CN102568704B - 一种环保型无铅半导体陶瓷电容电极银浆及其制备方法 - Google Patents
一种环保型无铅半导体陶瓷电容电极银浆及其制备方法 Download PDFInfo
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Abstract
Description
序号 | 本发明制得银浆 | 国内公司1生产银浆 | 国内公司2生产银浆 |
1 | 2.8 | 2.1 | 2.3 |
2 | 3.0 | 1.9 | 2.6 |
3 | 3.1 | 2.5 | 2.4 |
Claims (7)
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CN201210071280.6A CN102568704B (zh) | 2012-03-16 | 2012-03-16 | 一种环保型无铅半导体陶瓷电容电极银浆及其制备方法 |
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CN102568704B true CN102568704B (zh) | 2015-01-21 |
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Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103390443A (zh) * | 2013-06-25 | 2013-11-13 | 彩虹集团电子股份有限公司 | 一种用于半导体陶瓷电容的无铅电极银浆料及其制备方法 |
CN103606419B (zh) * | 2013-10-26 | 2016-01-06 | 溧阳市东大技术转移中心有限公司 | 无铅银导体浆料的制备方法 |
CN103545012B (zh) * | 2013-11-11 | 2016-04-27 | 广东风华高新科技股份有限公司 | 滤波器用导电银浆及其制备方法 |
CN104078099A (zh) * | 2014-06-04 | 2014-10-01 | 乐凯特科技铜陵有限公司 | 一种环保pcb电路板导电银浆及其制备方法 |
CN104143376A (zh) * | 2014-06-30 | 2014-11-12 | 永利电子铜陵有限公司 | 一种含镍微粉pcb电路板导电银浆及其制备方法 |
CN104217856A (zh) * | 2014-08-18 | 2014-12-17 | 东莞市戍普电子科技有限公司 | 一种mlcc用镍浆及其制备方法 |
KR20170068777A (ko) * | 2015-12-10 | 2017-06-20 | 주식회사 동진쎄미켐 | 태양전지 전극 형성용 페이스트 조성물 |
CN106879085B (zh) * | 2016-12-19 | 2020-02-07 | 东莞珂洛赫慕电子材料科技有限公司 | 一种适配铝碳化硅基材的电阻浆料及其制备方法 |
CN107093491B (zh) * | 2017-04-20 | 2019-03-29 | 洛阳理工学院 | 一种中低温烧渗银电极浆料及其制备方法 |
CN107234366A (zh) * | 2017-06-16 | 2017-10-10 | 深圳市赛雅电子浆料有限公司 | 一种焊接银浆及其制备工艺和应用焊接工艺 |
CN109411113A (zh) * | 2017-08-18 | 2019-03-01 | 西安宏星电子浆料科技有限责任公司 | 凹槽自流平导体浆料及其使用方法 |
CN108962422B (zh) * | 2018-08-30 | 2020-05-22 | 浙江纳沛新材料有限公司 | 一种用于ltcc陶瓷基板的导电银浆及其制备方法 |
CN108735343A (zh) * | 2018-08-30 | 2018-11-02 | 浙江纳沛新材料有限公司 | 一种用于低温共烧陶瓷基板的导电银浆及其制备方法 |
CN109659065B (zh) * | 2018-12-14 | 2020-07-28 | 杭州华光焊接新材料股份有限公司 | 一种介电陶瓷电容用银浆 |
CN109935380A (zh) * | 2019-04-01 | 2019-06-25 | 南京航空航天大学 | 一种ain厚膜电路用导电银浆及其制备方法 |
CN111128438A (zh) * | 2019-12-31 | 2020-05-08 | 合肥圣达电子科技实业有限公司 | 一种浸焊不挂锡环保型银浆料及其制备方法 |
CN111468713B (zh) * | 2020-04-14 | 2022-06-10 | 湖南省国银新材料有限公司 | 一种电子烟雾化芯用镍浆及其制备方法 |
CN113161036A (zh) * | 2021-04-28 | 2021-07-23 | 佛山市顺德区百锐新电子材料有限公司 | 一种防黏连抗硫化的面电极银浆及其制备方法 |
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CN1909748A (zh) * | 2006-07-28 | 2007-02-07 | 王克政 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
CN101986390A (zh) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | 圆片电容电极用银浆 |
CN102153281A (zh) * | 2010-11-11 | 2011-08-17 | 肇庆市羚光电子化学品材料科技有限公司 | 压电陶瓷玻璃及其制备方法和应用 |
CN102340900A (zh) * | 2011-07-21 | 2012-02-01 | 佛山市海辰科技有限公司 | 基于ir-led陶瓷基板的稀土厚膜电路电热元件及其制备方法 |
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2012
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Patent Citations (4)
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CN1909748A (zh) * | 2006-07-28 | 2007-02-07 | 王克政 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
CN102153281A (zh) * | 2010-11-11 | 2011-08-17 | 肇庆市羚光电子化学品材料科技有限公司 | 压电陶瓷玻璃及其制备方法和应用 |
CN101986390A (zh) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | 圆片电容电极用银浆 |
CN102340900A (zh) * | 2011-07-21 | 2012-02-01 | 佛山市海辰科技有限公司 | 基于ir-led陶瓷基板的稀土厚膜电路电热元件及其制备方法 |
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