CN100386829C - Ptc厚膜电路可控电热元件 - Google Patents
Ptc厚膜电路可控电热元件 Download PDFInfo
- Publication number
- CN100386829C CN100386829C CNB2004100508301A CN200410050830A CN100386829C CN 100386829 C CN100386829 C CN 100386829C CN B2004100508301 A CNB2004100508301 A CN B2004100508301A CN 200410050830 A CN200410050830 A CN 200410050830A CN 100386829 C CN100386829 C CN 100386829C
- Authority
- CN
- China
- Prior art keywords
- slurry
- ptc
- substrate
- thick film
- slurry materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005485 electric heating Methods 0.000 title claims abstract description 38
- 239000002002 slurry Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 26
- 239000010935 stainless steel Substances 0.000 claims abstract description 26
- 239000011267 electrode slurry Substances 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 238000002360 preparation method Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 9
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229940029985 mineral supplement Drugs 0.000 claims description 3
- 239000002562 thickening agent Substances 0.000 claims description 3
- 235000013619 trace mineral Nutrition 0.000 claims description 3
- 239000011573 trace mineral Substances 0.000 claims description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical group CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 3
- 239000001856 Ethyl cellulose Substances 0.000 claims description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical group CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 2
- 229920001249 ethyl cellulose Polymers 0.000 claims description 2
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000013008 thixotropic agent Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 14
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 230000035939 shock Effects 0.000 abstract description 4
- 238000009472 formulation Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 9
- 239000012071 phase Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000002547 anomalous effect Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/02—Heaters using heating elements having a positive temperature coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
Claims (2)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100508301A CN100386829C (zh) | 2004-07-28 | 2004-07-28 | Ptc厚膜电路可控电热元件 |
EP05766847.7A EP1791396B1 (en) | 2004-07-28 | 2005-07-15 | Controllable electrothermal element of ptc thick film circuit |
US11/658,793 US7800028B2 (en) | 2004-07-28 | 2005-07-15 | Controllable electrothermal element of PTC thick film circuit |
JP2007522901A JP4874244B2 (ja) | 2004-07-28 | 2005-07-15 | Ptc厚膜電気回路制御の電熱素子 |
PCT/CN2005/001052 WO2006010317A1 (fr) | 2004-07-28 | 2005-07-15 | Élément électrothermique réglable d'un circuit ptc à couche épaisse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100508301A CN100386829C (zh) | 2004-07-28 | 2004-07-28 | Ptc厚膜电路可控电热元件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1588573A CN1588573A (zh) | 2005-03-02 |
CN100386829C true CN100386829C (zh) | 2008-05-07 |
Family
ID=34602285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100508301A Expired - Lifetime CN100386829C (zh) | 2004-07-28 | 2004-07-28 | Ptc厚膜电路可控电热元件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7800028B2 (zh) |
EP (1) | EP1791396B1 (zh) |
JP (1) | JP4874244B2 (zh) |
CN (1) | CN100386829C (zh) |
WO (1) | WO2006010317A1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100499942C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺 |
CN100499941C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土介质浆料及其制备工艺 |
CN1937856B (zh) * | 2006-07-28 | 2010-12-15 | 王克政 | 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 |
CN100499940C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
DE102006041054A1 (de) * | 2006-09-01 | 2008-04-03 | Epcos Ag | Heizelement |
CN201100690Y (zh) * | 2007-02-02 | 2008-08-13 | 盛光润 | 一种电膜炉 |
FR2951348B1 (fr) * | 2009-10-12 | 2012-02-03 | Tornier Sa | Element chauffant et appareil chirurgical le mettant en oeuvre |
CN102685942B (zh) * | 2012-05-29 | 2014-05-07 | 王克政 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
DE102014110164B4 (de) | 2014-05-02 | 2022-11-03 | Borgwarner Ludwigsburg Gmbh | Verfahren zum Herstellen eines Heizstabs |
WO2016036607A1 (en) * | 2014-09-02 | 2016-03-10 | Graphene 3D Lab Inc. | Electrochemical devices comprising nanoscopic carbon materials made by additive manufacturing |
