CN100386829C - Ptc厚膜电路可控电热元件 - Google Patents

Ptc厚膜电路可控电热元件 Download PDF

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CN100386829C
CN100386829C CNB2004100508301A CN200410050830A CN100386829C CN 100386829 C CN100386829 C CN 100386829C CN B2004100508301 A CNB2004100508301 A CN B2004100508301A CN 200410050830 A CN200410050830 A CN 200410050830A CN 100386829 C CN100386829 C CN 100386829C
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王克政
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Guangdong Yuchen Electronic Technology Co ltd
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    • HELECTRICITY
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Abstract

本发明公开了一种PTC厚膜电路可控电热元件,包括基片、系列电子浆料,系列电子浆料制备在基片上,所述系列电子浆料包括介质浆料、电极浆料,系列电子浆料均由功能相、无机粘结相和有机载体三部分组成。所述系列电子浆料还包括PTC浆料,所述基片为1Cr18Ni9系列不锈钢基片,系列电子浆料以厚膜电路的形式制备在基片上,同时还公开了所述介质浆料、PTC浆料、电极浆料的配方。本发明具有以下优点:加热温度场可控,功率密度大,响应速度快,机械强度高,抗振动,抗热冲击能力强,外形结构紧凑,使用寿命长,节能。

Description

PTC厚膜电路可控电热元件
技术领域
本发明涉及一种厚膜电路电热元件,尤其是涉及一种PTC厚膜电路可控电热元件。
背景技术
随着电热产品在家电、工业电器、电子设备、汽车行业等诸多领域的日益普及,电热元件的应用变得越来越广泛,所以人们对电热元件各方面的性能要求也越来越高。
现有技术中的电热元件(以镍铬丝为主)存在以下缺点:功率密度较小,一般为15瓦/厘米2左右,不能很好的满足人们对大功率的要求;启动速度也较慢,并且多具有热惰性;机械强度较低,抗振动、抗热冲击能力弱;元件体积较大,占用较大空间,并且安装也不方便;不易实现控温材料与电热材料共平面、共曲面化设计;节能效果不理想;它们的寿命一般较短,而且具有副作用,不利于身体健康;耐腐蚀方面也不理想;工艺性较差。
传统的PTC(即Postitive Temperatare Coefficient的简称)存在着如下问题:
传统的PTC加热器是把若干个圆盘式、蜂窝式PTC元件用粘接或夹持的方法和散热器一起连接起来,引出电极,形成发热器组件。粘接式PTC发热器组件是由波纹式散热条利用硅胶粘接而成。这种结构致使功率不稳和元件容易老化,功率衰竭严重,还可能引起电器短路,甚至会导致火灾。
用机械夹持方式代替粘接,选用整体翅片式散热,提高了散热效果,解决了粘接式PTC存在的开胶、老化等安全问题。但PTC电热元件的表面温度多在250℃左右,装夹和电极的引出却显得十分重要。除防止接触不良、短路、电场分布不均避免电击穿外,还必须防止机械接触不良而引起的局部过热而击穿。
多个元件串联使用时,由于元件特性难以一致,元件升温不同,电压降分布迅速变化,并产生恶性循环,压降越大,温度升高的元件有可能发生击穿,且会连锁发生。因此,串联时元件严格挑选很重要。
多个元件并联使用时,在一定限度内能够增大系统功率,但系统确定后,多个元件的发热功率,并非单个元件发热的总和,而实际上要小的多。并联时,通电后几秒内将出现较大的冲击电流,由于元件的离散性,各元件的升温的速度不同,因此,冲击电流并不是单个元件冲击电流的叠加,一般要比叠加之和小些。尽管如此,并联时应选用冲击电流较小的元件。
按国际要求,PTC发热器信赖性实验是在无风状态下,施加额定电压运行1000小时功率衰减小于8%;实际测试目前多数厂家产品功率衰减都大于15%。由于以上问题的存在,串联或并联式PTC加热器的应用受到很大限制。
另外,现有的厚膜电路的发热元件是电阻元件,不具有温度的可控性;以陶瓷为基片的厚膜电路电热元件存在着工艺性差、易脆等先天性的不足,从而大大制约了它的发展和应用范围。
为了改进上述电热元件的不足,人们开始研究开发以不锈钢为基片的厚膜电路电热元件。目前,美国的Dupont、Est以及德国的Heraeus等极少数公司已经掌握了以美国牌号430(即不锈钢1Cr17)作厚膜电路基板的系列浆料制备技术。国内德利公司依托国防大学力量开发的基于不锈钢1Cr17基片的厚膜电路系列浆料已申请了专利,其申请号分别为02139894、02139895、02139896,申请日均为2002年12月30日,发明名称分别为基于不锈钢基板的大功率厚膜电路用电阻浆料及其制备工艺、基于不锈钢基板的大功率厚膜电路用导电浆料及其制备工艺、基于不锈钢基板的大功率厚膜电路用介质浆料及其制备工艺的专利,采用的也是以不锈钢1Cr17作厚膜电路基板的系列浆料。并且上述系列浆料均未涉及PTC电子浆料,所制成的电热元件为电阻式电热元件,因此自身不具有温度可控制性。
由于1Cr17只是普通纯度高烙铁素体(F)型不锈钢,其碳的质量分数为0.1%左右并含少量的氮,它与常用的奥氏体型不锈钢相比,缺点是材质较脆,机械加工工艺及焊接工艺性均较差,极大地限制了它的应用。而奥氏体型1Cr18Ni9系列不锈钢,具有非常好的塑性和韧性,从而具有良好的弯折、卷曲和冲压成形性,机械加工性能优良,便于制成各种形状的构件、容器或管道,因此以1Cr18Ni9系列不锈钢为基板的厚膜电路可控电热元件无疑已经是该技术发展的必然趋势。
发明内容
本发明的目的在于提供一种温度可控、响应快、功率密度大、低压启动、成本低、体积小、安全、方便、节电的一种基于1Cr18Ni9系列基片的PTC厚膜电路可控电热元件。
本发明是通过下述方案来实现上述目的的:
该电热元件包括基片、系列电子浆料,系列电子浆料制备在基片上,所述系列电子浆料由介质浆料、电极浆料和PTC浆料构成,所述基片为1Cr18Ni9系列不锈钢基片,系列电子浆料以厚膜电路的形式制备在基片上。
系列电子浆料均由功能相、无机粘结相和有机载体三部分组成,所述介质浆料的无机粘结相为硼硅酸盐、硅酸铝,其有机载体为主溶剂松油醇、柠檬酸三丁酯;功能相配方如下:CaO-Al2O3-SiO2-B2O3和添加剂TiO2:2~10%、ZrO2:2~8%、CaO:35~45%;所述PTC浆料的无机粘结相为氧化物CuO、Co2O3,有机载体为增稠剂乙基纤维素、硝基纤维素,其功能相配方如下:主配方(Ba:50~63%、Pb:20~33%、Ca:4~13%)TiO3+X%Nb2O5或Y2O3其中X为摩尔分数且X=0.14~0.18和微量添加剂AST(即微晶玻璃)、Sb2O3、Li2CO3、MnNO3;所述电极浆料的无机粘结相为氧化物与玻璃的混合物,有机载体为辅助溶剂;功能相配方如下:Bi2O3或TiO2:2~6%、细即末状Ag:60~70%、片状Ag:20~40%、细即末状Pb:2~9%。
按上述配方制备的介质浆料、PTC浆料、导体浆料,其构成特点是由功能相组分和无机粘合相、有机溶剂载体照配比按制备工艺得到,并以厚膜电路的形式制备在1Cr18Ni9系列不锈钢基片上即得基于不锈钢基板的PTC厚膜电路可控电热元件。
本发明与传统的电热元件相比具有许多性能上优势:
1、加热温度场可控。厚膜电热元件的电路轨迹可随意设计,且不存在加热盲区,根据需要可设计制成均匀或非均匀温度场;“生带技术”应用后,厚膜电路可制成曲面,若与电阻厚膜电路结合将大大扩展厚膜可控电路电热元件应用领域和提高厚膜可控电路电热元件自动控制程度。
2、功率密度大。其功率一般为40~60瓦/厘米2,在强制冷却的条件下,其功率可高达200瓦/厘米2,是传统家用电热器具电热元件的近十倍。功率密度大使得其外形尺寸小,还可以低压启动。
3、响应速度快。电阻膜层的表面加热速度可达200~300℃/s,这是普通电热合金元件所不能达到的,从而使得厚膜电热元件可以应用于需要快速加热的器具。
4、机械强度高,抗振动,抗热冲击能力强。这种厚膜式电热元件不会像合金电热材料产生高温脆性,其膜层和不锈钢基片结合力强,所以能抗机械和热冲击,不用担心因为支撑、安装不当或其本身自重而引起变形、倒塌等现象。
5、节能。利用不锈钢的传导性,结合电热结构的优化设计,厚膜可控电热元件产生的热量可最大限度的加以利用,热量浪费少,与传统电热元件相比,节能达10~30%。
附图说明
以下结合附图和具体实施例对本发明作进一步说明
图1为本发明的结构示意图;
具体实施例
如图1,本发明包括1Cr18Ni9不锈钢基片1、系列电子浆料,所述系列电子浆料包括介质浆料2、PTC浆料3、电极浆料(又名导体浆料)4;介质浆料2以电路的形式印制在1Cr18Ni9不锈钢基片1表面,并烧成具有一定厚度的致密膜层,目的是为提供PTC层和导体层与不锈钢基片1的绝缘。PTC浆料3制备在介质浆料2的外表面;电极浆料4制备在电路的两端、PTC浆料3的外表面,主要进行电阻与电阻以及电阻与外接电源的连接。
系列电子浆料均由功能相、无机粘结相和有机载体三部分组成,其中,系列电子浆料的无机粘结相和有机载体均采用了现有浆料通常所采用的组分,如介质浆料2的无机粘结相为硼硅酸盐、硅酸铝,其有机载体为主溶剂松油醇、柠檬酸三丁酯;电极浆料4的无机粘结相为氧化物与玻璃的混合物,有机载体为辅助溶剂,该辅助溶剂可采用表面活性剂和触变剂;本发明在此不作细述;介质浆料2功能相配方如下:CaO-Al2o3-SiO2-B2O3(按玻璃的成份配比,用电子天平称取所需氧化物的用量,氧化物的规格为化学纯或分析纯)和添加剂TiO2:3%、ZrO2:7%、CaO:40%;所述PTC浆料3配方如下:主配方(Ba:58%、Pb30%、Ca:12%)TiO3+X%Nb2O5或Y2O3(X为摩尔分数,X=0.16)和微量添加剂AST、Sb2O3、Li2CO3、Mn(NO3)(采用国产的分析纯度原料,按特定的电子陶瓷制备工艺);所述电极浆料4的功能相配方如下:Ag(细,即粉末状,市售)65%、Ag(片,即片状,市售):30%、Pb(细,即粉末状,市售):2%。按上述配方制备的介质浆料、PTC浆料、导体浆料,其构成特点是由固相组分和无机粘合剂、有机溶剂载体按照配比制备工艺得到,并以厚膜电路的形式制备在1Cr18Ni9系列不锈钢基片上,即得基于不锈钢基板的PTC厚膜电路可控电热元件。下表为本发明系列电子浆料的组成(表1):表2为制备的PTC浆料性能
Figure C20041005083000081
表2
本发明所采用的奥氏体型1Cr18Ni9系列不锈钢具有非常好的塑性和韧性,从而具有良好的弯折、卷曲和冲压成形性,便于制成各种形状的构件、容器或管道。正是基于上述原因,本发明选择1Cr18Ni9系列不锈钢作为厚膜可控电路的基片,研制可直接应用于1Cr18Ni9系列不锈钢基片的系列厚膜电子浆料,包括介质浆料、PTC浆料和导体浆料。
本发明PTC厚膜电路可控电热元件是指PTC电子浆料所制备的厚膜电路电热元件,是一种正温度系数的半导体发热元件,它属于钛酸钡(BaTiO3)系列的化合物。一般半导体随温度升高电阻降低,呈NTC(NegativeTemperatune Coefficient)特性,即负温效应。而PTC元件当温度达到某一特定范围(居里点附近)时,电阻会急剧增加,发生几个数量级的变化,这种阻抗的异常变化现象被称为PTC效应,PTC电热元件表面温度多在250℃左右,PTC电热元件的居里点可以通过添加不同的杂质而用其它元素来置换钛酸钡中的钡把居里点移向高温侧或低温侧。正是基于上述原因,本发明选择了PTC浆料并将它以厚膜电路的形式制备在不锈钢基片上,制作了基于1Cr18Ni9系列不锈钢基片的厚膜电路可控电热元件,制作这种PTC效应的厚膜电路可控电热元件更是前所未有的实践与探索。

Claims (2)

1.一种PTC厚膜电路可控电热元件,包括基片、系列电子浆料,系列电子浆料制备在基片上,所述系列电子浆料包括介质浆料、电极浆料,系列电子浆料均由功能相、无机粘结相和有机载体三部分组成,介质浆料的无机粘结相为硼硅酸盐、硅酸铝,其有机载体为主溶剂;电极浆料的无机粘结相为氧化物与玻璃的混合物,有机载体为辅助溶剂;其特征在于:所述系列电子浆料还包括PTC浆料,所述基片为1Cr18Ni9系列不锈钢基片,系列电子浆料以厚膜电路的形式制备在基片上;
所述介质浆料功能相配方如下:CaO-Al2O3-SiO2-B2O3和添加剂TiO2:2~10%、ZrO2:2~8%、CaO:35~45%;
所述PTC浆料的无机粘结相为氧化物,其有机载体为增稠剂;功能相配方如下:主配方(Ba:50~63%、Pb:20~33%、Ca:4~13%)TiO3+X%Nb2O5或Y2O3其中X为摩尔分数且X=0.14~0.18和微量添加剂AST、Sb2O3、Li2CO3、MnNO3
所述电极浆料功能相配方如下:Bi2O3或TiO2:2~6%、粉末状Ag:60~70%、片状Ag:20~40%、粉末状Pb:2~9%。
2.根据权利要求1所述的PTC厚膜电路可控电热元件,其特征在于,所述PTC浆料的无机粘结相氧化物为CuO、Co2O3,其有机载体增稠剂为乙基纤维素、硝基纤维素;介质浆料的有机载体主溶剂为松油醇、柠檬酸三丁酯;电极浆料的有机载体辅助溶剂采用表面活性剂和触变剂。
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US11/658,793 US7800028B2 (en) 2004-07-28 2005-07-15 Controllable electrothermal element of PTC thick film circuit
JP2007522901A JP4874244B2 (ja) 2004-07-28 2005-07-15 Ptc厚膜電気回路制御の電熱素子
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