TWI265905B - Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method - Google Patents

Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method

Info

Publication number
TWI265905B
TWI265905B TW093124682A TW93124682A TWI265905B TW I265905 B TWI265905 B TW I265905B TW 093124682 A TW093124682 A TW 093124682A TW 93124682 A TW93124682 A TW 93124682A TW I265905 B TWI265905 B TW I265905B
Authority
TW
Taiwan
Prior art keywords
substrate
installation
removal
substrate carrier
carrier
Prior art date
Application number
TW093124682A
Other languages
Chinese (zh)
Other versions
TW200512144A (en
Inventor
Yasuyoshi Kitazawa
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003296454A external-priority patent/JP3909597B2/en
Priority claimed from JP2003296453A external-priority patent/JP2005064431A/en
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of TW200512144A publication Critical patent/TW200512144A/en
Application granted granted Critical
Publication of TWI265905B publication Critical patent/TWI265905B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

An installation/removal device (1) for putting or removing a substrate (A) into or from a storage container (10) in which substrates are stored, the installation/removal device comprising a mounting table (31) on which the substrate (A) is mounted, a holder (32) for holding the substrate (A) provided on the mounting table (31) so as to be movable in the direction of installation/removal of the substrate (A), and rollers (37) provided on the mounting table which support the substrate (A), being held by the holder (32), such that it is movable in the direction of installation/removal.
TW093124682A 2003-08-20 2004-08-17 Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method TWI265905B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003296454A JP3909597B2 (en) 2003-08-20 2003-08-20 Board loading / unloading device
JP2003296453A JP2005064431A (en) 2003-08-20 2003-08-20 Apparatus and method for substrate transfer

Publications (2)

Publication Number Publication Date
TW200512144A TW200512144A (en) 2005-04-01
TWI265905B true TWI265905B (en) 2006-11-11

Family

ID=34680569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124682A TWI265905B (en) 2003-08-20 2004-08-17 Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method

Country Status (3)

Country Link
KR (1) KR100633848B1 (en)
CN (1) CN1600658B (en)
TW (1) TWI265905B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481541B (en) * 2010-08-04 2015-04-21 Daifuku Kk Transport device and transport method for plate-shaped objects

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102464210A (en) * 2010-11-11 2012-05-23 株式会社Siti Substrate carrying device
CN102602695A (en) * 2011-01-25 2012-07-25 佶新科技股份有限公司 Substrate conveying and sorting device
CN104495357B (en) * 2014-12-12 2017-01-04 南通富士通微电子股份有限公司 A kind of photolithography plate Filtting device
JP6449074B2 (en) * 2015-03-25 2019-01-09 住友化学株式会社 Substrate processing apparatus and substrate processing method
JP6339057B2 (en) * 2015-09-29 2018-06-06 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
CN107601043A (en) * 2017-08-23 2018-01-19 武汉华星光电半导体显示技术有限公司 Base plate transfer device
CN109250502B (en) * 2018-10-18 2020-08-11 深圳市华星光电半导体显示技术有限公司 Substrate conveying device
JP7204537B2 (en) * 2019-03-05 2023-01-16 キオクシア株式会社 Substrate bonding apparatus and semiconductor device manufacturing method
CN114408572B (en) * 2021-12-20 2024-04-26 江苏长欣车辆装备有限公司 Transfer device that glass production workshop used

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197728A (en) * 2001-12-27 2003-07-11 Aitec:Kk Cassette for storing substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481541B (en) * 2010-08-04 2015-04-21 Daifuku Kk Transport device and transport method for plate-shaped objects

Also Published As

Publication number Publication date
TW200512144A (en) 2005-04-01
KR20050020662A (en) 2005-03-04
CN1600658A (en) 2005-03-30
KR100633848B1 (en) 2006-10-13
CN1600658B (en) 2012-05-09

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Legal Events

Date Code Title Description
MC4A Revocation of granted patent