JP2003197728A - Cassette for storing substrate - Google Patents

Cassette for storing substrate

Info

Publication number
JP2003197728A
JP2003197728A JP2001397664A JP2001397664A JP2003197728A JP 2003197728 A JP2003197728 A JP 2003197728A JP 2001397664 A JP2001397664 A JP 2001397664A JP 2001397664 A JP2001397664 A JP 2001397664A JP 2003197728 A JP2003197728 A JP 2003197728A
Authority
JP
Japan
Prior art keywords
substrate
receiver
storage cassette
cassette
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001397664A
Other languages
Japanese (ja)
Inventor
Kazuo Kimata
一夫 木全
Takao Nakamori
孝雄 中森
Katsuhiko Kato
克彦 加藤
Kiyonori Nakano
清憲 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aitec Co Ltd
Original Assignee
Aitec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aitec Co Ltd filed Critical Aitec Co Ltd
Priority to JP2001397664A priority Critical patent/JP2003197728A/en
Priority to TW091134981A priority patent/TW594903B/en
Priority to CN02158466A priority patent/CN1428279A/en
Priority to KR1020020083981A priority patent/KR20030057380A/en
Publication of JP2003197728A publication Critical patent/JP2003197728A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the size and weight of a cassette for storing substrates by reducing the storage pitch of substrate. <P>SOLUTION: The cassette 1 for storing substrates comprises a substrate receiver 5 provided with an upward protrusion 53 for supporting a substrate 100 at a central position wherein the substrate 100 is placed or removed using a carrying means 200, e.g. a robot. The substrate receiver 5 has a shape copying the flexure of the substrate 100 occurring when the carrying means 200 supports the substrate 100 from below. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【０００１】 【発明の属する技術分野】本発明は、ＬＣＤ、ＰＤＰ、
ＦＥＤ等ＦＰＤ（フラットパネルディスプレイ）のガラ
ス基板等各種基板の搬送、保管用として使用される基板
収納カセットに関する。 【０００２】 【従来の技術及び発明が解決しようとする課題】従来か
らの一般的な基板収納カセットは、図４に示すように、
基板受け５によって基板１００の両端部１０１のみを支
持しており、基板１００の自重により撓みが発生し、ロ
ボット等搬送手段により基板１００の出し入れを行うた
めには、基板収納ピッチ（上下基板受け５間の間隔）を
大きく設定する必要があり、基板収納カセットの大型化
等を招いていた。 【０００３】また、従来からの他の基板収納カセットと
して、図５に示すように、基板１００の撓みを減らすた
めに基板１００の中心寄りの位置を支持する上向き凸部
５３が形成された基板受け５を備えたものが知られてい
るが、このような基板収納カセットは、図６に示すよう
に、基板１００をロボットハンド２００などで取り出す
ときに基板１００が上向き凸形状に撓み、基板１００の
端部１０１が基板受け５と干渉し、また、基板１００の
中央部１０２が直上の基板１００と干渉する場合がある
という問題があった。 【０００４】本発明は、上記のような従来技術の問題点
を解決し、基板収納ピッチを縮小化しつつ、基板取り出
し時に基板と基板受けまたは他の基板との干渉を防止す
ることができる基板収納カセットを提供することを目的
とする。 【０００５】 【課題を解決するための手段】本発明の基板収納カセッ
トは、基板の中心寄りの位置を支持する上向き凸部が形
成された基板受けを備え、基板の出し入れがロボット等
搬送手段によって行われる基板収納カセットにおいて、
前記基板受けの形状を、前記搬送手段が基板を下方から
支持しているときに発生する基板の撓み形状に倣った形
状にしたことを特徴とする。 【０００６】 【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて説明する。 【０００７】図１は、本実施形態に係る基板収納カセッ
トの斜視図を示している。図１に示すように、この基板
収納カセット１は、底板２の左端及び右端から左右一対
の支柱３が複数組奥行き方向に所定間隔を置いて立設さ
れており、各支柱３の上端に天板４が固定されている。
また、各々の支柱３には、上下方向に等間隔で複数の基
板受け５が内向きに突設されている。長板状の基板受け
５は、各々の支柱３において同一の高さ位置にある１２
個の基板受け５が１枚の基板１００を共同して支持する
役割を果たしている。 【０００８】図２は、基板受け５の拡大正面図を示して
いる。図２に示すように、基板受け５は、支柱３の内側
面から水平に伸びた基部５１と、この基部５１から斜め
上方へ伸びた傾斜部５２と、この傾斜部５２の先端に上
向きに突出した上向き凸部５３とを有している。基板受
け５、特に傾斜部５２は、図２に示すように、基板５１
がロボット等搬送手段によって下方から支持されている
とき（図２は、部分的に図示を省略したが左右一対のロ
ボットハンド２００によって支持されている場合に対応
する。）に発生する基板１００の撓みに着目し、このと
きの基板１００の鉛直断面形状（撓み角度）と略一致す
る鉛直断面形状（傾斜角度）をもつように設定されてい
る。換言すると、基板受け５の形状を、基板１００が搬
送手段２００によって下方から支持されているときに発
生する撓みに倣った形状にしている。また、上向き凸部
５３は、図２に示すように、基板１００の中心寄りの位
置を支持する。上下に隣り合った基板受け５間において
は、上側の基板受け５Ａの基部５１Ａの下面の高さ位置
は、下側の基板受け５Ｂの上向き凸部５３Ｂの上端の高
さ位置よりも高く、下側の基板受け５Ｂによって支持さ
れた基板１００Ｂの端部１０１Ｂが上側の基板受け５Ａ
と干渉しないように設定されている。 【０００９】図３は、基板収納カセット１から基板１０
０を取り出す際の動作説明図を示している。図３におい
て、（Ａ）は、取り出し対象となる上側基板１００Ａと
その直下の下側基板１００Ｂとの間にロボットのハンド
２００を進入させた状態を表している。この状態におい
ては、上下いずれの基板１００Ａ、１００Ｂも中央部１
０２Ａ、１０２Ｂが僅かに下がった状態で基板受け５
Ａ、５Ｂによって支持されている。この状態から、ハン
ド２００を上昇させ、ハンド２００によって上側基板１
００Ａを支持するようにする。（Ｂ）は、このハンド２
００上昇時において、ハンド２００が上側基板１００Ａ
を支持し始めた後、上側基板１００Ａがまさに基板受け
５Ａの上向き凸部５３Ａから離れようとしている時点で
の状態を表している。（Ｂ）の状態では、上側基板１０
０Ａに上向き凸形状の撓みが発生し、上側基板１００Ａ
は基板受け５Ａの傾斜部５２Ａと略平行な状態となるた
め、上側基板１００Ａの端部１０１Ａと基板受け５Ａと
は干渉しない。（Ｃ）は、（Ｂ）の状態からハンド２０
０がさらに上昇し、上側基板１００Ａを基板収納カセッ
ト１から取り出すために上側基板１００Ａを水平に手前
に移動させている状態を表している。（Ｃ）の状態で
は、上側基板１００Ａの中央部１０２Ａは、上向き凸形
状により最大高さ位置となるが、上側基板１００Ａの直
上の基板１００Ｃは、傾斜部５２Ｃを有する基板受け５
Ｃの上向き凸部５３Ｃによって中心寄りの位置で支持さ
れているため、その中央部１０２Ｃの撓みが少なくしか
も中央部１０２Ｃの高さ位置が高い。このため、基板収
納ピッチ（上下に隣り合う基板受け５Ａ、５Ｂ、５Ｃ間
の間隔）が比較的小さくても、上側基板１００Ａの中央
部１０２Ａとその上の基板１００Ｃとは干渉しなくな
る。 【００１０】以上説明したように、本実施形態の基板収
納カセット１は、基板１００の中心寄りの位置を支持す
る上向き凸部５３が形成された基板受け５を備え、基板
１００の出し入れがロボット等搬送手段２００によって
行われる基板収納カセット１において、基板受け５の形
状を、搬送手段２００が基板１００を下方から支持して
いるときに発生する基板１００の撓み形状に倣った形状
にした。このため、本実施形態によると、基板１００を
基板受け５で支持しているときは、上向き凸部５３が基
板１００の中心寄りの位置を支持していることから基板
１００の上下方向の撓みは少ないものとなり、また、基
板１００を取り出す際、搬送手段２００によって下方か
ら支持されている基板１００に撓みが発生するが、この
撓みは基板受け５の形状に沿った形状となるため、基板
収納ピッチを縮小しても基板１００と基板受け５との干
渉及び基板１００同士の干渉を防止することが可能とな
り、基板収納カセット１の小型化、軽量化を図ることが
できる。 【００１１】 【発明の効果】本発明の基板収納カセットによると、基
板受けの形状を、搬送手段が基板を下方から支持してい
るときに発生する基板の撓み形状に倣った形状にしたた
め、基板収納ピッチを縮小化させて基板収納カセットの
小型化、軽量化を図ることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LCD, a PDP,
The present invention relates to a substrate storage cassette used for transporting and storing various substrates such as a glass substrate of an FPD (flat panel display) such as an FED. 2. Description of the Related Art A conventional general substrate storage cassette is shown in FIG.
Only the both ends 101 of the substrate 100 are supported by the substrate receiver 5, and the substrate 100 is bent by its own weight. In order to transfer the substrate 100 in and out by a transfer means such as a robot, the substrate storage pitch (the upper and lower substrate receivers 5) is required. (Interval between them) needs to be set large, which has led to an increase in the size of the substrate storage cassette. [0005] As another conventional substrate storage cassette, as shown in FIG. 5, in order to reduce the deflection of the substrate 100, a substrate receiving member having an upward convex portion 53 for supporting a position near the center of the substrate 100 is formed. As shown in FIG. 6, when the substrate 100 is taken out by the robot hand 200 or the like, the substrate 100 is bent upward in a convex shape. There is a problem that the end portion 101 interferes with the substrate receiver 5 and the central portion 102 of the substrate 100 sometimes interferes with the substrate 100 immediately above. SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and reduces the substrate storage pitch while preventing interference between the substrate and a substrate receiver or another substrate when the substrate is taken out. It is intended to provide a cassette. A substrate storage cassette according to the present invention includes a substrate receiver having an upwardly projecting portion for supporting a position near the center of a substrate, and the substrate is taken in and out by a transfer means such as a robot. In the performed substrate storage cassette,
The substrate receiver may have a shape following a bent shape of the substrate generated when the transfer unit supports the substrate from below. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a substrate storage cassette according to the present embodiment. As shown in FIG. 1, in the substrate storage cassette 1, a plurality of pairs of right and left columns 3 are erected from the left end and the right end of the bottom plate 2 at predetermined intervals in the depth direction. The plate 4 is fixed.
In addition, a plurality of substrate receivers 5 are provided on each of the columns 3 at equal intervals in a vertical direction so as to protrude inward. The long plate-shaped substrate receiver 5 is located at the same height position on each of the columns 3.
The individual substrate receivers 5 play a role of supporting one substrate 100 jointly. FIG. 2 is an enlarged front view of the board receiver 5. As shown in FIG. 2, the substrate receiver 5 includes a base 51 extending horizontally from the inner side surface of the column 3, an inclined portion 52 extending obliquely upward from the base 51, and a tip of the inclined portion 52 projecting upward. And an upwardly directed convex portion 53. As shown in FIG. 2, the substrate receiver 5, particularly the inclined portion 52,
2 is supported from below by transfer means such as a robot (FIG. 2 is partially omitted, but corresponds to a case where the substrate 100 is supported by a pair of left and right robot hands 200). And is set to have a vertical cross-sectional shape (inclination angle) that substantially matches the vertical cross-sectional shape (deflection angle) of the substrate 100 at this time. In other words, the shape of the substrate receiver 5 is shaped to follow the deflection that occurs when the substrate 100 is supported from below by the transport means 200. The upward convex portion 53 supports a position near the center of the substrate 100, as shown in FIG. Between the vertically adjacent substrate receivers 5, the height position of the lower surface of the base 51A of the upper substrate receiver 5A is higher than the height position of the upper end of the upward protrusion 53B of the lower substrate receiver 5B. The end 101B of the substrate 100B supported by the substrate receiver 5B on the side
Is set so as not to interfere with FIG. 3 shows a state in which the substrate storage cassette 1
An operation explanatory diagram when taking out 0 is shown. 3A shows a state in which the robot hand 200 has entered between the upper substrate 100A to be taken out and the lower substrate 100B immediately below. In this state, both the upper and lower substrates 100A and 100B
02A and 102B are slightly lowered, and
A, 5B. From this state, the hand 200 is raised, and the upper substrate 1 is
00A is supported. (B) is this hand 2
00, the hand 200 moves to the upper substrate 100A.
After starting to support the upper substrate 100A, the upper substrate 100A is about to be separated from the upward convex portion 53A of the substrate receiver 5A. In the state of (B), the upper substrate 10
0A is bent upwardly, and the upper substrate 100A
Is substantially parallel to the inclined portion 52A of the substrate receiver 5A, so that the end 101A of the upper substrate 100A does not interfere with the substrate receiver 5A. (C) is the hand 20 from the state of (B).
0 further rises to indicate a state in which the upper substrate 100A is horizontally moved forward to take out the upper substrate 100A from the substrate storage cassette 1. In the state (C), the central portion 102A of the upper substrate 100A has the maximum height position due to the upward convex shape, but the substrate 100C immediately above the upper substrate 100A has the substrate receiver 5 having the inclined portion 52C.
C is supported at a position near the center by the upward convex portion 53C, so that the central portion 102C is less bent and the height of the central portion 102C is high. For this reason, even if the substrate storage pitch (the interval between the vertically adjacent substrate receivers 5A, 5B, and 5C) is relatively small, the central portion 102A of the upper substrate 100A does not interfere with the substrate 100C thereon. As described above, the substrate storage cassette 1 of the present embodiment includes the substrate receiver 5 having the upwardly projecting portion 53 for supporting the position of the substrate 100 near the center. In the substrate storage cassette 1 performed by the transfer means 200, the shape of the substrate receiver 5 is made to follow the bent shape of the substrate 100 generated when the transfer means 200 supports the substrate 100 from below. For this reason, according to the present embodiment, when the substrate 100 is supported by the substrate receiver 5, since the upward convex portion 53 supports a position near the center of the substrate 100, the vertical deflection of the substrate 100 is small. When the substrate 100 is taken out, the substrate 100 supported from below by the transporting means 200 is bent. However, since the bending is shaped according to the shape of the substrate receiver 5, the substrate storage pitch is reduced. It is possible to prevent the interference between the substrate 100 and the substrate receiver 5 and the interference between the substrates 100 even when the size of the substrate storage cassette 1 is reduced, so that the size and weight of the substrate storage cassette 1 can be reduced. According to the substrate storage cassette of the present invention, the shape of the substrate receiver is made similar to the bent shape of the substrate generated when the transfer means supports the substrate from below. By reducing the storage pitch, the size and weight of the substrate storage cassette can be reduced.

【図面の簡単な説明】 【図１】本発明の一実施形態に係る基板収納カセットの
斜視図である。 【図２】基板受けの拡大正面図である。 【図３】基板収納カセットから基板を取り出す際の動作
説明図である。 【図４】従来からの一般的な基板収納カセットの構成図
である。 【図５】従来からの他の基板収納カセットの構成図であ
る。 【図６】図５図示の従来例の問題点の説明図である。 【符号の説明】 １ 基板収納カセット ５ 基板受け ５３ 上向き凸部 １００ 基板 ２００ ロボット等搬送手段BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a substrate storage cassette according to an embodiment of the present invention. FIG. 2 is an enlarged front view of a substrate receiver. FIG. 3 is an operation explanatory diagram when a substrate is taken out from a substrate storage cassette. FIG. 4 is a configuration diagram of a conventional general substrate storage cassette. FIG. 5 is a configuration diagram of another conventional substrate storage cassette. FIG. 6 is an explanatory diagram of a problem of the conventional example shown in FIG. 5; [Description of Signs] 1 Substrate storage cassette 5 Substrate receiver 53 Upward projection 100 Substrate 200 Transport means such as robot

───────────────────────────────────────────────────── フロントページの続き (72)発明者 加藤 克彦 愛知県一宮市多加木二丁目７番30号 株式 会社アイテック内 (72)発明者 中野 清憲 愛知県一宮市多加木二丁目７番30号 株式 会社アイテック内 Ｆターム(参考） 3E096 AA06 BA20 BB05 CA08 CB03 DA03 DA23 DB06 DC01 FA10 GA20 5F031 CA05 DA01 EA06 PA13    ────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Katsuhiko Kato             2-7-30 Takagi, Ichinomiya City, Aichi Prefecture Stock             Inside ITEC (72) Inventor Kiyonori Nakano             2-7-30 Takagi, Ichinomiya City, Aichi Prefecture Stock             Inside ITEC F term (reference) 3E096 AA06 BA20 BB05 CA08 CB03                       DA03 DA23 DB06 DC01 FA10                       GA20                 5F031 CA05 DA01 EA06 PA13

