JP4872949B2 - 回路接続材料及びそれを用いた回路部材の接続構造 - Google Patents

回路接続材料及びそれを用いた回路部材の接続構造 Download PDF

Info

Publication number
JP4872949B2
JP4872949B2 JP2008053648A JP2008053648A JP4872949B2 JP 4872949 B2 JP4872949 B2 JP 4872949B2 JP 2008053648 A JP2008053648 A JP 2008053648A JP 2008053648 A JP2008053648 A JP 2008053648A JP 4872949 B2 JP4872949 B2 JP 4872949B2
Authority
JP
Japan
Prior art keywords
circuit
group
carbon atoms
weight
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008053648A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009111327A (ja
Inventor
孝 中澤
征宏 有福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2008053648A priority Critical patent/JP4872949B2/ja
Priority to KR1020087029027A priority patent/KR101071039B1/ko
Priority to CN200880110597.8A priority patent/CN101822130B/zh
Priority to PCT/JP2008/068285 priority patent/WO2009048070A1/ja
Publication of JP2009111327A publication Critical patent/JP2009111327A/ja
Application granted granted Critical
Publication of JP4872949B2 publication Critical patent/JP4872949B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
JP2008053648A 2007-10-12 2008-03-04 回路接続材料及びそれを用いた回路部材の接続構造 Expired - Fee Related JP4872949B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008053648A JP4872949B2 (ja) 2007-10-12 2008-03-04 回路接続材料及びそれを用いた回路部材の接続構造
KR1020087029027A KR101071039B1 (ko) 2007-10-12 2008-10-08 회로 접속 재료 및 그것을 이용한 회로 부재의 접속 구조
CN200880110597.8A CN101822130B (zh) 2007-10-12 2008-10-08 电路连接材料和使用其的电路部件的连接结构
PCT/JP2008/068285 WO2009048070A1 (ja) 2007-10-12 2008-10-08 回路接続材料及びそれを用いた回路部材の接続構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007266509 2007-10-12
JP2007266509 2007-10-12
JP2008053648A JP4872949B2 (ja) 2007-10-12 2008-03-04 回路接続材料及びそれを用いた回路部材の接続構造

Publications (2)

Publication Number Publication Date
JP2009111327A JP2009111327A (ja) 2009-05-21
JP4872949B2 true JP4872949B2 (ja) 2012-02-08

Family

ID=40779466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008053648A Expired - Fee Related JP4872949B2 (ja) 2007-10-12 2008-03-04 回路接続材料及びそれを用いた回路部材の接続構造

Country Status (3)

Country Link
JP (1) JP4872949B2 (zh)
KR (1) KR101071039B1 (zh)
CN (1) CN101822130B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934166B2 (ja) 2009-05-25 2012-05-16 住友電気工業株式会社 電極の接着剤接続構造、電子機器およびその組立方法
JP5518747B2 (ja) * 2009-11-16 2014-06-11 日立化成株式会社 回路接続材料及びそれを用いた回路部材の接続構造
JP5654289B2 (ja) * 2010-08-26 2015-01-14 デクセリアルズ株式会社 実装体の製造方法及び実装体並びに異方性導電膜
JP6146302B2 (ja) * 2011-05-18 2017-06-14 日立化成株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
JP5134111B2 (ja) * 2011-05-20 2013-01-30 住友電気工業株式会社 接続方法、接続構造および電子機器
JP6231257B2 (ja) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
CN108987962B (zh) * 2017-06-05 2021-12-03 日立金属株式会社 压接端子、带端子的电线以及带端子的电线的制造方法
KR102348525B1 (ko) * 2020-07-17 2022-01-07 88테크 주식회사 전도성 페이스트와 그 제조방법 및 이를 이용한 fpcb의 보강판 적층구조와 전자파 차폐층을 동시에 형성하는 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06264258A (ja) * 1993-03-10 1994-09-20 Shikoku Chem Corp 銅及び銅合金の表面処理剤
JPH06302952A (ja) * 1993-04-14 1994-10-28 Asahi Chem Ind Co Ltd スルーホール回路基板の製造法
JP3280474B2 (ja) * 1993-07-20 2002-05-13 住友ベークライト株式会社 樹脂組成物
JP2000171823A (ja) * 1998-12-03 2000-06-23 Casio Comput Co Ltd 液晶表示素子
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP4647073B2 (ja) * 2000-09-29 2011-03-09 四国化成工業株式会社 銅及び銅合金のはんだ付け方法
JP2002146325A (ja) * 2000-11-16 2002-05-22 Hitachi Chem Co Ltd 接着剤組成物とそれを用いた接着部材と半導体搭載用基板と半導体装置
JP2003064331A (ja) * 2001-08-30 2003-03-05 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造

Also Published As

Publication number Publication date
CN101822130B (zh) 2014-03-12
KR20090077028A (ko) 2009-07-14
JP2009111327A (ja) 2009-05-21
KR101071039B1 (ko) 2011-10-06
CN101822130A (zh) 2010-09-01

Similar Documents

Publication Publication Date Title
US6762249B1 (en) Wiring-connecting material and process for producing circuit board with the same
JP4872949B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP4590732B2 (ja) 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP5716763B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP2009277769A (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JPWO2008139996A1 (ja) フィルム状回路接続材料及び回路部材の接続構造
JP5176139B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP2017073386A (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
JP4916677B2 (ja) 配線接続材料及びそれを用いた配線板製造方法
US20100277884A1 (en) Circuit-connecting material and circuit terminal connection structure
JP4154919B2 (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP4844461B2 (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP4605184B2 (ja) 配線接続材料及びそれを用いた配線板製造方法
JP3889944B2 (ja) 回路接続用接着フィルム及びそれを用いた回路板の製造方法
JP2009275079A (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP4617848B2 (ja) 接着剤組成物及び回路接続用接着剤組成物
JP4400674B2 (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP2010212706A (ja) 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2008169389A (ja) 回路接続材料及び回路板の製造法
JP5023665B2 (ja) 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに、接続体
JP2005290394A (ja) 回路接続用接着フィルム及びそれを用いた回路板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091218

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110809

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110927

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111025

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111107

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141202

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141202

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141202

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees