，除了具有附 設第17圖所示的層架補強肋之大致等邊三角形的子層架 之晶圓保持具以外，進一步設置：在與收納容器本體的開 口相對置之背面部（第1圖的底板部2E)內側具有後層架 © (設置於背面的層架而稱爲「後層架」）的晶圓保持具。該 後層架396(2個等邊396-1、396-2)和相當於底邊部的後 (晶圓保持具）支承板部3 95是形成大致等邊三角形的環狀 構造。在與收納容器本體的開口部相對置的背面部內側， 藉由後晶圓保持具安裝部3 98來安裝後晶圓保持具。後層 架3 96是附設於後（晶圓保持具）支承板部3 95，和安裝於 收納容器側壁部的上述層架（子層架）同樣的，其頂角部是 朝晶圓中心側。在大致等邊三角形的後層架3 96的頂角部 設置載置突起397。在將收納容器橫向放置時，該載置突 -41 - 200946418 起397的高度是和安裝於收納容器側壁部之其他子層架 (382、 383、 385、 386)的載置突起（387 、 388、 389、 390) 的高度相同，因此在載置晶圓S時，是和其他載置突起同 樣的使晶圓背面接觸該載置突起397。 因此，後層架396是和其他層架以同程度的角度0形 成傾斜（或是使載置突起3 97的高度一致）。另外，在其他 子層架未傾斜時，後層架396也同樣的不傾斜。如此般藉 由設置後層架，不僅是在設置在相對置的兩處之收納容器 © 側壁部之子層架，在設置於其等的大致中間位置的場所也 能支承晶圓背面，因此可進一步減少晶圓的撓曲，而能實 現更窄的間距’以進一步增多可收納於收納容器內的晶圓 數目。 和其他的層架（子層架）同樣的，附設用來補強後層架 396的層架補強肋399(3 99- 1、399-2)亦可。另外，後（晶 圓保持具）支承板部395，不一定要以大致等邊三角形的 底邊部的形式來形成直線狀，也能形成曲線狀。另外，在 〇 後（晶圓保持具）支承板部395不一定要設置限制部，晶圓 邊緣不與後（晶圓保持具）支承板部接觸亦可（在其他晶圓 保持具的限制部與晶圓邊緣接觸）。然而，若在後（晶圓保 持具）支承板部3 95設置限制部來按壓晶圓邊緣，可將晶 圓固定地更牢固。 另外’藉由使載置突起和收納於收納容器之晶圓中心 隔一定距離，可將晶圓穩定地固定在收納容器。爲了容易 從收納容器的開口進行晶圓的取出放入，且爲了儘量減少 -42- 200946418 晶圓撓曲，該距離宜爲所收納的晶圓直徑的0.3倍至〇·5 倍的範圍。 目前爲止所說明的晶圓保持具，主要是針對可和收納 容器分割或分離的構件的形式。由於晶圓保持具具有上述 般複雜的構造，若考慮到成形模具的製作以及定期洗淨 等，以上述分割或分離的形式較佳，但依該晶圓保持具的 構造，也能以和收納容器形成一體的方式來製作（例如插 〇 入成形）。形成一體的情況之好處在於，可省去晶圓保持 具之安裝及組裝作業，經由1次的成形即可製作出收納容 器本體和晶圓保持具。又關於洗淨也是，可改良洗淨裝置 和洗淨液，以和分別洗淨的情況同樣程度的作業即可完成 洗淨。例如，晶圓保持具的構成要素之安裝部可和收納容 器本體形成一體。另外，層架（包含子層架）也和收納容器 本體形成一體亦可。再者，限制部也和收納容器本體形成 一體亦可。這些都例如能在藉由插入成形進行成形時和收 © 納容器本體一起形成。 第21圖係顯示將晶圓保持具（（晶圓保持具）支承板部 和層架）藉由插入成形進行成形時的形狀的示意圖。插入 成形，是預先形成出晶圓保持具的成形體’將該成形體插 入收納容器本體的成形模具’然後注入樹脂而形成一體 物。以（晶圓保持具）支承板部602配設於收納容器本體 601的嵌合部的方式進行插入成形。嵌合部是指’晶圓保 持具熔合於收納容器本體而接合成一體的部分。若使接合 部分（收納容器本體601和（晶圓保持具）支承板部602的 -43- 200946418 邊界部分）的表面稍熔融而進行熔合，其接合強度變強， 因此要插入的晶圓保持具（特別是（晶圓保持具）支承板部 6〇2)，宜使用熔點比隨後注入的收納容器本體601樹脂低 的材料。然而，只要能形成包圍晶圓保持具的插入部的周 圍，不一定要符合前述條件。例如第21圖所示，能使用 具有包入部606的晶圓保持具和收納容器本體601的模 具，也能使用可形成底切（undercut)607之晶圓保持具和 收納容器本體601的模具。結果，附設層架603之晶圓保 ⑩ 持具不會從收納容器本體60 1脫離，而能使（晶圓保持具） 支承板部602和收納容器本體601強固地結合在一起。當 然，若配合上溶合性，可進一步強化其結合。 另外，藉由使晶圓保持具的插入部的角部儘量形成平 滑，可避免應力集中在隨後注入的收納容器本體樹脂，因 此可進行高加工精度的加工。另外，宜避免熱膨脹係數差 異太大的樹脂。在這種情況，若將成形品加溫，樹脂會產 生伸縮，而可能發生接合部的剝離或裂痕等。爲了防止熱 〇 收縮所造成的剝離，較佳爲在局部形成第21圖所示的底 切607。再者，在插入成形時，包圍（晶圓保持具）支承板 部6 02之收納容器本體601的樹脂厚度，必須能充分承受 插入所產生之內部應力。例如，相當於底切607外側的突 緣部和包入部6 06的厚度的設計很重要。 另外，關於層架，可不和（晶圓保持具）支承板部形成 一體而僅將形狀複雜的層架予以分割分離，而在必要時再 將層架安裝於收納容器。 -44- 200946418 第22圖係顯示本發明的晶圓保持具的其他實施例。 本實施例的晶圓保持具610的特徵在於，（晶圓保持具）支 承板部611的內側呈中空（穿孔狀態）。如此般具有中空的 支承板部之晶圓保持具，配合上中空的層架可實現更進一 步的輕量化。第22圖的正中央的支承板部611是構成限 制部612，晶圓邊緣是與該部分接觸。層架616是形成內 側穿孔的E字形（在支承板部側穿孔）。在E字形層架的直 〇 線部分的交點（臂部6 1 5和帶狀部分6 1 3的交點）附近配置 載置突起614。第22圖雖是在1個層架配置3個載置突 起，但如先前所述並不限於3個，也可以是1個或2個， 或是比3個更多。但是，在配置成第22圖所示的位置的 情況，在載置晶圓時，晶圚重量和層架重量的合計荷重可 均一分散於3個臂部615，層架的穩定性佳而能延長層架 壽命。層架呈D字形或B字形等之無縱棒的情況，可使 用和第22圖所示的晶圓保持具同樣的中空支承板。另 ❹ 外，這種E字形、B字形或D字形等的無縱棒的層架也 是，除了呈水平以外，當然也能使用上述般之呈傾斜的構 . 造。另外，也能如上述般將該等晶圓保持具藉由插入成形 來形成出。 目前爲止，雖是說明在層架的既定位置配置1個或複 數個載置突起，但也能配置比前述實施例所敘述的情況更 多的載置突起。另外，載置突起是指，形成突（凸）狀或突 起狀之可載置晶圓的部分。載置突起的前端可以是既微小 且細，而使接觸晶圓背面的部分較小。或者，載置突起也 -45- 200946418 可以是前端部（載置晶圓的部分）呈平坦狀或曲面狀的載置 突起。或者，載置突起可在層架上面（載置晶圓時的上 側，是與晶圓背面接觸的側）之既定位置隔著間隔而形 成，以支承晶圓背面。載置突起，也可以使載置晶圓的部 位和晶圓形成平面重疊，亦即讓層架整體或一部分與晶圓 背面接觸。在此情況，是由層架本身來支承晶圓背面。在 此情況也是，可將層架的一部分（相當於晶圓背面之不要 被支承的部位）設計成凹狀，以避免接觸晶圓背面。例 ® 如，若晶圓背面的周緣部不想與層架接觸，可在支承晶圓 背面的周緣部之層架部分形成凹陷或讓其消失。或是，載 置突起的形狀也可以是半球狀或半圓柱狀。在半球狀載置 突起的情況’載置晶圓時，理論上是與晶圓形成點接觸， 實際上接觸部承受晶圓重量而稍微下沉，因此是成爲大致 圓形的面接觸。另外，在半圓柱狀的載置突起的情況，在 載置晶圓時，理論上是與晶圓形成點接觸，實際上接觸部 承受晶圓重量而稍微下沉，因此是成爲大致矩形的面接 〇 觸。 關於構成收納容器本體和蓋體的材料，可使用雜質氣 體產生少之高純度的聚碳酸酯、聚對苯二甲酸丁二酯、聚 酸醯亞胺、環烯烴聚合物、氟樹脂等的高分子材料。特別 是在晶圓製程內的容器一般是使用，在前述高分子材料混 合導電性塡料（碳纖維、碳粉、碳奈米管等）而賦予抗靜電 性或導電性的材料。又關於晶圓保持具（（晶圓保持具）支 承板部、層架）所使用的材料，包括聚丙烯、聚對苯二甲 -46- 200946418 酸丁二酯、聚四氟乙烯、聚萘二酸丁酯、聚醚醚酮、氟樹 脂、聚乙烯、聚乙烯彈性體、聚烯烴彈性體等的高分子材 料。較佳爲使用：進一步在其等中混合導電性塡料（碳纖 維、碳粉、碳奈米管等）而賦予抗靜電性或導電性的材 料’如此可抑制起因於靜電而附著在收納容器、晶圓保持 具（（晶圓保持具）支承板部、層架、載置突起）上的粒子 等。 G 作爲上述插入材料，如上述般可使用熔點比收納容器 本體更低的熱塑性樹脂或金屬材料。收納容器本體爲聚碳 酸酯製的情況’作爲晶圓保持具（（晶圓保持具）支承板 部、層架、載置突起）的材料，例如可使用聚對苯二甲酸 丁二酯、聚四氟乙烯、聚碳酸酯和聚四氟乙烯的樹脂合金 (alloy)等。另外，在收納容器本體爲環狀烯烴系樹脂或環 狀烯烴系共聚物的情況’作爲晶圓保持具（（晶圓保持具） 支承板部、層架、載置突起）的材料，例如可使用其等和 〇 聚四氟乙烯的樹脂合金等。作爲金屬材料，是包括不鏽鋼 系、鈦系、鋁系等。該等金屬材料，由於強度比高分子材 料高’故能形成更薄。又具有釋氣非常少的好處。再者， 也能使用以高分子材料被覆該等金屬材料而構成的材料。 如此般以高分子材料來被覆金屬材料而構成的晶圓保持具 ((晶圓保持具）支承板部、層架、載置突起），由於強度佳 且表面平滑’層架可做得較薄且變形量變小，結果可縮小 層架間距。 本發明的晶圓收納容器，不僅可作爲製程用容器而適 -47- 200946418 用在半導體前步驟及後步驟的製程內，當然也能作爲出貨 容器來使用。另外，雖然主要是針對收納半導體晶圓之晶 圓收納容器來做說明，但本發明的晶圓收納容器並不限於 半導體晶圓，當然也適用於一般的薄板。例如，本發明也 適用於光罩、標線片（reticle)等的收納容器，液晶等的顯 示元件形成用基板等的收納容器等。又在上述說明，在某 個實施例有記載但在其他實施例未記載的內容，只要不互 相矛盾且能適用，當然也能適用在該實施例中。 @ 本發明可適用於，使用晶圓收納容器（用來搬運或保 管半導體晶圓）之半導體產業。 【圖式簡單說明】 第1圖係顯示本發明的實施形態之晶圓收納容器本體 的內部的立體圖。 第2圖係顯示本發明的實施形態之晶圓收納容器的立 體圖。 〇 第3圖係顯示本發明的實施形態之晶圓保持具的立體 圖。 第4圖係顯示本發明的實施形態之組裝有晶圓保持具 和半導體晶圓之晶圓收納容器的單側的俯視圖。 第5圖係顯示本發明的其他實施形態之組裝有晶圓保 持具和半導體晶圓之晶圓收納容器的單側的俯視圖。 第6圖係顯示本發明的其他實施形態之組裝有晶圓保 持具和半導體晶圓之晶圓收納容器的單側的俯視圖。 -48- 200946418 第7圖係顯示本發明的其他實施形態之組裝有晶圓保 持具和半導體晶圓之晶圓收納容器的單側的俯視圖。 第8圖係顯示本發明的其他實施形態之組裝有晶圓保 持具和半導體晶圓之晶圓收納容器的單側的俯視圖。 第9(a)〜（c)圖係顯示本發明的晶圓保持具之限制部及 層架。 第10圖係顯示晶圓按壓構件的立體圖。 〇 第η圖係顯示晶圓按壓構件的俯視圖。 第12圖係半導體晶圓的邊緣周邊部的放大俯視圖。 第1 3圖係顯示本發明的實施形態之其他晶圓保持具 的立體圖。 第14圖係顯示具有傾斜層架之晶圓收納容器。 第15圖係顯示本發明的其他形狀的層架。 第16圖係顯示附設具有層架補強肋的層架之晶圓收 納容器。 Ο 第17圖係顯示附設具有層架補強肋的層架之晶圓收 納容器。 第1 8圖係顯示具有後層架之晶圓收納容器。 第1 9圖係用來說明傾斜層架的狀態。 第20圖係顯示具有層架補強肋的層架狀態之立體 圖。 第21圖係用來說明晶圓保持具的插入成形的狀態。 第22圖係顯示晶圓保持具的其他實施形態。 -49- 200946418 【主要元件符號說明】 1 :晶圓收納容器 2、 3 1 1、3 3 1、3 3 9、3 4 1、6 0 1 :晶圓收納容器本體 3、 610:晶圓保持具 4 :蓋體 5 :頂突緣 6 :搬運用的把手When the pitch of the shelf 513 is a, the distance between the regulating portion 512 of the support plate portion 511 (the wafer holder) and the uppermost portion (wafer contact position) of the mounting protrusion 514, that is, the (wafer holder) supporting plate The base portion of the portion 511 to the uppermost connecting line formed on the layer Q frame 513 has a wafer radial direction component b, the root portion of the shelf 513 has a thickness c, and the upper end of the shelf 513 has a root end to the mounting protrusion 514. The distance from the uppermost end portion is d, and the distance from the uppermost end portion of the placing protrusion 514 to the lower end of the root portion of the shelf 513 is e, and J a = c + d + e. Further, if the length of the shelf 513 (the distance from the root of the shelf 513 to the shelf position where the uppermost end of the placement protrusion 514 is located) is m, then b = msin 0. b is only required to be inside the wafer peripheral portion (a portion 1 to 5 mm from the edge of the wafer). However, when the wafer is enlarged in diameter, the wafer itself is deflected due to the weight of the wafer. Therefore, it should not be too short (the portion of the wafer is deflected more than the inner side of b). In the case of a wafer diameter of 300 to 00 mm, b should be 40 to 100 mm. The shelf having b and α described above can support the back surface of the wafer in such a manner as not to impede wafer entry and exit and minimize wafer deflection caused by wafer weight. For example, when a 450 mm wafer is placed, the wafer back surface can be supported so as to suppress the deflection of the wafer as much as possible, and the resin burrs or the like (which occur on the shelf when forming a shelf or the like) can be prevented from contacting. Wafers are used to support the wafer. -36- 200946418 c = about 2.5 mm, e = about 2 mm, b = about 90 mm, and α = about 3.5 degrees, the spacing a between the shelves is about 10 mm. However, c and α may become smaller depending on the material strength of the shelf, and e may increase or decrease depending on the thickness of the wafer and the margin of the wafer into and out of the container. Further, b is changed depending on the degree of deformation caused by the weight of the shelf itself, the degree of difficulty in wafer entry and exit, and the like. For example, the degree of deformation caused by the weight of the wafer itself is completely no problem, and the difficulty in wafer entry and exit is small. In the case of a large-diameter wafer, it can extend further to the inner side of the wafer, that is, toward the center side of the wafer. Further, if one or more mounting protrusions or the like are provided therebetween, the deflection of the wafer itself can be further reduced. The sub-layer of the substantially equilateral triangle shown in Fig. 15 has an apex angle of 15 to 140 degrees, preferably 45 to 75 degrees, and most preferably approximately 60 degrees. For example, in a storage container of 300 mm, the number of sub-shelves attached to one wafer holder (the viewing angle of the wafer holder portion in the center of the wafer is about 75 degrees) is as follows. In the case of b = 40 mm and a vertex angle of 15 degrees, the substantially equilateral G triangle has a base length of about 11 mm and an equilateral length of about 41 mm, so that it is attached with up to about 18 equilateral triangle sub-shelves. In the case of b = 40 mm and a vertex angle of 45 degrees, the substantially equilateral triangle has a base length of about 34 mm and an equilateral length of about 44 mm, so that it is attached with up to about 6 equilateral triangle sub-layers. In the case of b = 40mm and apex angle of 60 degrees, it is attached up to about 4; in the case of b = 40mm and apex angle of 75 degrees, it is attached up to about 3; in the case of b = 40mm and apex angle of 140 degrees, It is equipped with a roughly equilateral triangle sub-layer shelf. In a 300 mm storage container, a sub-layer shelf is attached to a wafer holder (approximately 75 degrees from the wafer holder area in the center of the wafer -37-200946418) at b = 90 mm. The number of cases is explained below. At a top angle of 15 degrees, a maximum of