CN104318979A (zh) * | 2014-09-19 | 2015-01-28 | 王晨 | 复合材料基厚膜电路稀土介质浆料及其制备工艺 |
CN104827857B (zh) * | 2015-04-03 | 2017-11-07 | 佛山市海辰科技有限公司 | PTCR‑xthm电热芯片为热源的电动汽车智能暖气机系统 |
KR102248618B1 (ko) * | 2016-06-27 | 2021-05-04 | 니뽄 다바코 산교 가부시키가이샤 | 에어로졸 흡인기용 카트리지 및 그것을 구비하는 에어로졸 흡인기, 및 에어로졸 흡인기용 발열 시트 |
CN107446408A (zh) * | 2017-07-18 | 2017-12-08 | 德阳烯碳科技有限公司 | Ptc石墨烯发热油墨及其制备方法、及其制备的发热膜 |
US11499724B2 (en) | 2018-07-03 | 2022-11-15 | Goodrich Corporation | Heated floor panels |
US10920994B2 (en) | 2018-07-03 | 2021-02-16 | Goodrich Corporation | Heated floor panels |
US10875623B2 (en) | 2018-07-03 | 2020-12-29 | Goodrich Corporation | High temperature thermoplastic pre-impregnated structure for aircraft heated floor panel |
US11376811B2 (en) | 2018-07-03 | 2022-07-05 | Goodrich Corporation | Impact and knife cut resistant pre-impregnated woven fabric for aircraft heated floor panels |
US10899427B2 (en) | 2018-07-03 | 2021-01-26 | Goodrich Corporation | Heated floor panel with impact layer |
US11273897B2 (en) | 2018-07-03 | 2022-03-15 | Goodrich Corporation | Asymmetric surface layer for floor panels |
CN109650933B (zh) * | 2019-01-28 | 2021-03-30 | 陕西科技大学 | 一种多孔Co3O4/Al2SiO5低密度吸波型复相陶瓷及其制备方法 |
CN111761788A (zh) * | 2019-04-02 | 2020-10-13 | 厦门市同骏电子有限公司 | 一种注塑压塑加热模块设备及生产工艺 |
US11903101B2 (en) | 2019-12-13 | 2024-02-13 | Goodrich Corporation | Internal heating trace assembly |
CN114126112A (zh) * | 2021-11-23 | 2022-03-01 | 浙江波仕科技有限公司 | 一种高分子电热膜电极及其生产工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0794260A (ja) * | 1993-07-30 | 1995-04-07 | Toshiba Lighting & Technol Corp | ヒータおよび定着装置 |
CN1143425A (zh) * | 1994-03-04 | 1997-02-19 | 株式会社小松 | 正特性热敏电阻及采用它的热敏电阻装置 |
CN1202511A (zh) * | 1998-06-02 | 1998-12-23 | 武汉景辉科技发展有限公司 | 厚膜高温发热材料 |
CN1490376A (zh) * | 2003-09-01 | 2004-04-21 | 王培英 | 半导瓷厚膜发热材料 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03246901A (ja) * | 1990-02-23 | 1991-11-05 | Hitachi Ltd | 厚膜抵抗組成物、該組成物を用いたハイブリッドicおよびその製法 |
DE69320098T2 (de) * | 1992-05-15 | 1999-04-01 | Denso Corp., Kariya, Aichi | Kaltleiterthermistor für Heizgeräte und Verfahren zur Herstellung |
JPH07140022A (ja) * | 1993-11-16 | 1995-06-02 | Matsushita Electric Ind Co Ltd | 抵抗素子用ペースト、抵抗素子および力学量センサ |
JPH07297008A (ja) * | 1994-03-04 | 1995-11-10 | Komatsu Ltd | 正特性サーミスタおよびこれを用いたサーミスタ装置 |
US5702653A (en) * | 1995-07-11 | 1997-12-30 | Spectrol Electronics Corporation | Thick-film circuit element |
JP3927250B2 (ja) * | 1995-08-16 | 2007-06-06 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 窒化アルミニウム基板用厚膜導体ペースト組成物 |
US6443999B1 (en) * | 2000-03-16 | 2002-09-03 | The Gillette Company | Lithium cell with heat formed separator |
WO2002082473A2 (en) * | 2001-04-09 | 2002-10-17 | Morgan Chemical Products, Inc. | Thick film paste systems for circuits on diamonds substrates |
US20050029666A1 (en) * | 2001-08-31 | 2005-02-10 | Yasutoshi Kurihara | Semiconductor device structural body and electronic device |
JP3797281B2 (ja) * | 2001-09-20 | 2006-07-12 | 株式会社村田製作所 | 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品 |
US6780494B2 (en) * | 2002-03-07 | 2004-08-24 | Tdk Corporation | Ceramic electronic device and method of production of same |
JP3807609B2 (ja) * | 2002-03-07 | 2006-08-09 | Tdk株式会社 | セラミック電子部品及びその製造方法 |
-
2004
- 2004-07-28 CN CNB2004100508301A patent/CN100386829C/zh not_active Expired - Lifetime
-
2005
- 2005-07-15 EP EP05766847.7A patent/EP1791396B1/en not_active Not-in-force
- 2005-07-15 JP JP2007522901A patent/JP4874244B2/ja active Active
- 2005-07-15 US US11/658,793 patent/US7800028B2/en not_active Expired - Fee Related
- 2005-07-15 WO PCT/CN2005/001052 patent/WO2006010317A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0794260A (ja) * | 1993-07-30 | 1995-04-07 | Toshiba Lighting & Technol Corp | ヒータおよび定着装置 |
CN1143425A (zh) * | 1994-03-04 | 1997-02-19 | 株式会社小松 | 正特性热敏电阻及采用它的热敏电阻装置 |
CN1202511A (zh) * | 1998-06-02 | 1998-12-23 | 武汉景辉科技发展有限公司 | 厚膜高温发热材料 |
CN1490376A (zh) * | 2003-09-01 | 2004-04-21 | 王培英 | 半导瓷厚膜发热材料 |
Also Published As
Publication number | Publication date |
---|---|
US7800028B2 (en) | 2010-09-21 |
JP4874244B2 (ja) | 2012-02-15 |
EP1791396A4 (en) | 2010-07-28 |
EP1791396B1 (en) | 2017-09-06 |
US20090283511A1 (en) | 2009-11-19 |
JP2008508664A (ja) | 2008-03-21 |
EP1791396A1 (en) | 2007-05-30 |
CN1588573A (zh) | 2005-03-02 |
WO2006010317A1 (fr) | 2006-02-02 |
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