JP2003142555A - Robot for transferring substrate - Google Patents

Robot for transferring substrate

Info

Publication number
JP2003142555A
JP2003142555A JP2001336363A JP2001336363A JP2003142555A JP 2003142555 A JP2003142555 A JP 2003142555A JP 2001336363 A JP2001336363 A JP 2001336363A JP 2001336363 A JP2001336363 A JP 2001336363A JP 2003142555 A JP2003142555 A JP 2003142555A
Authority
JP
Japan
Prior art keywords
substrate
cassette
glass substrate
transfer robot
suction pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001336363A
Other languages
Japanese (ja)
Other versions
JP4018895B2 (en
Inventor
Hitoshi Kotaki
仁 小瀧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Akita Ltd
Original Assignee
NEC Akita Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Akita Ltd filed Critical NEC Akita Ltd
Priority to JP2001336363A priority Critical patent/JP4018895B2/en
Publication of JP2003142555A publication Critical patent/JP2003142555A/en
Application granted granted Critical
Publication of JP4018895B2 publication Critical patent/JP4018895B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To pull out a glass substrate that is accommodated in a cassette and is warped downward from the cassette without interfering with an upper glass substrate in a robot for transferring a thin and large substrate between cassettes. SOLUTION: A warped glass substrate 30 is set to be in the same warp shape as each of upper and lower substrates by a warp correction mechanism comprising a rod 2a and a thrust-up mechanism 2, the glass substrate 30 is retained by an suction pad 7 at a hand section 1, and the hand section 1 where the glass substrate is placed is pulled out of a shelf 25 in a cassette.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、薄く撓み易い大型
の基板をカセットから引き出したり収納したりする薄い
基板移載用ロボットに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin substrate transfer robot for pulling out and accommodating a large substrate that is thin and flexible.

【0002】[0002]

【従来の技術】近年、液晶あるいはプラズマディスプレ
イなどの表示パネルに使用される基板が大型化になり製
造工程中における基板の運搬および基板の移載について
は、設備の自動化し易いように半導体製造におけるカセ
ットツ−カセット方式が採られていた。しかしながら、
小型で軽い半導体基板であるウェハと違いガラス基板の
ような薄くて大型な基板は、基板の重量を支えるア−ム
の剛性の問題や重い基板の保持方法および撓んだ基板を
隣接する基板とが互いに接触することなくカセットから
如何に引き出すかあるいは如何にカセットに収納したり
するかの問題を解消する移載用ロボットが必要であっ
た。
2. Description of the Related Art In recent years, substrates used for display panels such as liquid crystal or plasma displays have become large in size, and in the transportation of substrates and the transfer of substrates during the manufacturing process, it is easy to automate the equipment in semiconductor manufacturing. The cassette-to-cassette method was adopted. However,
Unlike wafers, which are small and light semiconductor substrates, thin and large substrates, such as glass substrates, have problems with the rigidity of the arm that supports the weight of the substrate, how to hold a heavy substrate, and how to bend a bent substrate to an adjacent substrate. There is a need for a transfer robot that solves the problem of how to pull out from the cassette or how to store the cassettes without contacting each other.

【0003】図4(a)および(b)は従来の一例にお
けるロボットを説明するための図である。図4(b)に
示すように、上流の製造工程より送られて来たカセット
29のそれぞれの棚25にはガラス基板30が収納され
ている。このカセット29から所望の棚25のガラス基
板30を取り出す際に、所望の棚25とその下の棚25
との間にスライド機構24の動作によりハンド部28が
挿入される。そして、上下動機構(図示せず)の動作に
よりハンド部28が稍持ち上げられ、ガラス基板30の
裏面と吸着パッド27と接触しガラス基板30が吸着保
持される。
4A and 4B are views for explaining a robot in a conventional example. As shown in FIG. 4B, the glass substrates 30 are stored in the respective shelves 25 of the cassette 29 sent from the upstream manufacturing process. When taking out the glass substrate 30 of the desired shelf 25 from the cassette 29, the desired shelf 25 and the shelf 25 below it are taken out.
The hand unit 28 is inserted between the above and by the operation of the slide mechanism 24. Then, the hand unit 28 is slightly lifted by the operation of the vertical movement mechanism (not shown), and the back surface of the glass substrate 30 is brought into contact with the suction pad 27, and the glass substrate 30 is suction-held.

【0004】そして、ガラス基板30をカセット29の
棚25より浮かせてから、スライド板22の移動により
ガラス基板30を載せたハンド部28がカセット29か
ら引き出される。そして、このときハンド部28上のガ
ラス基板30が位置ずれをおこさないように、補助吸着
パッド26を働かせガラス基板30の保持をより確実に
する。このように、カセット29から引き出されたガラ
ス基板30は、ロボットの移動により製造設備の移載用
のカセットの前にロボットが停止し、スライド板22の
移動によりカセットにガラス基板30を載せたハンド部
28が挿入され、ガラス基板30は移載用のカセットの
棚に収納された。
Then, after the glass substrate 30 is lifted from the shelf 25 of the cassette 29, the slide plate 22 is moved so that the hand portion 28 on which the glass substrate 30 is placed is pulled out from the cassette 29. Then, at this time, the auxiliary suction pad 26 is operated so that the glass substrate 30 on the hand portion 28 is not displaced, so that the glass substrate 30 is held more reliably. As described above, the glass substrate 30 pulled out of the cassette 29 is stopped by the robot before the cassette for transferring the manufacturing equipment by the movement of the robot, and the hand of the glass substrate 30 placed on the cassette by the movement of the slide plate 22. The portion 28 was inserted, and the glass substrate 30 was stored in the shelf of the cassette for transfer.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上述し
たロボットでは、カセット29に収納されたガラス基板
30は、自重により下方に撓んでいるので、棚25から
ガラス基板30を浮かし、ハンド部28が上昇しガラス
基板30を持ち上げる際に、図4(b)に示すように、
ガラス基板30の両端が下方に垂れ、逆にガラス基板3
0中央部が上に凸に撓み、上の棚25のガラス基板30
の裏面と接触することが多々ある。
However, in the robot described above, the glass substrate 30 housed in the cassette 29 is bent downward by its own weight, so that the glass substrate 30 floats from the shelf 25 and the hand portion 28 rises. When raising the glass substrate 30, as shown in FIG.
Both ends of the glass substrate 30 hang downward, and conversely, the glass substrate 3
0 The central part bends upward and the glass substrate 30 of the upper shelf 25
Often comes in contact with the back of the.

【0006】これによって、カセット29からハンド部
28を引き出すとき、ハンド部28上のガラス基板とそ
の上の棚25のガラス基板が干渉し円滑に引き出せなか
ったり、あるいは、ひきだされるガラス基板30の表面
に形成された膜にキズをつけたりする品質上の問題を引
き起こすことがある。
As a result, when the hand unit 28 is pulled out from the cassette 29, the glass substrate on the hand unit 28 and the glass substrate on the shelf 25 on the hand unit 28 interfere with each other and cannot be pulled out smoothly, or the glass substrate 30 is pulled out. It may cause quality problems such as scratches on the film formed on the surface of the.

【0007】従って、本発明の目的は、基板をその上の
棚の基板に干渉することなく円滑にカセットから引き出
せる基板移載用ロボットを提供することにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a substrate transfer robot which can smoothly withdraw a substrate from a cassette without interfering with the substrate on the shelf above it.

【0008】[0008]

【課題を解決するための手段】本発明の特徴は、複数段
の棚を有するカセットの該棚に収納され自重で下方に撓
む基板を取り出すために前記カセット内に挿入されると
ともに前記基板の撓みを矯正する撓み矯正機構と、前記
カセットに挿入されるとともに該撓みが矯正された前記
基板の中央部の裏面に接触し前記基板を吸着する吸着パ
ッドを具備する基板保持機構と、前記基板を保持した前
記基板保持機構を前記撓み矯正機構を伴って前記カセッ
トから挿入または退出させる基板移動機構と、前記基板
保持機構と前記撓み矯正機構と前記基板移動機構とを上
下動させる上下動機構とを備える基板用移載ロボットで
ある。
A feature of the present invention is that a cassette having a plurality of shelves is inserted into the cassette to take out a substrate stored in the cassette and bent downward by its own weight. A bending correction mechanism for correcting the bending; a substrate holding mechanism having a suction pad that is inserted into the cassette and that contacts the back surface of the central portion of the substrate where the bending is corrected and sucks the substrate; A substrate moving mechanism that inserts or withdraws the held substrate holding mechanism from the cassette together with the bending correction mechanism, and a vertical movement mechanism that moves the substrate holding mechanism, the bending correction mechanism, and the substrate moving mechanism up and down. It is a substrate transfer robot provided.

【0009】また、前記吸着パッドの外側に配置され前
記基板の裏面を吸着保持する補助吸着パッドを備えるこ
とが望ましい。一方、前記撓み矯正機構は、前記補助吸
着パッドの外側に配置され前記基板の裏面と接触する一
対の棒部材と、前記一対の棒部材を突き上げる突き上げ
機構とを備えることが望ましい。
Further, it is desirable to provide an auxiliary suction pad which is disposed outside the suction pad and suction-holds the back surface of the substrate. On the other hand, it is preferable that the bending correction mechanism includes a pair of rod members arranged outside the auxiliary suction pad and in contact with the back surface of the substrate, and a push-up mechanism that pushes up the pair of rod members.

【0010】そして、好ましくは、前記基板保持機構と
前記撓み矯正機構と前記基板移動機構とを含む機構全体
を回転させる回転機構を備えることである。また、前記
棒部材と前記基板の裏面とはリング状部材を介して接触
することが望ましい。さらに、前記リング状部材は、ポ
リテトラフルオロエチレンで製作されていることが望ま
しい。
Preferably, a rotation mechanism for rotating the entire mechanism including the substrate holding mechanism, the bending correction mechanism and the substrate moving mechanism is provided. Further, it is desirable that the rod member and the back surface of the substrate contact each other through a ring-shaped member. Further, it is desirable that the ring-shaped member is made of polytetrafluoroethylene.

【0011】[0011]

【発明の実施の形態】次に、本発明について図面を参照
して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

【0012】図1(a)〜(c)は本発明の一実施の形
態における基板移載用ロボットを説明するための上面図
およびAA断面図並びにBB矢視図である。この基板移
載用ロボットは、図1に示すように、棚25に収納され
自重で下方に撓むガラス基板30を取り出すためにカセ
ットに挿入されるとともにガラス基板30の撓みを矯正
するロッド2aを含む撓み矯正機構を備えている。
1 (a) to 1 (c) are a top view, an AA sectional view and a BB arrow view for explaining a substrate transfer robot according to an embodiment of the present invention. As shown in FIG. 1, this substrate transfer robot has a rod 2a that is inserted into a cassette to take out a glass substrate 30 that is housed in a shelf 25 and is bent downward by its own weight, and that corrects the bending of the glass substrate 30. It is equipped with a bending correction mechanism including.

【0013】この撓み矯正機構は、ガラス基板30の中
央部が下に凸に撓わませるように支点となるガラス基板
30の裏面と接触する一対のロッド2aと、この一対の
ロッド2aを突き上げて撓んだガラス基板30の中央部
が下に凸に撓ませるように矯正する突き上げ機構2とを
備えている。また、ガラス基板30にきずをつけないよ
うに、ロッド2aとガラス基板30と接触する部分に摩
擦の小さいポリテトラフルオロエチレン製のスリ−ブ3
を設けることが望ましい。
In this bending correction mechanism, a pair of rods 2a that come into contact with the back surface of the glass substrate 30 that serves as a fulcrum so that the center portion of the glass substrate 30 is bent downwardly are pushed up, and the pair of rods 2a are pushed up. The push-up mechanism 2 is provided to correct the center portion of the bent glass substrate 30 so that the center portion of the bent glass substrate 30 is bent downward. Further, in order to prevent the glass substrate 30 from being scratched, a sleeve 3 made of polytetrafluoroethylene having a small friction is provided at a portion in contact with the rod 2a and the glass substrate 30.
Is desirable.

【0014】さらに、この突き上げ機構2は、図1
(c)に示すように、軸9を上下動させるエアシリンダ
4と、一端にロッド2aが取付けられ固定される支点軸
5を中心にして旋回するリンク10とで構成されてい
る。そして、この突き上げ機構2は、リンク10が旋回
させロッド2aを突き上げるので、単純に上方に突き上
げる方式よりは、ガラス基板30を効率的に矯正できる
利点がある。
Further, the push-up mechanism 2 is shown in FIG.
As shown in (c), it is composed of an air cylinder 4 that moves the shaft 9 up and down, and a link 10 that revolves around a fulcrum shaft 5 to which a rod 2a is attached and fixed at one end. The push-up mechanism 2 has the advantage that the glass substrate 30 can be efficiently corrected as compared with the simple upward push-up method because the link 10 turns to push up the rod 2a.

【0015】図2(a)および(b)はカセット内にお
けるロッドとハンド部の動作を説明するための図であ
る。まず、図2(a)に示すように、図1(c)の突き
上げ機構2を動作しない状態で、ハンド部1およびロッ
ド2aをカセット29の棚と棚との間に挿入する。次
に、図2(b)に示すように、上下動機構(図示せず)
によりロッド2aを含むハンド部1全体を上昇させ吸着
パッド7をガラス基板30の裏面と接触させ吸着パッド
7でガラス基板30を吸着保持する。
2 (a) and 2 (b) are views for explaining the operation of the rod and the hand portion in the cassette. First, as shown in FIG. 2A, the hand unit 1 and the rod 2a are inserted between the shelves of the cassette 29 with the push-up mechanism 2 of FIG. 1C not operating. Next, as shown in FIG. 2B, a vertical movement mechanism (not shown)
Thus, the entire hand unit 1 including the rod 2a is lifted to bring the suction pad 7 into contact with the back surface of the glass substrate 30, and the suction pad 7 holds the glass substrate 30 by suction.

【0016】次に、図1(c)の突き上げ機構2のエア
シリンダ4により軸9を下降させロッド2aを2点鎖線
で示すように突き上げ、下方に撓むガラス基板30の両
端の撓みを矯正する。このことによりガラス基板30の
両端を上に反らせガラス基板30が上下の基板とほぼ同
じ撓み形状になる。そして、上下機構(図示せず)を僅
かに上昇させ棚25よりガラス基板30を浮かせ、ガラ
ス基板を棚25より引き離す。このとき上のガラス基板
30と下のガラス基板との隙間C1およびC2がガラス
基板30とハンド部1が抜き出すのに十分な隙間がある
ので、ガラス基板30を載せたハンド部1をカセット2
9から引き出す。
Next, the shaft 9 is lowered by the air cylinder 4 of the pushing-up mechanism 2 shown in FIG. 1C to push up the rod 2a as shown by the chain double-dashed line, and the bending of both ends of the glass substrate 30 which bends downward is corrected. To do. As a result, both ends of the glass substrate 30 are bent upward, so that the glass substrate 30 has substantially the same bending shape as the upper and lower substrates. Then, the vertical mechanism (not shown) is slightly raised to float the glass substrate 30 from the shelf 25, and the glass substrate is separated from the shelf 25. At this time, the gaps C1 and C2 between the upper glass substrate 30 and the lower glass substrate are sufficient to allow the glass substrate 30 and the hand portion 1 to be pulled out, so that the hand portion 1 on which the glass substrate 30 is placed is placed in the cassette 2
Pull out from 9.

【0017】そして、抜き出された状態で、突き上げ機
構2を解除し、ロッド2aとハンド部1とは水平状態に
し、補助吸着パッド8と接触させ、ガラス基板30が位
置ずれが起きないようにガラス基板30の保持をより確
実にする。
Then, in the pulled-out state, the push-up mechanism 2 is released so that the rod 2a and the hand portion 1 are in a horizontal state and brought into contact with the auxiliary suction pad 8 so that the glass substrate 30 is not displaced. The glass substrate 30 is held more reliably.

【0018】そして、スライド板6を移動させ、ガラス
基板30を載せたハンド部1をロッド2aを含む撓み矯
正機構を伴ってカセット29から引き出される。
Then, the slide plate 6 is moved, and the hand portion 1 on which the glass substrate 30 is placed is pulled out from the cassette 29 together with the bending correction mechanism including the rod 2a.

【0019】図3は図1の基板移載用ロボットがカセッ
トから引き出されたガラス基板を製造設備の移載用カセ
ットに収納する動作を説明するための平面図である。ま
た、この基板移載用ロボットは、図3に示すように、ハ
ンド部1と連結するスライド板6を撓み矯正機構を伴っ
て移動させるスライド機構11と、スライド機構11を
回転させハンド部1の方向を設定する回転機構12と、
スライド機構11および回転機構を含む機構全体を上下
動させる上下動機構13とを備えている。
FIG. 3 is a plan view for explaining the operation in which the substrate transfer robot of FIG. 1 stores the glass substrate pulled out from the cassette in the transfer cassette of the manufacturing facility. In addition, as shown in FIG. 3, the substrate transfer robot includes a slide mechanism 11 that moves a slide plate 6 that is connected to the hand unit 1 with a bending correction mechanism, and a slide mechanism 11 that rotates the slide mechanism 11 to move the hand unit 1. A rotating mechanism 12 for setting the direction,
A vertical movement mechanism 13 for vertically moving the entire mechanism including the slide mechanism 11 and the rotation mechanism is provided.

【0020】まず、カセットから引き出されたガラス基
板30を載せたハンド部1は、スライド機構11により
ロボット本体の手元まで移動させられる。次に、製造設
備のカセット29aの位置及び向きをメモリより抽出し
制御部(図示せず)の指令により回転機構12が動作
し、スライド機構11を含むハンド部1が、例えば、90
度旋回し、ハンド部1の向きを移載用のカセットに合わ
せる。
First, the hand unit 1 on which the glass substrate 30 pulled out from the cassette is placed is moved to the hand of the robot body by the slide mechanism 11. Next, the position and orientation of the cassette 29a of the manufacturing equipment are extracted from the memory, the rotation mechanism 12 operates according to a command from a control unit (not shown), and the hand unit 1 including the slide mechanism 11 moves, for example,
The hand unit 1 is rotated once to match the orientation of the hand unit 1 with the cassette for transfer.

【0021】次に、カセット29aのどの棚に収納する
かメモリから読みとり、制御部を介して上下機構13に
指令する。上下動機構13は、移載すべきカセット29
aの棚とその上の棚の間にハンド部1が挿入できるよう
に高さ調整する。そして、2点鎖線で示すように、スラ
イド機構24の動作によりハンド部が伸びカセット29
aに挿入される。そして、上下動機構13が下降しガラ
ス基板30が所望の棚に載置される。下降によってガラ
ス基板30から解放されたハンド部1は、スライド機構
11によりロボット本体の手元に戻され、回転機構12
によりハンド部1は逆回転し元の位置に戻る。
Next, which shelf of the cassette 29a is to be stored is read from the memory, and the vertical mechanism 13 is instructed via the control unit. The vertical movement mechanism 13 includes a cassette 29 to be transferred.
The height is adjusted so that the hand unit 1 can be inserted between the shelf a and the shelf above it. Then, as indicated by the chain double-dashed line, the hand portion is extended by the operation of the slide mechanism 24 and the cassette 29
inserted in a. Then, the vertical movement mechanism 13 descends and the glass substrate 30 is placed on a desired shelf. The hand unit 1 released from the glass substrate 30 by descending is returned to the hand of the robot body by the slide mechanism 11, and is rotated by the rotating mechanism 12.
As a result, the hand unit 1 rotates in the reverse direction and returns to the original position.

【0022】そして、再び、図1で説明したように、ス
ライド機構11によりハンド部1が伸びカセットに進入
し前述したように、ガラス基板30を載せカセットから
引き出し、移載用のカセットの棚に収納する。このよう
な動作を繰り返して行い、上流工程から運び込まれたカ
セット29のガラス基板30の全てを製造設備の移載用
カセット29aに収納する。
Then, again, as described with reference to FIG. 1, the hand mechanism 1 is extended by the slide mechanism 11 to enter the cassette, and as described above, the glass substrate 30 is pulled out from the cassette and placed on the shelf of the cassette for transfer. Store. By repeating this operation, all the glass substrates 30 of the cassette 29 carried in from the upstream process are stored in the transfer cassette 29a of the manufacturing equipment.

【0023】一方、製造設備で処理され移載用のカセッ
ト29aから、空のカセット29にガラス基板30を収
納する場合も、図2で説明したように、移載用のカセッ
トから一枚づつガラス基板30を引き出し、図3で説明
したように、空のカセット29にガラス基板30を収納
すればよい。
On the other hand, even when the glass substrates 30 are stored in the empty cassette 29 from the transfer cassette 29a processed in the manufacturing facility, one glass is transferred from the transfer cassette as described with reference to FIG. The substrate 30 may be pulled out and the glass substrate 30 may be stored in the empty cassette 29 as described with reference to FIG.

【0024】[0024]

【発明の効果】以上説明したように本発明は、カセット
に収納された基板が撓んでも、この撓みを矯正する手段
を設けることにより、上下の棚に載置された基板に干渉
されることなく基板をカセットから引き出すことがで
き、薄く大型の基板でも円滑に移載できるとい効果があ
る。
As described above, according to the present invention, even if the substrate accommodated in the cassette bends, the substrate placed on the upper and lower shelves is interfered with by providing the means for correcting the deflection. The advantage is that the substrate can be pulled out from the cassette without any problem, and even thin and large substrates can be transferred smoothly.

【0025】また、基板どうしの接触が無くなることに
より、表面に形成された膜の損傷を起こすことが無いの
で、品質歩留まりの向上が図れるという効果もある。
Further, since there is no contact between the substrates, the film formed on the surface is not damaged, and there is an effect that the quality yield can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態における基板移載用ロボ
ットを説明するための上面図およびAA断面図並びにB
B矢視図である。
FIG. 1 is a top view, an AA sectional view, and B for explaining a substrate transfer robot according to an embodiment of the present invention.
FIG.

【図2】カセット内におけるロッドとハンド部の動作を
説明するための図である。
FIG. 2 is a diagram for explaining the operation of a rod and a hand portion in a cassette.

【図3】図1の基板移載用ロボットがカセットから引き
出されたガラス基板を製造設備の移載用カセットに収納
する動作を説明するための平面図である。
FIG. 3 is a plan view for explaining the operation of the substrate transfer robot of FIG. 1 for storing the glass substrate pulled out from the cassette in the transfer cassette of the manufacturing facility.

【図4】従来の一例におけるロボットを説明するための
図である。
FIG. 4 is a diagram for explaining a robot in a conventional example.

【符号の説明】[Explanation of symbols]

1,28 ハンド部 2a ロッド 2 突き上げ機構 3 スリ−ブ 4 エアシリンダ 5 支点軸 6 スライド板 7 吸着パッド 8 補助吸着パッド 9 軸 10 リンク 11 スライド機構 12 回転機構 13 上下動機構 29,29a カセット 30 ガラス基板 1,28 Hand part 2a rod 2 Push-up mechanism 3 sleeves 4 Air cylinder 5 fulcrum axis 6 slide plate 7 Adsorption pad 8 Auxiliary suction pad 9 axes 10 links 11 Slide mechanism 12 rotation mechanism 13 Vertical movement mechanism 29,29a cassette 30 glass substrate

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C007 AS03 CT04 CT05 CU02 DS03 ES17 FS01 FU00 FU02 NS12 3F022 AA08 CC02 EE05 KK10 KK20 5F031 CA05 DA01 FA02 FA07 FA11 GA08 GA32 GA35 GA47 GA48 GA49 PA13    ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3C007 AS03 CT04 CT05 CU02 DS03                       ES17 FS01 FU00 FU02 NS12                 3F022 AA08 CC02 EE05 KK10 KK20                 5F031 CA05 DA01 FA02 FA07 FA11                       GA08 GA32 GA35 GA47 GA48                       GA49 PA13

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 複数段の棚を有するカセットの該棚に収
納され自重で下方に撓む基板を取り出すために前記カセ
ット内に挿入されるとともに前記基板の撓みを矯正する
撓み矯正機構と、前記カセットに挿入されるとともに該
撓みが矯正された前記基板の中央部の裏面に接触し前記
基板を吸着する吸着パッドを具備する基板保持機構と、
前記基板を保持した前記基板保持機構を前記撓み矯正機
構を伴って前記カセットから挿入または退出させる基板
移動機構と、前記基板保持機構と前記撓み矯正機構と前
記基板移動機構とを上下動させる上下動機構とを備える
ことを特徴とする基板用移載ロボット。
1. A bending correction mechanism which is inserted into the cassette to take out a substrate which is housed in the cassette having a plurality of shelves and which is bent downward by its own weight, and which corrects the bending of the substrate, A substrate holding mechanism including a suction pad that is inserted into a cassette and that contacts the back surface of the central portion of the substrate whose deflection has been corrected and sucks the substrate,
A substrate moving mechanism that inserts or withdraws the substrate holding mechanism holding the substrate from the cassette together with the bending correction mechanism, and a vertical movement that moves the substrate holding mechanism, the bending correction mechanism, and the substrate moving mechanism up and down. A substrate transfer robot comprising a mechanism.
【請求項2】 前記吸着パッドの外側に配置され前記基
板の裏面を吸着保持する補助吸着パッドを備えることを
特徴とする請求項1記載の基板移載用ロボット。
2. The substrate transfer robot according to claim 1, further comprising an auxiliary suction pad which is disposed outside the suction pad and suction-holds the back surface of the substrate.
【請求項3】 前記撓み矯正機構は、前記補助吸着パッ
ドの外側に配置され前記基板の裏面と接触する一対の棒
部材と、前記一対の棒部材を突き上げる突き上げ機構と
を備えることを特徴とする請求項1または請求項2記載
の基板移載用ロボット。
3. The bending correction mechanism includes a pair of bar members arranged outside the auxiliary suction pad and in contact with the back surface of the substrate, and a push-up mechanism for pushing up the pair of bar members. The substrate transfer robot according to claim 1 or 2.
【請求項4】 前記基板保持機構と前記撓み矯正機構と
前記基板移動機構とを含む機構全体を回転させる回転機
構を備えることを特徴とする請求項1、請求項2または
請求項3記載の基板移載用ロボット。
4. The substrate according to claim 1, further comprising a rotating mechanism that rotates the entire mechanism including the substrate holding mechanism, the bending correction mechanism, and the substrate moving mechanism. Transfer robot.
【請求項5】 前記棒部材と前記基板の裏面とはリング
状部材を介して接触することを特徴とする請求項1、請
求項2、請求項3または請求項4記載の基板移載用ロボ
ット。
5. The substrate transfer robot according to claim 1, wherein the rod member and the back surface of the substrate are in contact with each other via a ring-shaped member. .
【請求項6】 前記リング状部材は、ポリテトラフルオ
ロエチレンで製作されていることを特徴とする請求項5
記載の基板移載用ロボット。
6. The ring-shaped member is made of polytetrafluoroethylene.
The substrate transfer robot described.
JP2001336363A 2001-11-01 2001-11-01 Substrate transfer robot and substrate transfer method Expired - Fee Related JP4018895B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001336363A JP4018895B2 (en) 2001-11-01 2001-11-01 Substrate transfer robot and substrate transfer method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001336363A JP4018895B2 (en) 2001-11-01 2001-11-01 Substrate transfer robot and substrate transfer method

Publications (2)

Publication Number Publication Date
JP2003142555A true JP2003142555A (en) 2003-05-16
JP4018895B2 JP4018895B2 (en) 2007-12-05

Family

ID=19151204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001336363A Expired - Fee Related JP4018895B2 (en) 2001-11-01 2001-11-01 Substrate transfer robot and substrate transfer method

Country Status (1)

Country Link
JP (1) JP4018895B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277613A (en) * 2007-05-01 2008-11-13 Ihi Corp Substrate handling device, method of loading substrate, and method of taking out substrate
JP2010232465A (en) * 2009-03-27 2010-10-14 Sharp Corp Method of transferring substrate
JP2011173732A (en) * 2011-04-25 2011-09-08 Ihi Corp Substrate mounting method and substrate take-out method
JP2019042822A (en) * 2017-08-30 2019-03-22 Towa株式会社 Suction mechanism, suction hand, conveyance mechanism, resin molding apparatus, conveyance method and method for manufacturing resin molding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277613A (en) * 2007-05-01 2008-11-13 Ihi Corp Substrate handling device, method of loading substrate, and method of taking out substrate
JP2010232465A (en) * 2009-03-27 2010-10-14 Sharp Corp Method of transferring substrate
JP2011173732A (en) * 2011-04-25 2011-09-08 Ihi Corp Substrate mounting method and substrate take-out method
JP2019042822A (en) * 2017-08-30 2019-03-22 Towa株式会社 Suction mechanism, suction hand, conveyance mechanism, resin molding apparatus, conveyance method and method for manufacturing resin molding

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