JP4874244B2 - Ｐｔｃ厚膜電気回路制御の電熱素子 - Google Patents

Ｐｔｃ厚膜電気回路制御の電熱素子 Download PDF

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Publication number
JP4874244B2
JP4874244B2 JP2007522901A JP2007522901A JP4874244B2 JP 4874244 B2 JP4874244 B2 JP 4874244B2 JP 2007522901 A JP2007522901 A JP 2007522901A JP 2007522901 A JP2007522901 A JP 2007522901A JP 4874244 B2 JP4874244 B2 JP 4874244B2
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Japan
Prior art keywords
paste
series
ptc
thick film
phase
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Expired - Fee Related
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JP2007522901A
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Japanese (ja)
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JP2008508664A5 (enExample
JP2008508664A (ja
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克政 王
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
JP2007522901A 2004-07-28 2005-07-15 Ｐｔｃ厚膜電気回路制御の電熱素子 Expired - Fee Related JP4874244B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200410050830.1 2004-07-28
CNB2004100508301A CN100386829C (zh) 2004-07-28 2004-07-28 Ptc厚膜电路可控电热元件
PCT/CN2005/001052 WO2006010317A1 (en) 2004-07-28 2005-07-15 Controllable electrothermal element of ptc thick film circuit

Publications (3)

Publication Number Publication Date
JP2008508664A JP2008508664A (ja) 2008-03-21
JP2008508664A5 JP2008508664A5 (enExample) 2011-09-15
JP4874244B2 true JP4874244B2 (ja) 2012-02-15

Family

ID=34602285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007522901A Expired - Fee Related JP4874244B2 (ja) 2004-07-28 2005-07-15 Ｐｔｃ厚膜電気回路制御の電熱素子

Country Status (5)

Country Link
US (1) US7800028B2 (enExample)
EP (1) EP1791396B1 (enExample)
JP (1) JP4874244B2 (enExample)
CN (1) CN100386829C (enExample)
WO (1) WO2006010317A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4753642B2 (ja) * 2005-07-04 2011-08-24 株式会社リコー 電子部品実装体の製造方法
CN100499942C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺
CN100499941C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土介质浆料及其制备工艺
CN1937856B (zh) * 2006-07-28 2010-12-15 王克政 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺
CN100499940C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺
DE102006041054A1 (de) * 2006-09-01 2008-04-03 Epcos Ag Heizelement
CN201100690Y (zh) * 2007-02-02 2008-08-13 盛光润 一种电膜炉
FR2951348B1 (fr) * 2009-10-12 2012-02-03 Tornier Sa Element chauffant et appareil chirurgical le mettant en oeuvre
CN102685942B (zh) * 2012-05-29 2014-05-07 王克政 一种ptc稀土厚膜电路智能电热元件及其制备方法
DE102014110164B4 (de) * 2014-05-02 2022-11-03 Borgwarner Ludwigsburg Gmbh Verfahren zum Herstellen eines Heizstabs
US10727537B2 (en) * 2014-09-02 2020-07-28 G6 Materials Corp. Electrochemical devices comprising nanoscopic carbon materials made by additive manufacturing
CN104318979A (zh) * 2014-09-19 2015-01-28 王晨 复合材料基厚膜电路稀土介质浆料及其制备工艺
CN104827857B (zh) * 2015-04-03 2017-11-07 佛山市海辰科技有限公司 PTCR‑xthm电热芯片为热源的电动汽车智能暖气机系统
KR102248618B1 (ko) * 2016-06-27 2021-05-04 니뽄 다바코 산교 가부시키가이샤 에어로졸 흡인기용 카트리지 및 그것을 구비하는 에어로졸 흡인기, 및 에어로졸 흡인기용 발열 시트
CN107446408A (zh) * 2017-07-18 2017-12-08 德阳烯碳科技有限公司 Ptc石墨烯发热油墨及其制备方法、及其制备的发热膜
US11376811B2 (en) 2018-07-03 2022-07-05 Goodrich Corporation Impact and knife cut resistant pre-impregnated woven fabric for aircraft heated floor panels
US10875623B2 (en) 2018-07-03 2020-12-29 Goodrich Corporation High temperature thermoplastic pre-impregnated structure for aircraft heated floor panel
US11499724B2 (en) 2018-07-03 2022-11-15 Goodrich Corporation Heated floor panels
US11273897B2 (en) 2018-07-03 2022-03-15 Goodrich Corporation Asymmetric surface layer for floor panels
US10920994B2 (en) 2018-07-03 2021-02-16 Goodrich Corporation Heated floor panels
US10899427B2 (en) 2018-07-03 2021-01-26 Goodrich Corporation Heated floor panel with impact layer
CN109650933B (zh) * 2019-01-28 2021-03-30 陕西科技大学 一种多孔Co3O4/Al2SiO5低密度吸波型复相陶瓷及其制备方法
CN111761788A (zh) * 2019-04-02 2020-10-13 厦门市同骏电子有限公司 一种注塑压塑加热模块设备及生产工艺
CN111981674A (zh) * 2019-05-22 2020-11-24 帅和节能电器科技(上海)有限公司 云控物联网即热式热水器
US11903101B2 (en) 2019-12-13 2024-02-13 Goodrich Corporation Internal heating trace assembly
CN114126112A (zh) * 2021-11-23 2022-03-01 浙江波仕科技有限公司 一种高分子电热膜电极及其生产工艺

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794260A (ja) * 1993-07-30 1995-04-07 Toshiba Lighting & Technol Corp ヒータおよび定着装置
JPH07140022A (ja) * 1993-11-16 1995-06-02 Matsushita Electric Ind Co Ltd 抵抗素子用ペースト、抵抗素子および力学量センサ
JPH07297008A (ja) * 1994-03-04 1995-11-10 Komatsu Ltd 正特性サーミスタおよびこれを用いたサーミスタ装置
JPH0936304A (ja) * 1995-07-11 1997-02-07 Spectrol Electron Corp 厚膜回路素子
JP2003168619A (ja) * 2001-09-20 2003-06-13 Murata Mfg Co Ltd 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品
JP2003264120A (ja) * 2002-03-07 2003-09-19 Tdk Corp セラミック電子部品及びその製造方法
JP2003528436A (ja) * 2000-03-16 2003-09-24 ザ ジレット カンパニー リチウム電池
US6723420B2 (en) * 2001-04-09 2004-04-20 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamond substrates
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03246901A (ja) * 1990-02-23 1991-11-05 Hitachi Ltd 厚膜抵抗組成物、該組成物を用いたハイブリッドｉｃおよびその製法
EP0569983B1 (en) * 1992-05-15 1998-08-05 Denso Corporation Positive-temperature-coefficient thermistor heating device and process for production of the same
CN1143425A (zh) * 1994-03-04 1997-02-19 株式会社小松 正特性热敏电阻及采用它的热敏电阻装置
JP3927250B2 (ja) * 1995-08-16 2007-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 窒化アルミニウム基板用厚膜導体ペースト組成物
CN1202511A (zh) * 1998-06-02 1998-12-23 武汉景辉科技发展有限公司 厚膜高温发热材料
US6780494B2 (en) * 2002-03-07 2004-08-24 Tdk Corporation Ceramic electronic device and method of production of same
CN1273560C (zh) * 2003-09-01 2006-09-06 王培英 半导瓷厚膜发热材料

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794260A (ja) * 1993-07-30 1995-04-07 Toshiba Lighting & Technol Corp ヒータおよび定着装置
JPH07140022A (ja) * 1993-11-16 1995-06-02 Matsushita Electric Ind Co Ltd 抵抗素子用ペースト、抵抗素子および力学量センサ
JPH07297008A (ja) * 1994-03-04 1995-11-10 Komatsu Ltd 正特性サーミスタおよびこれを用いたサーミスタ装置
JPH0936304A (ja) * 1995-07-11 1997-02-07 Spectrol Electron Corp 厚膜回路素子
JP2003528436A (ja) * 2000-03-16 2003-09-24 ザ ジレット カンパニー リチウム電池
US6723420B2 (en) * 2001-04-09 2004-04-20 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamond substrates
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
JP2003168619A (ja) * 2001-09-20 2003-06-13 Murata Mfg Co Ltd 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品
JP2003264120A (ja) * 2002-03-07 2003-09-19 Tdk Corp セラミック電子部品及びその製造方法

Also Published As

Publication number Publication date
EP1791396A4 (en) 2010-07-28
EP1791396A1 (en) 2007-05-30
US7800028B2 (en) 2010-09-21
EP1791396B1 (en) 2017-09-06
US20090283511A1 (en) 2009-11-19
JP2008508664A (ja) 2008-03-21
CN100386829C (zh) 2008-05-07
WO2006010317A1 (en) 2006-02-02
CN1588573A (zh) 2005-03-02

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