CN100386829C - Ptc厚膜电路可控电热元件 - Google Patents

Ptc厚膜电路可控电热元件 Download PDF

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Publication number
CN100386829C
CN100386829C CNB2004100508301A CN200410050830A CN100386829C CN 100386829 C CN100386829 C CN 100386829C CN B2004100508301 A CNB2004100508301 A CN B2004100508301A CN 200410050830 A CN200410050830 A CN 200410050830A CN 100386829 C CN100386829 C CN 100386829C
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CN
China
Prior art keywords
ptc
series
slurry
pastes
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004100508301A
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English (en)
Chinese (zh)
Other versions
CN1588573A (zh
Inventor
王克政
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Guangdong Yuchen Electronic Technology Co ltd
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNB2004100508301A priority Critical patent/CN100386829C/zh
Publication of CN1588573A publication Critical patent/CN1588573A/zh
Priority to US11/658,793 priority patent/US7800028B2/en
Priority to EP05766847.7A priority patent/EP1791396B1/en
Priority to PCT/CN2005/001052 priority patent/WO2006010317A1/zh
Priority to JP2007522901A priority patent/JP4874244B2/ja
Application granted granted Critical
Publication of CN100386829C publication Critical patent/CN100386829C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
CNB2004100508301A 2004-07-28 2004-07-28 Ptc厚膜电路可控电热元件 Expired - Lifetime CN100386829C (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CNB2004100508301A CN100386829C (zh) 2004-07-28 2004-07-28 Ptc厚膜电路可控电热元件
US11/658,793 US7800028B2 (en) 2004-07-28 2005-07-15 Controllable electrothermal element of PTC thick film circuit
EP05766847.7A EP1791396B1 (en) 2004-07-28 2005-07-15 Controllable electrothermal element of ptc thick film circuit
PCT/CN2005/001052 WO2006010317A1 (en) 2004-07-28 2005-07-15 Controllable electrothermal element of ptc thick film circuit
JP2007522901A JP4874244B2 (ja) 2004-07-28 2005-07-15 Ｐｔｃ厚膜電気回路制御の電熱素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100508301A CN100386829C (zh) 2004-07-28 2004-07-28 Ptc厚膜电路可控电热元件

Publications (2)

Publication Number Publication Date
CN1588573A CN1588573A (zh) 2005-03-02
CN100386829C true CN100386829C (zh) 2008-05-07

Family

ID=34602285

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100508301A Expired - Lifetime CN100386829C (zh) 2004-07-28 2004-07-28 Ptc厚膜电路可控电热元件

Country Status (5)

Country Link
US (1) US7800028B2 (enExample)
EP (1) EP1791396B1 (enExample)
JP (1) JP4874244B2 (enExample)
CN (1) CN100386829C (enExample)
WO (1) WO2006010317A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP4753642B2 (ja) * 2005-07-04 2011-08-24 株式会社リコー 電子部品実装体の製造方法
CN100499942C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺
CN100499941C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土介质浆料及其制备工艺
CN1937856B (zh) * 2006-07-28 2010-12-15 王克政 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺
CN100499940C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺
DE102006041054A1 (de) * 2006-09-01 2008-04-03 Epcos Ag Heizelement
CN201100690Y (zh) * 2007-02-02 2008-08-13 盛光润 一种电膜炉
FR2951348B1 (fr) * 2009-10-12 2012-02-03 Tornier Sa Element chauffant et appareil chirurgical le mettant en oeuvre
CN102685942B (zh) * 2012-05-29 2014-05-07 王克政 一种ptc稀土厚膜电路智能电热元件及其制备方法
DE102014110164B4 (de) * 2014-05-02 2022-11-03 Borgwarner Ludwigsburg Gmbh Verfahren zum Herstellen eines Heizstabs
US10727537B2 (en) * 2014-09-02 2020-07-28 G6 Materials Corp. Electrochemical devices comprising nanoscopic carbon materials made by additive manufacturing
CN104318979A (zh) * 2014-09-19 2015-01-28 王晨 复合材料基厚膜电路稀土介质浆料及其制备工艺
CN104827857B (zh) * 2015-04-03 2017-11-07 佛山市海辰科技有限公司 PTCR‑xthm电热芯片为热源的电动汽车智能暖气机系统
KR102248618B1 (ko) * 2016-06-27 2021-05-04 니뽄 다바코 산교 가부시키가이샤 에어로졸 흡인기용 카트리지 및 그것을 구비하는 에어로졸 흡인기, 및 에어로졸 흡인기용 발열 시트
CN107446408A (zh) * 2017-07-18 2017-12-08 德阳烯碳科技有限公司 Ptc石墨烯发热油墨及其制备方法、及其制备的发热膜
US11376811B2 (en) 2018-07-03 2022-07-05 Goodrich Corporation Impact and knife cut resistant pre-impregnated woven fabric for aircraft heated floor panels
US10875623B2 (en) 2018-07-03 2020-12-29 Goodrich Corporation High temperature thermoplastic pre-impregnated structure for aircraft heated floor panel
US11499724B2 (en) 2018-07-03 2022-11-15 Goodrich Corporation Heated floor panels
US11273897B2 (en) 2018-07-03 2022-03-15 Goodrich Corporation Asymmetric surface layer for floor panels
US10920994B2 (en) 2018-07-03 2021-02-16 Goodrich Corporation Heated floor panels
US10899427B2 (en) 2018-07-03 2021-01-26 Goodrich Corporation Heated floor panel with impact layer
CN109650933B (zh) * 2019-01-28 2021-03-30 陕西科技大学 一种多孔Co3O4/Al2SiO5低密度吸波型复相陶瓷及其制备方法
CN111761788A (zh) * 2019-04-02 2020-10-13 厦门市同骏电子有限公司 一种注塑压塑加热模块设备及生产工艺
CN111981674A (zh) * 2019-05-22 2020-11-24 帅和节能电器科技(上海)有限公司 云控物联网即热式热水器
US11903101B2 (en) 2019-12-13 2024-02-13 Goodrich Corporation Internal heating trace assembly
CN114126112A (zh) * 2021-11-23 2022-03-01 浙江波仕科技有限公司 一种高分子电热膜电极及其生产工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794260A (ja) * 1993-07-30 1995-04-07 Toshiba Lighting & Technol Corp ヒータおよび定着装置
CN1143425A (zh) * 1994-03-04 1997-02-19 株式会社小松 正特性热敏电阻及采用它的热敏电阻装置
CN1202511A (zh) * 1998-06-02 1998-12-23 武汉景辉科技发展有限公司 厚膜高温发热材料
CN1490376A (zh) * 2003-09-01 2004-04-21 王培英 半导瓷厚膜发热材料

