US7900853B2 - Apparatus for supplying chemical liquid - Google Patents

Apparatus for supplying chemical liquid Download PDF

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Publication number
US7900853B2
US7900853B2 US12/248,085 US24808508A US7900853B2 US 7900853 B2 US7900853 B2 US 7900853B2 US 24808508 A US24808508 A US 24808508A US 7900853 B2 US7900853 B2 US 7900853B2
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United States
Prior art keywords
nozzles
nozzle cover
chemical liquid
nozzle
driver
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US12/248,085
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US20090120468A1 (en
Inventor
Si-Eun Kim
Kyo-Woog Koo
Keun-Young Park
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Semes Co Ltd
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Semes Co Ltd
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Assigned to SEMES CO., LTD. reassignment SEMES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, SI-EUN, KOO, KYO-WOOG, PARK, KEUN-YOUNG
Publication of US20090120468A1 publication Critical patent/US20090120468A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Definitions

  • the present invention relates to an apparatus for supplying chemical liquid, and more particularly, to an apparatus for supplying chemical liquid, the apparatus capable of simultaneously supplying a plurality of chemical liquids by using a plurality of nozzles that can be independently driven forward or backward and capable of enhancing processing efficiency by reducing the waiting time required to change the nozzles.
  • a conventional semiconductor device is fabricated by depositing a predetermined layer on a silicon semiconductor substrate, which is used as a semiconductor substrate, and transforming the layer into patterns having electrical properties.
  • the patterns are formed through sequential or repeated unit processes such as a layer deposition process, a photolithography process, an etching process, an ion implantation process, and a polishing process.
  • a single-wafer-type cleaning device which is a kind of cleaning device, cleans a substrate by rotating the substrate attached to a spin chuck while an apparatus for supplying chemical liquid, which is disposed above the substrate, supplies a cleaning solution to the substrate.
  • FIG. 1 is a perspective view of a conventional apparatus for supplying chemical liquid by using a chuck cylinder 20 .
  • the conventional apparatus attaches one of a plurality of nozzles 10 a through 10 c , which supplies predetermined chemical liquid, to the chuck cylinder 20 for a cleaning process.
  • the chuck cylinder 20 which is moved by a vertical transfer actuator 30 and a horizontal transfer actuator 40 , moves the nozzle 10 a , 10 b or 10 c attached thereto to a position above a substrate (not shown). Then, the nozzle 10 a , 10 b or 10 c supplies the predetermined chemical liquid onto the substrate.
  • the chuck cylinder 20 is moved back to where the nozzles 10 a through 10 c are disposed. Then, one of the nozzles 10 a through 10 c , which is attached to the chuck cylinder 20 , is detached from the chuck cylinder 20 , and another one of the nozzles 10 a through 10 c is attached to the chuck cylinder 20 . Thereafter, the chuck cylinder 20 having the nozzle 10 a , 10 b or 10 c newly attached thereto is moved to the substrate, so that the nozzle 10 a , 10 b or 10 c can supply the chemical liquid onto the substrate.
  • aspects of the present invention provide an apparatus for supplying chemical liquid, the apparatus capable of simultaneously supplying a plurality of chemical liquids by using a plurality of nozzles that can be independently driven and capable of enhancing processing efficiency by reducing the waiting time required to change the nozzles when the chemical liquids need to be successively used.
  • an apparatus for supplying chemical liquid includes: a plurality of nozzles, each of which can be moved forward or backward and supplies chemical liquid; a nozzle cover which accommodates the nozzles therein and has an open end to allow each of the nozzles to move into or out of the nozzle cover; and a nozzle driver which moves each of the nozzles forward or backward.
  • FIG. 1 is a perspective view of a conventional apparatus for supplying chemical liquid by using a chuck cylinder
  • FIG. 2 is a plan view of an apparatus for supplying chemical liquid according to an exemplary embodiment of the present invention
  • FIG. 3 is a side view of the apparatus shown in FIG. 2 ;
  • FIG. 4 is a plan view for explaining the operation of the apparatus shown in FIG. 2 ;
  • FIG. 5 is a side view for explaining the operation of the apparatus shown in FIG. 2 ;
  • FIG. 6 is a plan view of the apparatus of FIG. 2 in which a nozzle cover can be moved to the right or left;
  • FIG. 7 is a plan view of the apparatus of FIG. 2 which sprays chemical liquid onto a substrate by using a third nozzle;
  • FIG. 8 is a plan view of the apparatus of FIG. 2 which sprays chemical liquids onto the substrate by using a plurality of nozzles;
  • FIG. 9 is a plan view of an apparatus for supplying chemical liquid according to another exemplary embodiment of the present invention, the apparatus spraying chemical liquids onto a substrate by rotating a nozzle cover.
  • FIG. 2 is a plan view of an apparatus for supplying chemical liquid according to an exemplary embodiment of the present invention.
  • FIG. 3 is a side view of the apparatus shown in FIG. 2 .
  • the apparatus includes nozzles 110 , a nozzle cover 120 , and a nozzle driver 130 .
  • the apparatus may further include a horizontal nozzle cover driver (not shown), a vertical nozzle cover driver (not shown), and a chemical liquid ejector 150 .
  • Each of the first through third nozzles 110 a through 110 c supplies chemical liquid onto a substrate 200 .
  • each of the first through third nozzles 110 a through 110 c can be independently moved forward or backward by the nozzle driver 130 .
  • the first through third nozzles 110 a through 110 c include chemical liquid suppliers 140 a through 140 c , respectively, and different chemical liquids are supplied to the first through third nozzles 110 a through 110 c through hoses or pipes, respectively.
  • the three nozzles 110 a through 110 c are shown, which is, however, a mere example. That is, more than three nozzles can be provided.
  • the nozzle cover 120 accommodates the first through third nozzles 110 a through 110 c therein and has an open side to allow each of the first through third nozzles 110 a through 110 c to move forward out of the nozzle cover 120 and supply chemical liquid onto the substrate 200 .
  • the nozzle cover 120 having the first through third nozzles 110 a through 110 c therein may be moved to the right or left by the horizontal nozzle cover driver (not shown).
  • the nozzle cover 120 having the first through third nozzles 110 a through 110 c therein may be moved upward or downward by the vertical nozzle cover driver (not shown).
  • the nozzle driver 130 moves each of the first through third nozzles 110 a through 110 c within the nozzle cover 120 forward or backward.
  • the nozzle driver 130 may be an air cylinder that can move each of the first through third nozzles 110 a through 110 c connected thereto.
  • the nozzle driver 130 according to the present invention is not limited to the air cylinder. That is, the nozzle driver 130 can be any device that can move each of the first through third nozzles 110 a through 110 c forward or backward.
  • the nozzle driver 130 is disposed inside the nozzle cover 120 . However, the nozzle driver 130 may also be disposed outside the nozzle cover 120 .
  • the chemical liquid ejector 150 collects chemical liquids that drop from the first through third nozzles 110 a through 110 c and ejects the collected chemical liquids from the nozzle cover 120 . As shown in FIG. 3 , the chemical liquid ejector 150 is disposed under respective ends of the first through third nozzles 110 a through 110 c within the nozzle cover 120 to collect chemical liquids which drop from the respective ends of the first through third nozzles 110 a through 110 c . The chemical liquid ejector 150 collects residual chemical liquids that drop from the respective ends of the nozzles 110 a through 110 c to prevent the residual chemical liquids from contaminating the nozzle cover 120 or the substrate 200 .
  • the chemical liquid ejector 150 includes a pipe 152 to eject the collected chemical liquids from the nozzle cover 120 through the pipe 152 .
  • the single chemical liquid ejector 150 may be disposed within the nozzle cover 120 to collect chemical liquids that drop from the first through third nozzles 110 a through 110 c .
  • a plurality of chemical liquid ejectors corresponding to the first through third nozzles 110 a through 110 c , respectively, may be disposed within the nozzle cover 120 .
  • the chemical liquid ejectors may be disposed under the first through third nozzles 110 a through 110 c respectively and collect chemical liquids that drop from the first through third nozzles 110 a through 110 c respectively and separately.
  • the horizontal nozzle cover driver moves the nozzle cover 120 to the right or left as shown in FIG. 6 .
  • the horizontal nozzle cover driver may include a guide 170 which guides the nozzle cover 120 and a motor (not shown) which generates power to move the nozzle cover 120 along the guide 170 .
  • the horizontal nozzle cover driver may come in various configurations as long as it can move the nozzle cover 120 to the right or left.
  • the horizontal nozzle cover driver places each of the first through third nozzles 110 a through 110 c within the nozzle cover 120 right in the middle of or at a predetermined position above the substrate 200 , so that each of the first through third nozzles 110 a through 110 c can spray chemical liquid in the middle of or at the predetermined position above the substrate 200 .
  • the vertical nozzle cover driver moves the nozzle cover 120 upward or downward.
  • the vertical nozzle cover driver may include a shaft 160 which is connected to the nozzle cover 120 and a power generator such as an air cylinder (not shown) which moves the shaft 160 upward or downward.
  • the vertical nozzle cover driver may adjust the distance between each of the first through third nozzles 110 a through 110 c and the substrate 200 , so that each of the first through third nozzles 110 a through 110 c can spray chemical liquid onto the substrate 200 at an optimal distance from the substrate 200 .
  • FIG. 4 is a plan view for explaining the operation of the apparatus shown in FIG. 2 .
  • FIG. 5 is a side view for explaining the operation of the apparatus shown in FIG. 2 .
  • FIG. 6 is a plan view of the apparatus of FIG. 2 in which the nozzle cover 120 can be moved to the right or left.
  • FIG. 7 is a plan view of the apparatus of FIG. 2 which sprays chemical liquid onto the substrate 200 by using the third nozzle 110 c.
  • the nozzle cover 120 is moved to the right or left by the horizontal nozzle cover driver (not shown).
  • the horizontal nozzle cover driver (not shown) may move the nozzle cover 120 from a position shown in dotted lines to the position of the substrate 200 .
  • the second nozzle 110 b sprays chemical liquid onto the substrate 200 after being moved forward by the nozzle driver 130 .
  • the second nozzle 110 b is moved back into the nozzle cover 120 , and the first nozzle 110 a or the third nozzle 110 c is moved forward to supply another chemical liquid onto the substrate 200 .
  • chemical liquid is sprayed from the third nozzle 110 c onto the substrate 200 .
  • the second nozzle 110 b sprays chemical liquid onto the substrate 200 as shown in FIG. 6
  • the third nozzle 110 c is moved forward as shown in FIG. 7 .
  • the horizontal nozzle cover driver (not shown) slightly moves the nozzle cover 120 to place the third nozzle 110 c in the middle of the substrate 200 .
  • the chuck cylinder 20 is moved to where the nozzles 10 a through 10 c are disposed. Then one of the nozzles 10 a through 10 c , which is already attached to the chuck cylinder 20 , is detached from the chuck cylinder 20 , and another one of the nozzles 10 a through 10 c is newly attached to the chuck cylinder 20 . Next, the chuck cylinder 20 having the nozzle 10 a , 10 b or 10 c newly attached thereto is moved to the substrate (not shown). Thus, the entire processing efficiency is reduced due to the waiting time required to change the nozzles 10 a through 10 c.
  • each of the first through third nozzles 110 a through 110 c which can be moved forward or backward, is moved into or out of the nozzle cover 120 .
  • the nozzle cover 120 is moved by a distance corresponding to a gap between the first through third nozzles 110 a through 110 c , so that a corresponding one of the first through third nozzles 110 a through 110 c faces the center of the substrate 200 .
  • each of the first through third nozzles 110 a through 110 c can spray chemical liquid onto the substrate 200 at an optimal distance from the substrate 200 .
  • the apparatus according to the present embodiment can also simultaneously supply chemical liquids onto the substrate 200 through the first through third nozzles 110 a through 110 c.
  • FIG. 8 is a plan view of the apparatus of FIG. 2 which sprays chemical liquids onto the substrate 200 by using the first through third nozzles 110 a through 110 c.
  • the second and third nozzles 110 b and 110 c simultaneously spray different chemical liquids.
  • the apparatus for supplying chemical liquid according to the present embodiment includes first through third nozzles 110 a through 110 c , a nozzle cover 120 , a nozzle driver 130 , and a chemical liquid ejector 150 .
  • first through third nozzles 110 a through 110 c the apparatus for supplying chemical liquid according to the present embodiment includes first through third nozzles 110 a through 110 c , a nozzle cover 120 , a nozzle driver 130 , and a chemical liquid ejector 150 .
  • FIG. 9 is a plan view of the apparatus for supplying chemical liquid according to another exemplary embodiment of the present invention, the apparatus spraying chemical liquid onto a substrate 200 by rotating the nozzle cover 120 .
  • the horizontal nozzle cover driver moves the nozzle cover 120 to the right or left.
  • a nozzle cover rotator rotates the nozzle cover 120 .
  • the nozzle cover rotator (not shown) rotates the nozzle cover 120 about an end of the nozzle cover 120 which is opposite an open end of the nozzle cover 120 .
  • the nozzle cover rotator (not shown) may include a shaft 180 which is connected to the nozzle cover 120 and a motor (not shown) which generates power to rotate the shaft 180 .
  • the present invention is not limited thereto.
  • the nozzle cover rotator may come in various configurations as long as it can rotate the nozzle cover 120 about an end of the nozzle cover 120 .
  • each of the first through third nozzles 110 a through 110 c may be moved forward or backward by the nozzle driver 130 to supply chemical liquid.
  • different chemical liquids can also be simultaneously sprayed onto the substrate 200 in the present embodiment.
  • the nozzle cover rotator (not shown) rotates the nozzle cover 120 in a clockwise direction or a counterclockwise direction.
  • the entire area of the substrate 200 can be scanned and thus sprayed with chemical liquids.
  • each of the first through third nozzles 110 a through 110 c can spray chemical liquid at an optimal distance from the substrate 200 .
  • An apparatus for supplying chemical liquid according to the present invention provides at least one of the following advantages.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
US12/248,085 2007-10-11 2008-10-09 Apparatus for supplying chemical liquid Active 2029-02-24 US7900853B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070102692A KR100901459B1 (ko) 2007-10-11 2007-10-11 약액 공급 장치
KR10-2007-0102692 2007-11-10

Publications (2)

Publication Number Publication Date
US20090120468A1 US20090120468A1 (en) 2009-05-14
US7900853B2 true US7900853B2 (en) 2011-03-08

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US12/248,085 Active 2029-02-24 US7900853B2 (en) 2007-10-11 2008-10-09 Apparatus for supplying chemical liquid

Country Status (5)

Country Link
US (1) US7900853B2 (ja)
JP (1) JP4864955B2 (ja)
KR (1) KR100901459B1 (ja)
CN (1) CN101406888B (ja)
TW (1) TWI396226B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036592B1 (ko) * 2008-11-28 2011-05-24 세메스 주식회사 처리액 공급 유닛과, 이를 이용한 기판 처리 장치
KR101213967B1 (ko) * 2009-12-21 2012-12-20 주식회사 케이씨텍 기판세정장치
JP5248633B2 (ja) * 2011-01-18 2013-07-31 東京エレクトロン株式会社 液処理装置および液処理方法
CN110949915A (zh) * 2019-12-07 2020-04-03 盐城东方汽车广场投资发展有限公司 一种室外环保垃圾桶
JP7424424B2 (ja) * 2021-11-02 2024-01-30 東京エレクトロン株式会社 液処理装置

Citations (8)

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Publication number Priority date Publication date Assignee Title
JPH03263831A (ja) 1990-03-14 1991-11-25 Dan Clean Prod:Kk スプレー洗浄装置
US5299533A (en) * 1993-03-22 1994-04-05 The Babcock & Wilcox Company Open beam sootblower
US5348234A (en) * 1992-05-04 1994-09-20 Stork Nedserv B.V. Cleaning lance machine
US5353996A (en) * 1993-02-18 1994-10-11 Boise Cascade Corporation Sootblower frame and drive assembly
EP0959490A2 (en) 1998-05-22 1999-11-24 Nec Corporation A semiconductor device washing apparatus and a method of washing a semiconductordevice
JP2003209087A (ja) 2001-11-02 2003-07-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007157898A (ja) 2005-12-02 2007-06-21 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
JP2007165746A (ja) 2005-12-16 2007-06-28 Tokyo Electron Ltd 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
KR100722077B1 (ko) * 2003-04-28 2007-05-25 마츠시타 덴끼 산교 가부시키가이샤 노즐 장치 및 이것을 구비한 위생 세정 장치
US7323080B2 (en) * 2004-05-04 2008-01-29 Semes Co., Ltd. Apparatus for treating substrate
WO2007072571A1 (ja) * 2005-12-22 2007-06-28 Pre-Tech Co., Ltd. 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
JP2007254992A (ja) * 2006-03-22 2007-10-04 Aisin Seiki Co Ltd 温水洗浄便座のノズルユニット

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03263831A (ja) 1990-03-14 1991-11-25 Dan Clean Prod:Kk スプレー洗浄装置
US5348234A (en) * 1992-05-04 1994-09-20 Stork Nedserv B.V. Cleaning lance machine
US5353996A (en) * 1993-02-18 1994-10-11 Boise Cascade Corporation Sootblower frame and drive assembly
US5299533A (en) * 1993-03-22 1994-04-05 The Babcock & Wilcox Company Open beam sootblower
EP0959490A2 (en) 1998-05-22 1999-11-24 Nec Corporation A semiconductor device washing apparatus and a method of washing a semiconductordevice
CN1236977A (zh) 1998-05-22 1999-12-01 日本电气株式会社 半导体器件清洗装置和清洗半导体器件的方法
JP2003209087A (ja) 2001-11-02 2003-07-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007157898A (ja) 2005-12-02 2007-06-21 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
JP2007165746A (ja) 2005-12-16 2007-06-28 Tokyo Electron Ltd 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体

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* Cited by examiner, † Cited by third party
Title
Korean Office Action for Korean Patent Application No. 10-2007-0102692 issued Nov. 12, 2008.
Office Action issued Dec. 11, 2009 by the Chinese Patent Office for corresponding Chinese patent application No. 200810167467.X.
Office Action issued Sep. 15, 2010 by the Japanese Patent Office for corresponding Japanese patent application No. 2008-263656.

Also Published As

Publication number Publication date
TW200929332A (en) 2009-07-01
JP2009094521A (ja) 2009-04-30
KR20090037181A (ko) 2009-04-15
CN101406888A (zh) 2009-04-15
TWI396226B (zh) 2013-05-11
JP4864955B2 (ja) 2012-02-01
KR100901459B1 (ko) 2009-06-08
CN101406888B (zh) 2012-03-21
US20090120468A1 (en) 2009-05-14

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