TW594903B - Cartridge for accommodating substrate - Google Patents
Cartridge for accommodating substrate Download PDFInfo
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- TW594903B TW594903B TW091134981A TW91134981A TW594903B TW 594903 B TW594903 B TW 594903B TW 091134981 A TW091134981 A TW 091134981A TW 91134981 A TW91134981 A TW 91134981A TW 594903 B TW594903 B TW 594903B
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- Prior art keywords
- substrate
- cartridge
- shape
- holder
- substrate holder
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Abstract
Description
594903 五、發明說明（Ο 【發明所屬技術領域】 本發明係關於一種用來移送或保管液晶顯示器（lcd )、電漿顯不面板（PDP) 、FED等平面顯示器（FPD)的 玻璃基板等各種基板的基板收納用卡匣。 【習知技術及發明所欲解決之問題】 如第4圖所不，習知之一般基板收納用卡匣僅藉由基 板座5來支承基板1〇〇的兩端部1〇1，但由於基板丨〇〇會因自 身重量而發生彎折，為了利用機器人等移送機構來進行基 板100的放入取出，必須加大基板收納的間距（上下基板 座5之間的間隔），因此會導致基板收納用卡匣的大型化 〇 如第5圖所示，習知之其他基板收納用卡匣，為了減 少基板1 0 0的彎折，具備形成有上凸部5 3以支承基板丨〇 〇的 靠=心部位的基板座5之設計業已眾所周知，然而如第6圖 所不’此種基板收納用卡匣在利用機器人手部2 〇 〇等來取 出基板100時，該基板收納用卡匣的基板1〇〇會彎折成上凸 的形狀’進而發生基板1〇〇的端部1〇1與基板座5相互干擾 以及基板100的中央部1〇2與正上方的基板1〇〇相互干擾的 問題。 本發明係為解決上述之習知技術的問題點而開發者， 其目的在提供一種可縮小基板收納的間距，且在將基板取 出時可防止基板與基板座或、其他基板相互干擾之基板收納 用卡匣。 【解決問題之手段】594903 V. Description of the Invention (0 [Technical Field of the Invention] The present invention relates to a variety of glass substrates for transferring or storing liquid crystal displays (lcds), plasma display panels (PDPs), and flat displays (FPDs) such as FEDs. [The problem to be solved by the conventional technology and invention] As shown in FIG. 4, the conventional general substrate storage cassette supports only both ends of the substrate 100 by the substrate holder 5. However, since the substrate may bend due to its own weight, in order to use a robot or other transfer mechanism to load or remove the substrate 100, the substrate storage space must be increased (the distance between the upper and lower substrate holders 5). Interval), it will increase the size of the substrate storage cassette. As shown in FIG. 5, other conventional substrate storage cassettes are provided with upper protrusions 53 to reduce the bending of the substrate 100. The design of the substrate holder 5 that supports the substrate at the center of the substrate is well known. However, as shown in FIG. 6, when such a substrate storage cassette is used to take out the substrate 100 using a robot hand 200 or the like, The substrate 100 of the board storage cassette is bent into a convex shape, and further, the end 100 of the substrate 100 and the substrate holder 5 interfere with each other, and the central portion 102 of the substrate 100 is directly above the substrate 100. The problem that the substrate 100 interferes with each other. The present invention was developed to solve the problems of the above-mentioned conventional technology, and the object of the invention is to provide a substrate storage space that can be reduced and the substrate and the substrate holder can be prevented when the substrate is taken out. Or, other substrate-receiving cassettes that interfere with each other.
9457.ptd 第5頁 5949039457.ptd Page 5 594903
且利用機器人等搬送機^ 納用卡匡中’其特徵為. 構由下方支承基板時所發 本發明的基板收納用卡J£係 承基板的靠中心部位的基板座， 來進行基板的放入取出之基板收 上述基板座的形狀係仿傚搬送機 生的基板彎折形狀而設計者。 【發明之實施型態】 以下參佐圖面說明本發明之實施型態。It also uses a conveyor such as a robot to accept the card, and it is characterized in that the substrate storage card J of the present invention issued when the substrate is supported from below is a substrate holder at the center of the substrate to carry the substrate. The shape in which the substrate is taken in and taken out and the substrate holder is designed is modeled after the shape of the substrate bent by the conveyor. [Implementation Mode of the Invention] The following reference drawings illustrate the implementation mode of the present invention.
第1圖係本實施型態之基板收納用卡^匡的斜視圖。如 第1圖所不，該基板收納用卡匣丨中，左右成對的支柱3係 由底板2的左端及右端朝縱深方向，相隔預定間隔地豎設 複數組，且在各支柱3的上端固定有上頂板4。此外，&複1數 的基板座5係於上下方向等間隔地朝内突設於各支柱3。在 各支柱3上，長板狀的基板座5則具有由位於相 個基板座5共同支承-片基板1GQ的作用。％度的12FIG. 1 is a perspective view of a substrate storage card according to this embodiment. As shown in FIG. 1, in the substrate storage cassette 丨, the left and right pair of pillars 3 are arranged in a vertical direction from the left and right ends of the bottom plate 2 at a predetermined interval, and at the upper end of each pillar 3上 上 顶板 4。 4 fixed on the top plate. In addition, a plurality of substrate holders 5 are projected inwardly from the pillars 3 at regular intervals in the vertical direction. On each of the pillars 3, the long-plate-shaped substrate holder 5 has a function of supporting the sheet substrate 1GQ in common with the substrate holders 5 located on the respective substrate holders 5. % Degree of 12
第2圖係基板座5的放大正視圖。如第2圖所示，基板 座5係具備：由支柱3的内侧面水平地延伸的基部51 ;由該 基部51朝斜上方延伸的傾斜部5 2 ;及朝上突出於該傾斜部 52的前端的上凸部53。如第2圖所示，基板座5 (尤其是傾 斜部5 2 )之形狀係著眼於利用機器人等搬送機構由基板 1〇〇的下方支承基板丨00時（第2圖係為與藉由左右各一對 的機1§人手部2 〇 〇來支承的狀態相對應，但其中部份圖示 已省略）’基板1 〇 〇產生彎折的情形，使之具有與此時之 基板1 0 0的垂直剖視形狀（彎折角度）大致相同的垂直剖 視形狀（傾斜角度）。換言之，基板座5的形狀設定係仿FIG. 2 is an enlarged front view of the substrate holder 5. As shown in FIG. 2, the substrate holder 5 includes a base portion 51 extending horizontally from the inner side surface of the pillar 3, an inclined portion 5 2 extending obliquely upward from the base portion 51, and a base portion 51 protruding upward from the inclined portion 52.上 的 上挂 部 53。 Upper convex portion 53. As shown in FIG. 2, the shape of the substrate holder 5 (especially the inclined portion 5 2) is based on the case where the substrate is supported by the substrate 100 from below by using a transport mechanism such as a robot (the second image shows Each pair of machines 1§ corresponds to the state of being supported by the human hand 2000, but some of the illustrations have been omitted) 'The substrate 1 00 is bent, so that it has a substrate 100 at this time. The vertical cross-sectional shape (bending angle) is approximately the same as the vertical cross-sectional shape (tilt angle). In other words, the shape setting of the substrate holder 5 is imitated
9457.ptd 第6頁 594903 五、發明說明（3) - 效利用搬送機構2 0 0由下方支承基板1 〇 〇時所發生的彎折形· 狀。而且，如第2圖所示，上凸部5 3係支承基板1 〇 〇的靠中 心部位。在上下相鄰的基板座5之間，上侧基板座5 A之基 部5 1 A之下面高度位置係高於下侧基板座5 b之上凸部5 3 B 上端之高度位置，使得藉由下侧基板座5 b所支承之基板 100B的端部101B不會與上側基板座5A相互干擾。 第3圖係將基板1 0 〇從基板收納用卡匣1取出時的動作 說明圖。第3圖中，（A)係令機器人的手部2〇〇進入作為 取出對象之上側基板100A及其正下方之下側基板1〇 〇B之間 的狀態。在該狀態下，上下任一個基板l〇OA、1 〇〇B皆為在 其中央部102A、102B稍微下垂的狀態下，藉由基板座μ、 5B來支承。由該狀態令手部2〇〇上升而藉由手部2〇〇來支承 上側基板1 0 0 A。（ B )係為在該手部2 〇 〇上升的情況下，在 手部20 0開始支承上側基板1 ooa後，上侧基板1〇 〇A即將從 基板座5A的上凸部53A分離時的狀態。由於在（b )的狀態 下，上側基板1 0 0 A會形成上凸形狀的彎折，且上側基板 1 0 0 A與基板座5 A的傾斜部5 2 A會成為略平行狀態，故上侧 基板100A的端部101A與基板座5A不會相互干擾。（c)係 手部200從（B)的狀態再升高，為了從基板收納用卡匣1 取出上側基板1 0 0 A ’而將上側基板1 〇 〇 A水平地移動至正前 面的狀態。在（C )狀態中，上侧基板1 〇 〇 a的中央部1 〇 2 A 因為上凸形狀而達到最高位 '置，然而因為上側基板1 〇 〇 A正 上方的基板100C係藉由具有傾斜部52C之基板座5C的上凸 部53C而支承於靠中心部位，所以其中央部1 〇2C的彎折較9457.ptd Page 6 594903 V. Description of the Invention (3)-The bending shape and shape that occur when the transfer mechanism 2000 is used to support the substrate 100 from below. Further, as shown in FIG. 2, the upper convex portion 53 is a center portion of the support substrate 100. Between the upper and lower adjacent substrate holders 5, the height position below the base portion 5 1 A of the upper substrate holder 5 A is higher than the height position of the upper end of the convex portion 5 3 B above the lower substrate holder 5 b. The end portion 101B of the substrate 100B supported by the lower substrate holder 5 b does not interfere with the upper substrate holder 5A. Fig. 3 is an operation explanatory view when the substrate 100 is taken out from the substrate storage cassette 1. In FIG. 3 (A), the robot hand 200 is brought into a state between the upper substrate 100A to be taken out and the lower substrate 100B directly below it. In this state, both the upper and lower substrates 100A and 100B are supported by the substrate holders µ and 5B in a state where the central portions 102A and 102B sag slightly. In this state, the hand 200 is raised, and the upper substrate 100 A is supported by the hand 200. (B) In the case where the hand 200 rises, when the hand 200 starts to support the upper substrate 100a, the upper substrate 100A is about to be separated from the upper convex portion 53A of the substrate holder 5A. status. In the state (b), the upper substrate 1 0 A will form a convex convex bend, and the upper substrate 1 0 A and the inclined portion 5 2 A of the substrate holder 5 A will be slightly parallel. The end portion 101A of the side substrate 100A and the substrate holder 5A do not interfere with each other. (C) The hand 200 is raised again from the state of (B), and the upper substrate 100A is horizontally moved to the front state in order to take out the upper substrate 100A 'from the substrate storage cassette 1. In the (C) state, the central portion 1 002 A of the upper substrate 100a reaches the highest position because of the convex shape, but because the substrate 100C directly above the upper substrate 100A is inclined The upper convex portion 53C of the substrate holder 5C of the portion 52C is supported near the center, so the bending of the central portion 102C is relatively small.
9457.ptd 第7頁 594903 五、發明說明（4) 小’該中央部1 0 2C的高度位置亦較高。因此，即使基板間-距（上下相鄰之基板座5 A、5 B、5 C彼此間的間隔）較小， 上側基板100A的中央部1 02A與其上的基板100C亦不會相互 干擾。 ， 如以上所說明，本實施型態之基板收納用卡匣1係在 具備形成有上凸部5 3以支承基板1 0 0的靠中心部位的基板 座5，且利用機器人等搬送機構2〇〇來進行基板10〇之放入 取出的基板收納用卡匣1中，基板座5的形狀係仿傚搬送機 構20 0由下方支承基板100時所發生的基板1〇〇彎折形狀而 設計者。所以，根據本實施型態，以基板座5來支承基板 1 0 0時，係由上凸部5 3支承基板1 〇 〇的靠中心部位，故基板 100在上下方向的彎折會變小，而且，在取出基板時， 搬送機構2 0 0由下方支承的基板1〇〇雖會產生.灣折，然而由 於該彎折係形成順沿基板座5的形狀，所以即使縮小基板 收納間距，亦可防止基板1 〇 〇與基板座5的相互干擾及基板 100彼此間的干擾，又可獲致基板收納用卡匣1的小型化及 輕量化。 【發明之效果】 根據本發明的基板收納用卡匣，由於基板座的形狀 係仿傚搬送機構由下方支承基板時所發生的基板彎折形狀 而設計者，故可縮小基板收納間距，進而獲致基板收納用 卡匣的小型化及輕量化。9457.ptd Page 7 594903 V. Description of the invention (4) Small ′ The height position of the central portion 1 2 2C is also higher. Therefore, even if the substrate-to- substrate distance (the distance between the substrate holders 5 A, 5 B, and 5 C adjacent to each other) is small, the center portion 102A of the upper substrate 100A and the substrate 100C thereon do not interfere with each other. As described above, the substrate accommodating cassette 1 of this embodiment is provided on a substrate holder 5 having a central portion formed with an upper convex portion 53 to support the substrate 100, and a transfer mechanism 2 such as a robot is used. In the substrate accommodating cassette 1 for placing and taking out the substrate 100, the shape of the substrate holder 5 is designed following the shape of the substrate 100 that is bent when the transport mechanism 200 supports the substrate 100 from below. Therefore, according to this embodiment, when the substrate 100 is supported by the substrate holder 5, the central portion of the substrate 100 is supported by the upper convex portion 53, so the bending of the substrate 100 in the vertical direction becomes smaller. In addition, when the substrate is taken out, the substrate 100 supported by the conveying mechanism 2000 from the bottom may generate a bay fold. However, since the bend is formed along the shape of the substrate holder 5, even if the substrate storage pitch is reduced, It is possible to prevent mutual interference between the substrate 100 and the substrate holder 5 and interference between the substrates 100, and to achieve miniaturization and weight reduction of the substrate storage cassette 1. [Effects of the Invention] According to the substrate storage cassette of the present invention, since the shape of the substrate holder is designed to imitate the shape of the substrate bent when the transport mechanism supports the substrate from below, the substrate storage space can be reduced, and the substrate can be obtained. Miniaturization and weight reduction of the storage cassette.