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JPH03246901A (ja) * 1990-02-23 1991-11-05 Hitachi Ltd 厚膜抵抗組成物、該組成物を用いたハイブリッドｉｃおよびその製法
EP0569983B1 (en) * 1992-05-15 1998-08-05 Denso Corporation Positive-temperature-coefficient thermistor heating device and process for production of the same
JPH07140022A (ja) * 1993-11-16 1995-06-02 Matsushita Electric Ind Co Ltd 抵抗素子用ペースト、抵抗素子および力学量センサ
JPH07297008A (ja) * 1994-03-04 1995-11-10 Komatsu Ltd 正特性サーミスタおよびこれを用いたサーミスタ装置
US5702653A (en) * 1995-07-11 1997-12-30 Spectrol Electronics Corporation Thick-film circuit element
JP3927250B2 (ja) * 1995-08-16 2007-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 窒化アルミニウム基板用厚膜導体ペースト組成物
US6443999B1 (en) * 2000-03-16 2002-09-03 The Gillette Company Lithium cell with heat formed separator
US6723420B2 (en) * 2001-04-09 2004-04-20 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamond substrates
JPWO2003021664A1 (ja) * 2001-08-31 2005-07-07 株式会社日立製作所 半導体装置、構造体及び電子装置
JP3797281B2 (ja) * 2001-09-20 2006-07-12 株式会社村田製作所 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品
JP3807609B2 (ja) * 2002-03-07 2006-08-09 Ｔｄｋ株式会社 セラミック電子部品及びその製造方法
US6780494B2 (en) * 2002-03-07 2004-08-24 Tdk Corporation Ceramic electronic device and method of production of same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794260A (ja) * 1993-07-30 1995-04-07 Toshiba Lighting & Technol Corp ヒータおよび定着装置
CN1143425A (zh) * 1994-03-04 1997-02-19 株式会社小松 正特性热敏电阻及采用它的热敏电阻装置
CN1202511A (zh) * 1998-06-02 1998-12-23 武汉景辉科技发展有限公司 厚膜高温发热材料
CN1490376A (zh) * 2003-09-01 2004-04-21 王培英 半导瓷厚膜发热材料

Also Published As

Publication number Publication date
EP1791396A4 (en) 2010-07-28
EP1791396A1 (en) 2007-05-30
US7800028B2 (en) 2010-09-21
EP1791396B1 (en) 2017-09-06
JP4874244B2 (ja) 2012-02-15
US20090283511A1 (en) 2009-11-19
JP2008508664A (ja) 2008-03-21
WO2006010317A1 (en) 2006-02-02
CN1588573A (zh) 2005-03-02

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: FOSHAN HAICHEN TECHNOLOGY Co.,Ltd.

Assignor: Wang Kezheng

Contract fulfillment period: 2008.5.30 to 2018.5.30

Contract record no.: 2009440001274

Denomination of invention: PTC thick film curc uit controllable electric heating element

Granted publication date: 20080507

License type: Exclusive license

Record date: 20090819

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.5.30 TO 2018.5.30; CHANGE OF CONTRACT

Name of requester: FOSHAN CITY HAICHEN TECHNOLOGY CO., LTD.

Effective date: 20090819

EC01 Cancellation of recordation of patent licensing contract

Assignee: FOSHAN HAICHEN TECHNOLOGY Co.,Ltd.

Assignor: Wang Kezheng

Contract record no.: 2009440001274

Date of cancellation: 20101102

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150924

Address after: 528000, No. four, building 1, No. two, Huabao South Road, Chancheng District, Guangdong, Foshan

Patentee after: FOSHAN HAICHEN TECHNOLOGY Co.,Ltd.

Address before: 528000 No. 13, Nanhua street, Chancheng District, Guangdong, Foshan, 303

Patentee before: Wang Kezheng

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Date of cancellation: 20201114

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Date of cancellation: 20210401

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Effective date of registration: 20211125

Address after: 528000 2 / F, block 4, No.1, South Huabao Road, Chancheng District, Foshan City, Guangdong Province

Patentee after: Guangdong Yuchen Electronic Technology Co.,Ltd.

Address before: 528000 Second Floor, Four Blocks, No. 1 Huabao South Road, Chancheng District, Foshan City, Guangdong Province

Patentee before: FOSHAN HAICHEN TECHNOLOGY Co.,Ltd.

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CX01 Expiry of patent term

Granted publication date: 20080507