JP4864955B2 - 薬液供給装置 - Google Patents
薬液供給装置 Download PDFInfo
- Publication number
- JP4864955B2 JP4864955B2 JP2008263656A JP2008263656A JP4864955B2 JP 4864955 B2 JP4864955 B2 JP 4864955B2 JP 2008263656 A JP2008263656 A JP 2008263656A JP 2008263656 A JP2008263656 A JP 2008263656A JP 4864955 B2 JP4864955 B2 JP 4864955B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- chemical
- nozzle cover
- supply apparatus
- nozzles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000126 substance Substances 0.000 title claims description 114
- 239000000243 solution Substances 0.000 claims description 56
- 239000007788 liquid Substances 0.000 claims description 26
- 239000008155 medical solution Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004148 unit process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Description
120:ノズルカバー、
130:ノズル駆動部、
140:薬液供給部、
150:薬液排出部、
200:基板
Claims (7)
- 薬液を供給する複数のノズルと、
前記複数のノズルを内部に収容し、前記ノズルが出入り自在なように一方の側が開放されたノズルカバーと、を備え、
前記複数のノズルの各ノズルは、前方向に移動して前記一方の側から突き出て薬液を供給し、薬液供給後に前記一方の側からノズルカバー中へ移動するように、ノズル駆動部によってそれぞれ前後方向に移動可能となっており、
前記ノズルカバーは、ノズルカバー左右駆動部によってノズルの移動方向に対して直交する方向に移動可能となっている、薬液供給装置。 - 前記ノズルを収容するノズルカバーを上下に移動させるノズルカバー上下駆動部をさらに備える請求項1に記載の薬液供給装置。
- 前記ノズルを収容するノズルカバーの開放された一方の側とは反対側の一端を中心として前記ノズルカバーを回転させるノズルカバー回転駆動部をさらに備える請求項1に記載
の薬液供給装置。 - 前記ノズルを収容するノズルカバーを上下に移動させるノズルカバー上下駆動部をさらに備える請求項3に記載の薬液供給装置。
- 前記ノズル駆動部は、エアーシリンダーを用いて前記ノズルを前後方向に移動させる請求項1に記載の薬液供給装置。
- 前記ノズルカバーは、前記ノズルから滴下する薬液を回収して前記ノズルカバーの外部に排出する薬液排出部をさらに備える請求項1に記載の薬液供給装置。
- 前記薬液排出部は、前記それぞれのノズルに対して別々に形成される請求項1に記載の薬液供給装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070102692A KR100901459B1 (ko) | 2007-10-11 | 2007-10-11 | 약액 공급 장치 |
KR10-2007-0102692 | 2007-10-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009094521A JP2009094521A (ja) | 2009-04-30 |
JP4864955B2 true JP4864955B2 (ja) | 2012-02-01 |
Family
ID=40570207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008263656A Active JP4864955B2 (ja) | 2007-10-11 | 2008-10-10 | 薬液供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7900853B2 (ja) |
JP (1) | JP4864955B2 (ja) |
KR (1) | KR100901459B1 (ja) |
CN (1) | CN101406888B (ja) |
TW (1) | TWI396226B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101036592B1 (ko) * | 2008-11-28 | 2011-05-24 | 세메스 주식회사 | 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 |
KR101213967B1 (ko) * | 2009-12-21 | 2012-12-20 | 주식회사 케이씨텍 | 기판세정장치 |
JP5248633B2 (ja) * | 2011-01-18 | 2013-07-31 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
CN110949915A (zh) * | 2019-12-07 | 2020-04-03 | 盐城东方汽车广场投资发展有限公司 | 一种室外环保垃圾桶 |
JP7424424B2 (ja) * | 2021-11-02 | 2024-01-30 | 東京エレクトロン株式会社 | 液処理装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0744167B2 (ja) | 1990-03-14 | 1995-05-15 | 株式会社ダン・クリーン・プロダクト | スプレー洗浄装置 |
NL9200799A (nl) * | 1992-05-04 | 1993-12-01 | Meino Jan Van Der Woude | Verticale reinigingslansmachine. |
US5353996A (en) * | 1993-02-18 | 1994-10-11 | Boise Cascade Corporation | Sootblower frame and drive assembly |
US5299533A (en) * | 1993-03-22 | 1994-04-05 | The Babcock & Wilcox Company | Open beam sootblower |
JP3185753B2 (ja) | 1998-05-22 | 2001-07-11 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3892792B2 (ja) * | 2001-11-02 | 2007-03-14 | 大日本スクリーン製造株式会社 | 基板処理装置および基板洗浄装置 |
EP1627966B1 (en) * | 2003-04-28 | 2012-08-22 | Panasonic Corporation | Sanitary washing apparatus |
US7323080B2 (en) * | 2004-05-04 | 2008-01-29 | Semes Co., Ltd. | Apparatus for treating substrate |
JP4675772B2 (ja) | 2005-12-16 | 2011-04-27 | 東京エレクトロン株式会社 | 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
JP2007157898A (ja) | 2005-12-02 | 2007-06-21 | Tokyo Electron Ltd | 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 |
WO2007072571A1 (ja) * | 2005-12-22 | 2007-06-28 | Pre-Tech Co., Ltd. | 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法 |
JP2007254992A (ja) * | 2006-03-22 | 2007-10-04 | Aisin Seiki Co Ltd | 温水洗浄便座のノズルユニット |
-
2007
- 2007-10-11 KR KR1020070102692A patent/KR100901459B1/ko active IP Right Grant
-
2008
- 2008-10-09 US US12/248,085 patent/US7900853B2/en active Active
- 2008-10-09 TW TW097139277A patent/TWI396226B/zh active
- 2008-10-10 JP JP2008263656A patent/JP4864955B2/ja active Active
- 2008-10-13 CN CN200810167467XA patent/CN101406888B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI396226B (zh) | 2013-05-11 |
KR20090037181A (ko) | 2009-04-15 |
KR100901459B1 (ko) | 2009-06-08 |
CN101406888B (zh) | 2012-03-21 |
CN101406888A (zh) | 2009-04-15 |
TW200929332A (en) | 2009-07-01 |
US20090120468A1 (en) | 2009-05-14 |
JP2009094521A (ja) | 2009-04-30 |
US7900853B2 (en) | 2011-03-08 |
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