頁 594903Page 594903
【圖面之簡單說明】 扪圖係本發明實施型態之基板收納用卡£的斜视[Brief description of the drawing] 扪 The drawing is a squint view of the substrate storage card according to the embodiment of the present invention.
第2圖係基板座的放大正視圖。 第3圖係將基板由基板收納用卡匣取出眭 叫町的動作說明 第4圖係習知之一般基板收納用卡匣的構造圖 第5圖係習知之其他基板收納用卡匠的構造圖 第6圖係第5圖之習知例的問題說明圖。 【符號說明】 1…基板收納用卡匣 2…底板 3…支柱 4…上頂板 5、5A、5B、5C…基板座 51、 51A…基部 52、 52A、5 2C…傾斜部 53 、53A 、53B 、53C …上凸部 100、 100A、100B、100C …基板 101、 101A、101B …端部 102、 102A、102B、102C …中央部 20 0…機器人搬送機構、Figure 2 is an enlarged front view of the substrate holder. Fig. 3 is an explanation of the operation of taking out the substrate from the substrate storage cassette Howling Town. Fig. 4 is a structure diagram of a conventional substrate storage cassette. Fig. 5 is a structure diagram of another conventional substrate storage cardmaker. FIG. 6 is a problem explanatory diagram of the conventional example in FIG. 5. [Description of symbols] 1 ... Cartridge for housing substrate 2 ... Bottom plate 3 ... Pillar 4 ... Top plate 5,5A, 5B, 5C ... Substrate holders 51, 51A ... Base portions 52, 52A, 5 2C ... Inclined portions 53, 53A, 53B , 53C… upward protrusions 100, 100A, 100B, 100C… substrates 101, 101A, 101B… end portions 102, 102A, 102B, 102C… central portion 20 0… robot transfer mechanism,
9457.ptd 第9頁9457.ptd Page 9
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001397664A JP2003197728A (en) | 2001-12-27 | 2001-12-27 | Cassette for storing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200301533A TW200301533A (en) | 2003-07-01 |
| TW594903B true TW594903B (en) | 2004-06-21 |
Family
ID=19189225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091134981A TW594903B (en) | 2001-12-27 | 2002-12-03 | Cartridge for accommodating substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003197728A (en) |
| KR (1) | KR20030057380A (en) |
| CN (1) | CN1428279A (en) |
| TW (1) | TW594903B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI265905B (en) * | 2003-08-20 | 2006-11-11 | Shinko Electric Co Ltd | Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method |
| CN1305741C (en) * | 2004-10-20 | 2007-03-21 | 友达光电股份有限公司 | Cassette capable of holding substrates in different sizes |
| JP4903027B2 (en) * | 2006-01-06 | 2012-03-21 | 東京エレクトロン株式会社 | Substrate transport device and substrate support |
| JP4896260B2 (en) * | 2008-02-27 | 2012-03-14 | ミライアル株式会社 | Wafer storage container with back support structure |
| CN103523401B (en) * | 2013-10-31 | 2016-03-23 | 深圳市华星光电技术有限公司 | A kind of card casket |
| JP6469046B2 (en) * | 2016-07-15 | 2019-02-13 | クアーズテック株式会社 | Vertical wafer boat |
-
2001
- 2001-12-27 JP JP2001397664A patent/JP2003197728A/en active Pending
-
2002
- 2002-12-03 TW TW091134981A patent/TW594903B/en not_active IP Right Cessation
- 2002-12-26 KR KR1020020083981A patent/KR20030057380A/en not_active Application Discontinuation
- 2002-12-26 CN CN02158466A patent/CN1428279A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030057380A (en) | 2003-07-04 |
| TW200301533A (en) | 2003-07-01 |
| CN1428279A (en) | 2003-07-09 |
| JP2003197728A (en) | 2003-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |