JP4849890B2 - 貫通孔を有するガラス部品およびその製造方法 - Google Patents

貫通孔を有するガラス部品およびその製造方法 Download PDF

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Publication number
JP4849890B2
JP4849890B2 JP2005514386A JP2005514386A JP4849890B2 JP 4849890 B2 JP4849890 B2 JP 4849890B2 JP 2005514386 A JP2005514386 A JP 2005514386A JP 2005514386 A JP2005514386 A JP 2005514386A JP 4849890 B2 JP4849890 B2 JP 4849890B2
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JP
Japan
Prior art keywords
hole
latent image
photosensitive glass
exposure
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005514386A
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English (en)
Japanese (ja)
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JPWO2005033033A1 (ja
Inventor
潤 小澤
和明 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP2005514386A priority Critical patent/JP4849890B2/ja
Publication of JPWO2005033033A1 publication Critical patent/JPWO2005033033A1/ja
Application granted granted Critical
Publication of JP4849890B2 publication Critical patent/JP4849890B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/04—Compositions for glass with special properties for photosensitive glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Glass Compositions (AREA)
JP2005514386A 2003-10-06 2004-09-16 貫通孔を有するガラス部品およびその製造方法 Expired - Fee Related JP4849890B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005514386A JP4849890B2 (ja) 2003-10-06 2004-09-16 貫通孔を有するガラス部品およびその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003347091 2003-10-06
JP2003347091 2003-10-06
JP2005514386A JP4849890B2 (ja) 2003-10-06 2004-09-16 貫通孔を有するガラス部品およびその製造方法
PCT/JP2004/013508 WO2005033033A1 (fr) 2003-10-06 2004-09-16 Composant en verre presentant un orifice traversant et procede de production associe

Publications (2)

Publication Number Publication Date
JPWO2005033033A1 JPWO2005033033A1 (ja) 2007-11-15
JP4849890B2 true JP4849890B2 (ja) 2012-01-11

Family

ID=34419571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005514386A Expired - Fee Related JP4849890B2 (ja) 2003-10-06 2004-09-16 貫通孔を有するガラス部品およびその製造方法

Country Status (3)

Country Link
JP (1) JP4849890B2 (fr)
TW (1) TW200520650A (fr)
WO (1) WO2005033033A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319198A (ja) * 2005-05-13 2006-11-24 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
US9278886B2 (en) 2010-11-30 2016-03-08 Corning Incorporated Methods of forming high-density arrays of holes in glass
JP2015040168A (ja) * 2013-08-23 2015-03-02 Hoya株式会社 感光性ガラス基板の製造方法
JP6403716B2 (ja) * 2015-05-18 2018-10-10 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ リドロー法による光構造化可能なガラス体の製造方法
US9914660B2 (en) * 2015-05-18 2018-03-13 Schott Ag Sensitized, photo-sensitive glass and its production
DE102016109139A1 (de) * 2015-05-18 2016-11-24 Schott Ag Kontinuierliche Herstellung fotosensitiver Glaskörper
TW201704177A (zh) * 2015-06-10 2017-02-01 康寧公司 蝕刻玻璃基板的方法及玻璃基板
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
JP6898998B2 (ja) 2017-03-06 2021-07-07 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 電磁放射及び続くエッチングプロセスにより材料内に少なくとも１つの空隙を施すための方法
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP2018199605A (ja) * 2017-05-29 2018-12-20 Ａｇｃ株式会社 ガラス基板の製造方法およびガラス基板
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN108710261B (zh) * 2018-06-07 2020-12-25 信利光电股份有限公司 一种摄像模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278433A (ja) * 1988-04-30 1989-11-08 Hoya Corp 感光性ガラス物品の製造方法
JPH02255542A (ja) * 1989-03-29 1990-10-16 Hoya Corp 感光性ガラスのパターン形成方法
JPH1171139A (ja) * 1997-08-26 1999-03-16 Res Dev Corp Of Japan 微結晶分散ガラス及びその製造方法
JP2000313629A (ja) * 1999-04-27 2000-11-14 Japan Science & Technology Corp 微小穴開きガラス及びその製造方法
JP2003226548A (ja) * 2002-02-01 2003-08-12 Hoya Corp 感光性ガラス及びその加工方法並びにインクジェットプリンタ用部品の製造方法及び半導体基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137345A (ja) * 1983-01-21 1984-08-07 Konishiroku Photo Ind Co Ltd 結晶化ガラス
JP3559827B2 (ja) * 2002-05-24 2004-09-02 独立行政法人理化学研究所 透明材料内部の処理方法およびその装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278433A (ja) * 1988-04-30 1989-11-08 Hoya Corp 感光性ガラス物品の製造方法
JPH02255542A (ja) * 1989-03-29 1990-10-16 Hoya Corp 感光性ガラスのパターン形成方法
JPH1171139A (ja) * 1997-08-26 1999-03-16 Res Dev Corp Of Japan 微結晶分散ガラス及びその製造方法
JP2000313629A (ja) * 1999-04-27 2000-11-14 Japan Science & Technology Corp 微小穴開きガラス及びその製造方法
JP2003226548A (ja) * 2002-02-01 2003-08-12 Hoya Corp 感光性ガラス及びその加工方法並びにインクジェットプリンタ用部品の製造方法及び半導体基板の製造方法

Also Published As

Publication number Publication date
TWI337514B (fr) 2011-02-11
TW200520650A (en) 2005-06-16
JPWO2005033033A1 (ja) 2007-11-15
WO2005033033A1 (fr) 2005-04-14

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