approximately eight substantially equilateral triangular sub-shelves are attached. At the apex angle of 45 degrees, a maximum of two substantially equilateral triangular sub-shelves are attached. At approximately 60 degrees of the apex angle, approximately two substantially equilateral triangular sub-shelves are attached. At the top angle of 75 degrees, one substantially equilateral triangle sub-shelf is attached. In a storage container of 45 mm, a sub-layer truss attached to one wafer holder (with a viewing angle of about 75 degrees with respect to the wafer holder portion in the center of the wafer) is described in the case of b = 90 mm. as follows. At a top angle of 15 degrees, a maximum of approximately 12 substantially equilateral triangular sub-shelves are attached. At the apex angle of 45 degrees, a maximum of approximately four substantially equilateral triangular sub-shelves are attached. At the apex angle of 60 degrees, two substantially equilateral triangular sub-shelves are attached. At approximately 75 degrees of the apex angle, approximately two approximately equilateral triangular sub-shelves are attached. Figure 16 is a view showing another embodiment of the present invention having a sloping shelf. The shelf 343 shown in Fig. 16 is the same as the shelf shown in Fig. 14, and is inclined with respect to the (wafer holder) support plate portion, that is, when the wafer is placed as described above. 'It is inclined with respect to the horizontal plane (or wafer side). Further, a shelf reinforcing rib 350 is further provided. The shelf reinforcing rib 350 is formed between the shelf surface and the (wafer holder) support plate portion on the side opposite to the wafer supported by the shelf, and extends from the root of the shelf to the middle of the shelf. Reinforce the shelf. By using the shelf reinforcing rib 350' when placing the wafer, the deflection of the shelf caused by the weight of the wafer can be minimized, and the pitch of the shelf can be prevented from being increased, and as a result, the wafer in the container can be increased. The number of storage. Figure 19 also shows the shelf stiffening ribs 515. The shelf reinforcing rib 515 is -38-200946418. The base of the (wafer holder) support plate portion 511 and the shelf 513 extends in a thick and horizontal state in the radial direction of the wafer, thereby reinforcing the shelf 513. The root is most stressed. That is, in addition to bearing the overall weight of the shelf, the wafer weight is also taken when the wafer is placed on the shelf. Therefore, the rib height (thickness) of the root portion is large. Since the weight of the shelf reinforcing ribs on the shelf side is also loaded on the roots, the height is gradually reduced as it moves away from the roots to avoid stress concentration. In other words, the shelf reinforcement rib extends from the root of the shelf (and the support plate portion) to the middle of the shelf. The size of the shelf reinforcement rib in the direction of the wafer axis is the largest at the root and gradually increases with the middle of the shelf. Become smaller. Further, in place of such a shelf reinforcing rib, the shelf has a thickness and the thickness of the root portion is made thicker, and as the thickness of the front end of the shelf is made thinner, the shelf can be effectively strengthened. In addition, the reinforcement of the above-mentioned shelf is not only applicable to a shelf which is inclined, but also to a shelf which is horizontal without being inclined. For example, 'the shelf can be locally thickened (but not when the wafer is placed on the mounting protrusion, and the surface and the back surface of the wafer are not touched), or the material can be used together to make the shelf reinforcement. . Fig. 17 is a cross-sectional view showing the shelf reinforcing ribs of a plurality of sub-layers having the same substantially equilateral triangle shape as in Fig. 15 as viewed from the wafer surface side. The two equilateral sides of the sub-layers 362, 363, 3 65, 366 of the substantially equilateral triangle (362-1 and 362-2 '363-1 and 363-2, 365-1 and 365-2, 366- The inner side of 1 and 366-2) is attached: a shelf reinforcing rib 371 (371-1, extending from the root of the sub-shelf and (wafer holder) support plate portions (361, 3 64) to the middle portion of each of the equilateral sides 371-2), 372 (372-1, 372-2), 373 (373-1, 373-2), 374 (374-1, 374-2). In addition, mounting protrusions 367, 3 68, 369, and 370 are attached to the top corner portions of the sub-shelves-39-200946418 362, 363, 365, and 366, respectively, and the four mounting protrusions 367, 3 68, 369, and 370 are the most The height of the upper portion is equal. When the wafer S is placed, since the four mounting protrusions are uniformly in contact with the back surface of the wafer S, the wafer S is not inclined. Fig. 20 is a perspective view showing a state in which a wafer is placed on a shelf (sub shelf) similar to that of Fig. 17. The shelf 522 is mounted obliquely with respect to the (wafer holder) support plate portion 521, and includes two equilateral sides (522) of a substantially equilateral triangle having a (wafer holder) support plate portion 521 as a base. -1, 522-2). A placement protrusion 523 is attached near the vertex of the intersection of the two equal sides, and the back surface of the wafer S is placed on the placement protrusion 523. A shelf reinforcing rib 524 (524-1, 5 24-2) is attached from the root of the shelf 5 22 to the vicinity of the center of the two equilateral sides. Since the wafer S is placed on the shelf 5 22, the shelf 522 is subjected to the downward force generated by the weight of the wafer S. The shelf 522 is in the shape of a cantilever beam, and the weight of the wafer S and the weight of the shelf 5 22 itself are received at the root portions of the (wafer holder) support plate portion 521 and the shelf 5 22 . Therefore, if the strength of the root is insufficient, the shelf 5 22 may be deformed in the vicinity of the root. The shelf reinforcing rib 524 is also attached to the (wafer holder) support plate portion 521, and the shelf reinforcing rib 524 can reinforce the shelf 522 at the root portion to suppress deformation of the root portion. In addition, although the shelf 5 22 itself has the possibility of being deformed downward, the deformation of the shelf can be minimized by the shelf reinforcing rib 524. In particular, since the shelf reinforcing ribs 5 24 are thicker at the root portion and gradually thinner toward the front end portion, the degree of reinforcement can be further enhanced. Further, since the two equal sides (5 22-1 and 522-2) of the shelf 522 are substantially equal and the mounting protrusions 523 are attached to the corner portions, the downward force is equal to the negative 200946418, and is not equal to each other. Causes one party to bear greater strength. This also minimizes the deformation of the shelf. Further, as described above, the wafer S is in contact with the regulating portion 525 of the (wafer holder) supporting plate portion, but the (wafer holder) supporting plate portion portion 521 of the root portion of the shelf 522 does not necessarily have crystals. Round S contact. That is, although the wafer S is circular, the (wafer holder) support plate portion is not necessarily circular. However, a part (or all) of the (wafer holder) support plate portion on the bottom side of the shelf is in contact with the edge of the wafer, and the contact portion serves as a restriction portion for restricting the wafer in the radial direction. In the case where the support plate portion of the bottom side of the shelf (wafer holder) is in contact with the edge of the wafer, the restriction portion (that is, the portion of the (wafer holder) support plate portion that is in contact with the edge of the wafer) It is an arc shape with a diameter substantially equal to the wafer diameter. Fig. 18 is a view showing another embodiment of the present invention, in addition to the wafer holder having the sub-layered substantially equilateral triangle with the shelf reinforcing ribs shown in Fig. 17, further provided: The inside of the back surface (the bottom plate portion 2E of Fig. 1) on which the opening faces each other has a wafer holder on the inside of the rear shelf © (a shelf provided on the back side, referred to as a "back shelf"). The rear shelf 396 (two equilateral sides 396-1, 396-2) and the rear (wafer holder) supporting plate portion 3 95 corresponding to the bottom edge portion are annular structures having a substantially equilateral triangle shape. The rear wafer holder is attached to the inner side of the back surface portion facing the opening of the container body by the rear wafer holder mounting portion 3 98. The rear shelf 3 96 is attached to the rear (wafer holder) support plate portion 3 95, and is similar to the above-described shelf (sub-layer shelf) attached to the side wall portion of the storage container, and the apex portion is toward the wafer center side. . A placement protrusion 397 is provided at a top corner portion of the rear shelf 3 96 of the substantially equilateral triangle. When the storage container is placed laterally, the height of the mounting protrusion -41 - 200946418 is 397 and the mounting protrusions (387, 388) of the other sub-shelves (382, 383, 385, 386) attached to the side wall portion of the storage container. Since the heights of 389 and 390 are the same, when the wafer S is placed, the wafer rear surface is brought into contact with the mounting protrusion 397 in the same manner as the other mounting protrusions. Therefore, the rear shelf 396 is inclined at the same angle 0 as the other shelves (or the heights of the mounting projections 3 97 are uniform). In addition, when the other sub-shelves are not inclined, the rear shelf 396 is also not inclined. In this way, by providing the rear shelf, not only the sub-sheaths of the side walls of the storage containers are provided at the opposite positions, but also the back surface of the wafer can be supported at a position substantially at the intermediate position, so that it can be further The deflection of the wafer is reduced, and a narrower pitch can be achieved to further increase the number of wafers that can be accommodated in the storage container. Like the other shelves (sub-shelves), it is also possible to attach the shelf reinforcing ribs 399 (3 99-1, 399-2) for reinforcing the rear shelf 396. Further, the rear (crystal holder) support plate portion 395 does not necessarily have to be formed in a straight line shape as a substantially equilateral triangle base portion, and can also be formed in a curved shape. Further, it is not necessary to provide a restriction portion in the rear support (wafer holder) support plate portion 395, and the wafer edge may not be in contact with the rear (wafer holder) support plate portion (in the restriction portion of the other wafer holder) Contact with the edge of the wafer). However, if the rear portion (wafer holder) support plate portion 3 95 is provided with a regulating portion for pressing the edge of the wafer, the crystal can be fixedly fixed. Further, the wafer can be stably fixed to the storage container by a predetermined distance between the mounting projection and the center of the wafer accommodated in the storage container. In order to facilitate the removal of the wafer from the opening of the container, and to minimize the deflection of the wafer from -42 to 200946418, the distance is preferably in the range of 0.3 times to 〇·5 times the diameter of the accommodated wafer. The wafer holder described so far is mainly in the form of a member that can be divided or separated from the container. Since the wafer holder has the above-described complicated structure, it is preferable to divide or separate the forming mold in consideration of the production of the forming mold and the periodic cleaning, but the structure of the wafer holder can also be accommodated and accommodated. The container is made in one piece (for example, inserting and forming). The advantage of being integrated is that the mounting and assembling work of the wafer holder can be omitted, and the storage container body and the wafer holder can be produced by one molding. Further, as for the washing, the washing device and the washing liquid can be improved, and the washing can be completed in the same manner as in the case of washing separately. For example, the mounting portion of the components of the wafer holder can be integrally formed with the container body. Further, the shelf (including the sub-shelf) may be integrated with the container body. Further, the restricting portion may be integrally formed with the container body. These can be formed, for example, together with the container body when forming by insert molding. Fig. 21 is a view showing the shape of the wafer holder (the (wafer holder) support plate portion and the shelf) when it is formed by insert molding. The insert molding is a molded body in which a wafer holder is formed in advance. The molded body is inserted into a molding die of the container body, and then resin is injected to form an integral body. Insertion molding is performed so that the (wafer holder) support plate portion 602 is disposed in the fitting portion of the container body 601. The fitting portion means a portion in which the wafer holding member is fused to the container body and joined together. When the surfaces of the joint portion (the boundary portion of the storage container body 601 and the -43-200946418 boundary portion of the (wafer holder) support plate portion 602) are slightly melted and fused, the joint strength becomes strong, and thus the wafer holder to be inserted is inserted. (In particular, (wafer holder) support plate portion 6〇2), a material having a lower melting point than the resin of the container body 601 to be subsequently injected is preferably used. However, as long as the circumference of the insertion portion surrounding the wafer holder can be formed, it is not necessary to satisfy the aforementioned conditions. For example, as shown in Fig. 21, a mold holder having the enclosing portion 606 and a mold for accommodating the container main body 601 can be used, and a mold for forming an undercut 607 wafer holder and a container main body 601 can be used. As a result, the wafer holder attached to the shelf 603 is not detached from the container body 601, and the (wafer holder) support plate portion 602 and the container body 601 can be strongly bonded together. Of course, if it is complexed, its binding can be further enhanced. Further, by making the corner portion of the insertion portion of the wafer holder as smooth as possible, stress can be prevented from being concentrated on the resin of the container body to be subsequently injected, so that processing with high processing accuracy can be performed. In addition, it is preferable to avoid a resin having a too large difference in thermal expansion coefficient. In this case, if the molded article is heated, the resin may expand and contract, and peeling or cracking of the joint may occur. In order to prevent peeling due to shrinkage of the heat, it is preferable to partially form the undercut 607 shown in Fig. 21. Further, at the time of insert molding, the resin thickness of the container body 601 surrounding the (wafer holder) support plate portion 602 must sufficiently withstand the internal stress generated by the insertion. For example, the design corresponding to the thickness of the flange portion on the outer side of the undercut 607 and the thickness of the enclosing portion 06 is important. Further, the shelf may be formed integrally with the (wafer holder) support plate portion, and only the frame having a complicated shape may be divided and separated, and the shelf may be attached to the storage container if necessary. -44- 200946418 Figure 22 shows another embodiment of the wafer holder of the present invention. The wafer holder 610 of the present embodiment is characterized in that the inner side of the (wafer holder) support plate portion 611 is hollow (perforated state). Such a wafer holder having a hollow support plate portion can be further reduced in weight by being fitted with a hollow shelf. The support plate portion 611 in the center of Fig. 22 constitutes a restriction portion 612, and the edge of the wafer is in contact with the portion. The shelf 616 is an E-shape (perforated on the side of the support plate portion) forming an inner side perforation. The placement protrusion 614 is disposed in the vicinity of the intersection of the straight line portion of the E-shaped shelf (the intersection of the arm portion 615 and the band portion 613). In Fig. 22, three mounting protrusions are arranged on one shelf, but as described above, they are not limited to three, and may be one or two, or more than three. However, in the case where the position shown in FIG. 22 is arranged, when the wafer is placed, the total load of the wafer weight and the shelf weight can be uniformly dispersed in the three arm portions 615, and the stability of the shelf can be improved. Extend shelf life. In the case where the shelf has a D-shaped or B-shaped shape without a vertical rod, the same hollow support plate as the wafer holder shown in Fig. 22 can be used. Further, such a frame having no vertical bars such as an E-shape, a B-shape or a D-shape may be formed by using the above-described inclined structure in addition to being horizontal. Further, the wafer holders can be formed by insert molding as described above. Heretofore, although one or a plurality of placement projections are disposed at a predetermined position of the shelf, it is also possible to arrange more placement projections than those described in the above embodiments. Further, the placement projection means a portion in which a projection (convex) shape or a protruding shape on which a wafer can be placed is formed. The front end of the placement projection may be minute and thin, and the portion contacting the back surface of the wafer may be small. Alternatively, the mounting projections -45-200946418 may be flat projections or curved projections at the front end portion (portion on which the wafer is placed). Alternatively, the placement protrusions may be formed at intervals between the predetermined positions on the shelf (on the side where the wafer is placed, which is the side in contact with the wafer back surface) to support the wafer back surface. The projections may be placed so that the portion on which the wafer is placed overlaps the wafer formation plane, that is, the entire shelf or a portion of the shelf is in contact with the back surface of the wafer. In this case, the back of the wafer is supported by the shelf itself. Also in this case, a part of the shelf (corresponding to the portion of the wafer back surface that is not to be supported) can be designed to be concave to avoid contact with the back surface of the wafer. Example ® For example, if the peripheral portion of the back surface of the wafer does not want to be in contact with the shelf, a recess may be formed or eliminated in the shelf portion of the peripheral portion of the back surface of the support wafer. Alternatively, the shape of the mounting projections may be hemispherical or semi-cylindrical. In the case of placing a wafer in a hemispherical shape, it is theoretically that the wafer is in point contact with the wafer. In fact, the contact portion is slightly sunk by the weight of the wafer, and thus is a substantially circular surface contact. Further, in the case of a semi-cylindrical mounting protrusion, when the wafer is placed, it is theoretically in point contact with the wafer. Actually, the contact portion is slightly sunk by the weight of the wafer, and thus the surface is substantially rectangular. Touch. The material constituting the container body and the lid body can be made of a high purity polycarbonate, a polybutylene terephthalate, a polyphthalate, a cycloolefin polymer, a fluororesin or the like using a small amount of impurity gas. Molecular material. In particular, a container in a wafer process is generally used, and a conductive material (carbon fiber, carbon powder, carbon nanotube, or the like) is mixed with the polymer material to impart antistatic properties or conductivity. Also used for wafer holders ((wafer holder) support plate parts, shelves), including polypropylene, polyparaphenylene-46-200946418 butadiene diester, polytetrafluoroethylene, polynaphthalene A polymer material such as dibutyl acrylate, polyether ether ketone, fluororesin, polyethylene, polyethylene elastomer, or polyolefin elastomer. It is preferable to use a material in which a conductive material (carbon fiber, carbon powder, carbon nanotube, or the like) is added to impart antistatic properties or conductivity, and thus it is possible to suppress adhesion to a storage container due to static electricity. Particles on the wafer holder ((wafer holder) support plate portion, shelf, mounting protrusion). G As the above-mentioned inserting material, as described above, a thermoplastic resin or a metal material having a lower melting point than that of the container body can be used. In the case where the container body is made of polycarbonate, as a material of the wafer holder (a wafer holder support plate portion, a shelf, and a projection), for example, polybutylene terephthalate or poly can be used. A resin alloy of tetrafluoroethylene, polycarbonate, and polytetrafluoroethylene. In the case where the container body is a cyclic olefin resin or a cyclic olefin copolymer, the material of the wafer holder (the (wafer holder) support plate portion, the shelf, and the placement protrusion) may be, for example. A resin alloy or the like which is equivalent to polytetrafluoroethylene is used. The metal material includes a stainless steel system, a titanium system, an aluminum system, and the like. These metal materials can be formed thinner because the strength is higher than that of the polymer material. It also has the advantage of very little outgassing. Further, a material formed by coating these metal materials with a polymer material can also be used. A wafer holder (a (wafer holder) support plate portion, a shelf, and a mounting protrusion) which is formed by coating a metal material with a polymer material in this manner, has a good strength and a smooth surface, and the shelf can be made thinner. And the amount of deformation becomes smaller, and as a result, the shelf spacing can be reduced. The wafer storage container of the present invention can be used not only as a process container but also in a pre-semiconductor step and a post-step process, and can of course be used as a shipping container. Further, although the invention is mainly directed to a wafer storage container for accommodating a semiconductor wafer, the wafer storage container of the present invention is not limited to a semiconductor wafer, and is of course applicable to a general thin plate. For example, the present invention is also applicable to a storage container such as a reticle or a reticle, a storage container such as a display element forming substrate such as a liquid crystal, or the like. Further, in the above description, what is described in one embodiment but not described in the other embodiments can be applied to the embodiment as long as they are not contradictory and applicable. @ The present invention is applicable to the semiconductor industry using wafer storage containers for transporting or holding semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the inside of a wafer container body according to an embodiment of the present invention. Fig. 2 is a perspective view showing a wafer container according to an embodiment of the present invention. Fig. 3 is a perspective view showing a wafer holder according to an embodiment of the present invention. Fig. 4 is a plan view showing one side of a wafer storage container in which a wafer holder and a semiconductor wafer are assembled according to an embodiment of the present invention. Fig. 5 is a plan view showing one side of a wafer storage container in which a wafer holder and a semiconductor wafer are assembled according to another embodiment of the present invention. Fig. 6 is a plan view showing one side of a wafer storage container in which a wafer holder and a semiconductor wafer are assembled according to another embodiment of the present invention. -48- 200946418 Fig. 7 is a plan view showing one side of a wafer storage container in which a wafer holder and a semiconductor wafer are assembled according to another embodiment of the present invention. Fig. 8 is a plan view showing one side of a wafer storage container in which a wafer holder and a semiconductor wafer are assembled according to another embodiment of the present invention. The ninth (a) to (c) drawings show the restriction portion and the shelf of the wafer holder of the present invention. Fig. 10 is a perspective view showing the wafer pressing member. 〇 The nth figure shows a top view of the wafer pressing member. Fig. 12 is an enlarged plan view showing a peripheral portion of the edge of the semiconductor wafer. Fig. 13 is a perspective view showing another wafer holder according to an embodiment of the present invention. Fig. 14 shows a wafer storage container having a slanted shelf. Figure 15 shows a shelf of other shapes of the present invention. Figure 16 shows a wafer receiving container with a shelf having shelf stiffeners. Ο Figure 17 shows a wafer receiving container with a shelf with shelf reinforcement ribs. Fig. 18 shows a wafer storage container having a rear shelf. Figure 19 is a diagram for explaining the state of the inclined shelf. Fig. 20 is a perspective view showing the state of the shelf having the shelf reinforcing ribs. Fig. 21 is a view for explaining the state of insert molding of the wafer holder. Figure 22 is a view showing another embodiment of the wafer holder. -49- 200946418 [Description of main component symbols] 1 : Wafer storage container 2, 3 1 1 , 3 3 1 , 3 3 9 , 3 4 1 , 6 0 1 : Wafer storage container body 3, 610: Wafer holding 4: Cover 5: Top flange 6: Handle for handling
50、 313、 334、 335、 343、 513、 522、 603、 613 ：層 Q 架 51、 312、3 32、3 3 3、342、361、364、381、3 84、 511、521、602:(晶圓保持具）支承板部 52、 319、3 3 6、3 3 7、349、3 97、514、523、604、 614 :載置突起 54 :把手 5 5 :上部嵌合部 56 :下部嵌合部 〇 5 8 :上部被嵌合片 62 :支承板片 6 3 :板材 64、66 :定位手段 67 :前後方向定位手段 69 :下部板部 71 :缺口 73:前後方向支承板片 -50- 200946418 75 :制動器 76 :卡止片 76A :彈性板片 76B :卡止用爪 314、344、512、525、6 12：限制部 338:晶圓保持具前方安裝部 340 :晶圓保持具後方安裝部 © 3 45 :上部安裝部 346:中央安裝部 3 47 :下部安裝部 371 、 372 、 373 、 374 、 391(391-1 、 391-2)、 392(392-1 、 392-2) 、 393(393-1 、 393-2) 、 394(394-1 、 394-2)、399(399-1、399-2)、515、524 ：層架補強肋 3 95:後（晶圓保持具）支承板部 3 9 6 :後層架 ® 3 98 :後晶圓保持具安裝部 6 1 1 :支承板部 . 6 1 5 :臂部 6 1 6 :帶狀部分 -51 -50, 313, 334, 335, 343, 513, 522, 603, 613: layer Q shelves 51, 312, 3 32, 3 3 3, 342, 361, 364, 381, 3 84, 511, 521, 602: ( Wafer holder) support plate portions 52, 319, 3 3 6 , 3 3 7 , 349 , 3 97 , 514 , 523 , 604 , 614 : mounting protrusion 54 : handle 5 5 : upper fitting portion 56 : lower embedded Joint 〇 5 8 : upper fitted piece 62 : support plate 6 3 : plate 64 , 66 : positioning means 67 : front and rear direction positioning means 69 : lower plate part 71 : notch 73 : front and rear direction support plate - 50 - 200946418 75 : Brake 76 : locking piece 76A : elastic plate piece 76B : locking claws 314 , 344 , 512 , 525 , 6 12 : restricting portion 338 : wafer holder front mounting portion 340 : wafer holder rear mounting Part © 3 45 : upper mounting portion 346 : central mounting portion 3 47 : lower mounting portions 371 , 372 , 373 , 374 , 391 (391-1 , 391-2 ) , 392 (392-1 , 392-2 ) , 393 (393-1, 393-2), 394 (394-1, 394-2), 399 (399-1, 399-2), 515, 524: shelf reinforcement ribs 3 95: rear (wafer holder) Support plate section 3 9 6 : Rear shelf ® 3 98 : Rear wafer holder . Portion 611: support plate part 615: arm 616: belt portion -51--