TW200520650A - Glass component having through hole and production method thereof - Google Patents
Glass component having through hole and production method thereofInfo
- Publication number
- TW200520650A TW200520650A TW093129974A TW93129974A TW200520650A TW 200520650 A TW200520650 A TW 200520650A TW 093129974 A TW093129974 A TW 093129974A TW 93129974 A TW93129974 A TW 93129974A TW 200520650 A TW200520650 A TW 200520650A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- glass component
- diameter
- production method
- glass
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/04—Compositions for glass with special properties for photosensitive glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Treatment Of Glass (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003347091 | 2003-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200520650A true TW200520650A (en) | 2005-06-16 |
TWI337514B TWI337514B (zh) | 2011-02-11 |
Family
ID=34419571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093129974A TW200520650A (en) | 2003-10-06 | 2004-10-04 | Glass component having through hole and production method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4849890B2 (zh) |
TW (1) | TW200520650A (zh) |
WO (1) | WO2005033033A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108710261A (zh) * | 2018-06-07 | 2018-10-26 | 信利光电股份有限公司 | 一种摄像模组 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319198A (ja) * | 2005-05-13 | 2006-11-24 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法およびレーザー加工装置 |
WO2012075072A2 (en) * | 2010-11-30 | 2012-06-07 | Corning Incorporated | Methods of forming high-density arrays of holes in glass |
JP2015040168A (ja) * | 2013-08-23 | 2015-03-02 | Hoya株式会社 | 感光性ガラス基板の製造方法 |
JP6403716B2 (ja) * | 2015-05-18 | 2018-10-10 | ショット アクチエンゲゼルシャフトSchott AG | リドロー法による光構造化可能なガラス体の製造方法 |
US10093575B2 (en) | 2015-05-18 | 2018-10-09 | Schott Ag | Continuous production of photo-sensitive glass bodies |
JP6385391B2 (ja) * | 2015-05-18 | 2018-09-05 | ショット アクチエンゲゼルシャフトSchott AG | 増感された感光性ガラスおよびその製造 |
TW201704177A (zh) * | 2015-06-10 | 2017-02-01 | 康寧公司 | 蝕刻玻璃基板的方法及玻璃基板 |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
US10134657B2 (en) | 2016-06-29 | 2018-11-20 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
WO2018162385A1 (de) * | 2017-03-06 | 2018-09-13 | Lpkf Laser & Electronics Ag | Verfahren zum einbringen zumindest einer ausnehmung in ein material mittels elektromagnetischer strahlung und anschliessendem ätzprozess |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) * | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
JP2018199605A (ja) * | 2017-05-29 | 2018-12-20 | Agc株式会社 | ガラス基板の製造方法およびガラス基板 |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59137345A (ja) * | 1983-01-21 | 1984-08-07 | Konishiroku Photo Ind Co Ltd | 結晶化ガラス |
JPH01278433A (ja) * | 1988-04-30 | 1989-11-08 | Hoya Corp | 感光性ガラス物品の製造方法 |
JP2579358B2 (ja) * | 1989-03-29 | 1997-02-05 | ホーヤ株式会社 | 感光性ガラスのパターン形成方法 |
JPH1171139A (ja) * | 1997-08-26 | 1999-03-16 | Res Dev Corp Of Japan | 微結晶分散ガラス及びその製造方法 |
JP2000313629A (ja) * | 1999-04-27 | 2000-11-14 | Japan Science & Technology Corp | 微小穴開きガラス及びその製造方法 |
JP4129906B2 (ja) * | 2002-02-01 | 2008-08-06 | Hoya株式会社 | 感光性ガラス及びその加工方法並びにインクジェットプリンタ用部品の製造方法及び半導体基板の製造方法 |
JP3559827B2 (ja) * | 2002-05-24 | 2004-09-02 | 独立行政法人理化学研究所 | 透明材料内部の処理方法およびその装置 |
-
2004
- 2004-09-16 JP JP2005514386A patent/JP4849890B2/ja not_active Expired - Fee Related
- 2004-09-16 WO PCT/JP2004/013508 patent/WO2005033033A1/ja active Application Filing
- 2004-10-04 TW TW093129974A patent/TW200520650A/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108710261A (zh) * | 2018-06-07 | 2018-10-26 | 信利光电股份有限公司 | 一种摄像模组 |
CN108710261B (zh) * | 2018-06-07 | 2020-12-25 | 信利光电股份有限公司 | 一种摄像模组 |
Also Published As
Publication number | Publication date |
---|---|
JP4849890B2 (ja) | 2012-01-11 |
WO2005033033A1 (ja) | 2005-04-14 |
JPWO2005033033A1 (ja) | 2007-11-15 |
TWI337514B (zh) | 2011-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |