CN102685942B - 一种ptc稀土厚膜电路智能电热元件及其制备方法 - Google Patents
一种ptc稀土厚膜电路智能电热元件及其制备方法 Download PDFInfo
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- CN102685942B CN102685942B CN201210170105.2A CN201210170105A CN102685942B CN 102685942 B CN102685942 B CN 102685942B CN 201210170105 A CN201210170105 A CN 201210170105A CN 102685942 B CN102685942 B CN 102685942B
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- 229910003451 terbium oxide Inorganic materials 0.000 description 7
- SCRZPWWVSXWCMC-UHFFFAOYSA-N terbium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Tb+3].[Tb+3] SCRZPWWVSXWCMC-UHFFFAOYSA-N 0.000 description 7
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- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/02—Heaters using heating elements having a positive temperature coefficient
Landscapes
- Thermistors And Varistors (AREA)
Abstract
Description
流变特性 | 热敏电阻膜厚度 | 浆料粘度 | 单位用量 |
触变宜网印 | >15μm | 168±20Pas/10RPM | 80cm2/克 |
颜色(选) | 固体含量 | 丝网数目 | 浆料粘度 | 烧结温度 |
蓝(灰、黑)色 | 77% | 180 | 125PaS/RPM | 870℃ |
泄漏电流 | 绝缘电阻 | 击穿强度 |
<5mA(250VDC) | >50MΩ(500VDC) | >1800VAC |
方阻 | 分辨率 | 抗拉强度 | 老化强度 |
<3±2mΩ/□ | 0.1mm | >16(N/mm2) | 10(N/mm2) |
流变特性 | 电极层厚度 | 浆料粘度 | 单位用量 |
触变 宜网印 | >12μm | 186PaS/RPM。 | 88cm2/克 |
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201210170105.2A CN102685942B (zh) | 2012-05-29 | 2012-05-29 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
PCT/CN2012/077518 WO2013177838A1 (zh) | 2012-05-29 | 2012-06-26 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
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CN201210170105.2A CN102685942B (zh) | 2012-05-29 | 2012-05-29 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
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CN102685942A CN102685942A (zh) | 2012-09-19 |
CN102685942B true CN102685942B (zh) | 2014-05-07 |
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CN201210170105.2A Active CN102685942B (zh) | 2012-05-29 | 2012-05-29 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
Country Status (2)
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CN (1) | CN102685942B (zh) |
WO (1) | WO2013177838A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102946652A (zh) * | 2012-10-31 | 2013-02-27 | 宁波市万泓电器科技有限公司 | 带发热膜的加热管及其制造工艺 |
CN103415092B (zh) * | 2013-07-11 | 2015-09-16 | 九阳股份有限公司 | 一种厚膜加热装置的加工方法、厚膜加热容器和设备 |
CN104916345B (zh) * | 2015-05-25 | 2017-06-13 | 电子科技大学 | 一种厚膜电阻浆料及其制备方法 |
KR101762159B1 (ko) * | 2016-02-24 | 2017-08-04 | 엘지전자 주식회사 | 면상 발열장치, 이를 포함하는하는 전기 레인지 및 그 제조방법 |
CN105741903B (zh) * | 2016-05-06 | 2017-04-05 | 西安电子科技大学 | 一种银掺杂改性二氧化钌厚膜电阻浆料的制备方法 |
CN106098140A (zh) * | 2016-05-23 | 2016-11-09 | 东莞珂洛赫慕电子材料科技有限公司 | 一种基于不锈钢基材的ptc热敏电阻浆料及其制备方法 |
CN106060979A (zh) * | 2016-07-01 | 2016-10-26 | 新乡市杰达精密电子器件有限公司 | 钌或钌的化合物在制备厚膜加热元件中的应用和含有该物质的厚膜加热元件及其电阻浆料 |
CN106131982A (zh) * | 2016-07-08 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | 一种高温大功率稀土电阻浆料及其制备方法 |
CN106653151A (zh) * | 2017-01-12 | 2017-05-10 | 东莞珂洛赫慕电子材料科技有限公司 | 一种高温红外调频介质浆料及其制备方法 |
CN110762595A (zh) * | 2018-07-26 | 2020-02-07 | 河北华安天泰防爆科技有限公司 | 一种取暖器 |
KR102056084B1 (ko) * | 2018-08-21 | 2019-12-16 | 엘지전자 주식회사 | 전기 히터 |
KR102177948B1 (ko) | 2018-10-16 | 2020-11-12 | 엘지전자 주식회사 | 전기 히터 |
CN109862632A (zh) * | 2019-01-24 | 2019-06-07 | 广西桂仪科技有限公司 | 一种新能源汽车热管理的平板厚膜加热器及其制备工艺 |
CN110044509A (zh) * | 2019-04-30 | 2019-07-23 | 东莞珂洛赫慕电子材料科技有限公司 | 一种实现厚膜发热体表面温度全面监测的方法 |
CN116471715B (zh) * | 2023-06-20 | 2024-05-28 | 宜兴市美盛微电子科技有限公司 | 热敏电阻发热片及其制备方法 |
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JPH04106893A (ja) * | 1990-08-24 | 1992-04-08 | Brother Ind Ltd | Ptc面状発熱体の製造方法 |
CN100386829C (zh) * | 2004-07-28 | 2008-05-07 | 王克政 | Ptc厚膜电路可控电热元件 |
CN100499940C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
CN100499941C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土介质浆料及其制备工艺 |
CN1937856B (zh) * | 2006-07-28 | 2010-12-15 | 王克政 | 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 |
CN100499942C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺 |
CN101038797A (zh) * | 2007-04-23 | 2007-09-19 | 吴胜红 | 不锈钢基板的大功率厚膜电路电阻浆料及其制备方法 |
CN201114812Y (zh) * | 2007-07-06 | 2008-09-10 | 珠海粤科京华电子陶瓷有限公司 | 一种自控温金属陶瓷发热元件 |
CN101106842B (zh) * | 2007-07-24 | 2011-12-21 | 王晨 | 基于微晶玻璃基板的厚膜电路电热元件及其制备工艺 |
CN101321415B (zh) * | 2008-07-14 | 2011-12-21 | 佛山市海辰科技有限公司 | 基于氮化铝微晶陶瓷基板的稀土厚膜电路电热元件及其制备工艺 |
CN202143228U (zh) * | 2011-04-29 | 2012-02-08 | 陈才良 | 一种复合电热体 |
CN202085325U (zh) * | 2011-05-06 | 2011-12-21 | 陈小蕾 | 高温铝合金基稀土厚膜电路电热元件 |
CN102158993B (zh) * | 2011-05-06 | 2013-05-01 | 陈小蕾 | 高温铝合金基稀土厚膜电路电热元件及其制备技术 |
CN102340900A (zh) * | 2011-07-21 | 2012-02-01 | 佛山市海辰科技有限公司 | 基于ir-led陶瓷基板的稀土厚膜电路电热元件及其制备方法 |
CN202679662U (zh) * | 2012-05-29 | 2013-01-16 | 王克政 | 一种ptc稀土厚膜电路智能电热元件 |
-
2012
- 2012-05-29 CN CN201210170105.2A patent/CN102685942B/zh active Active
- 2012-06-26 WO PCT/CN2012/077518 patent/WO2013177838A1/zh active Application Filing
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CN102685942A (zh) | 2012-09-19 |
WO2013177838A1 (zh) | 2013-12-05 |
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