Claims (1)

【特許請求の範囲】 【請求項１】 基板の中心寄りの位置を支持する上向き
凸部が形成された基板受けを備え、基板の出し入れがロ
ボット等搬送手段によって行われる基板収納カセットに
おいて、 前記基板受けの形状を、前記搬送手段が基板を下方から
支持しているときに発生する基板の撓み形状に倣った形
状にしたことを特徴とする基板収納カセット。1. A substrate storage cassette provided with a substrate receiver having an upwardly projecting portion for supporting a position near the center of a substrate, wherein the substrate is loaded and unloaded by a transfer means such as a robot. A substrate storage cassette, wherein the shape of the receiver is formed in accordance with a bent shape of the substrate generated when the transfer means supports the substrate from below.
JP2001397664A 2001-12-27 2001-12-27 Cassette for storing substrate Pending JP2003197728A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001397664A JP2003197728A (en) 2001-12-27 2001-12-27 Cassette for storing substrate
TW091134981A TW594903B (en) 2001-12-27 2002-12-03 Cartridge for accommodating substrate
CN02158466A CN1428279A (en) 2001-12-27 2002-12-26 Board storage box
KR1020020083981A KR20030057380A (en) 2001-12-27 2002-12-26 Cassette for storaging substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001397664A JP2003197728A (en) 2001-12-27 2001-12-27 Cassette for storing substrate

Publications (1)

Publication Number Publication Date
JP2003197728A true JP2003197728A (en) 2003-07-11

Family

ID=19189225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001397664A Pending JP2003197728A (en) 2001-12-27 2001-12-27 Cassette for storing substrate

Country Status (4)

Country Link
JP (1) JP2003197728A (en)
KR (1) KR20030057380A (en)
CN (1) CN1428279A (en)
TW (1) TW594903B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1305741C (en) * 2004-10-20 2007-03-21 友达光电股份有限公司 Cassette capable of holding substrates in different sizes
WO2009107254A1 (en) * 2008-02-27 2009-09-03 ミライアル株式会社 Wafer storage container with back supporting structure

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI265905B (en) * 2003-08-20 2006-11-11 Shinko Electric Co Ltd Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method
JP4903027B2 (en) * 2006-01-06 2012-03-21 東京エレクトロン株式会社 Substrate transport device and substrate support
CN103523401B (en) * 2013-10-31 2016-03-23 深圳市华星光电技术有限公司 A kind of card casket
JP6469046B2 (en) * 2016-07-15 2019-02-13 クアーズテック株式会社 Vertical wafer boat

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1305741C (en) * 2004-10-20 2007-03-21 友达光电股份有限公司 Cassette capable of holding substrates in different sizes
WO2009107254A1 (en) * 2008-02-27 2009-09-03 ミライアル株式会社 Wafer storage container with back supporting structure
JP4896260B2 (en) * 2008-02-27 2012-03-14 ミライアル株式会社 Wafer storage container with back support structure

Also Published As

Publication number Publication date
TW594903B (en) 2004-06-21
KR20030057380A (en) 2003-07-04
TW200301533A (en) 2003-07-01
CN1428279A (en) 2003-07-09

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