WO2005033033A1 - Composant en verre presentant un orifice traversant et procede de production associe - Google Patents

Composant en verre presentant un orifice traversant et procede de production associe Download PDF

Info

Publication number
WO2005033033A1
WO2005033033A1 PCT/JP2004/013508 JP2004013508W WO2005033033A1 WO 2005033033 A1 WO2005033033 A1 WO 2005033033A1 JP 2004013508 W JP2004013508 W JP 2004013508W WO 2005033033 A1 WO2005033033 A1 WO 2005033033A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
glass
latent image
diameter
photosensitive glass
Prior art date
Application number
PCT/JP2004/013508
Other languages
English (en)
Japanese (ja)
Inventor
Jun Ozawa
Kazuaki Hashimoto
Original Assignee
Hoya Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corporation filed Critical Hoya Corporation
Priority to JP2005514386A priority Critical patent/JP4849890B2/ja
Publication of WO2005033033A1 publication Critical patent/WO2005033033A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/04—Compositions for glass with special properties for photosensitive glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Definitions

  • the present invention relates to a glass component having a through-hole having a uniform and fine diameter, and a method for producing the same.
  • FIG. 8 is an explanatory diagram of a method for manufacturing a glass part having a through hole disclosed in Patent Document 1.
  • a method for producing a glass component having a through hole disclosed in Patent Document 1 will be described with reference to FIG.
  • FIG. 8 is a process flow chart of a process of forming a through hole in a photosensitive glass having a substrate shape, and a side sectional view schematically showing a state in each process.
  • reference numeral 100 denotes photosensitive glass
  • 101a denotes an exposure crystallization portion
  • 101 denotes a through hole
  • 102 denotes a photomask
  • 102a denotes a light shielding film of a photomask
  • 103 denotes collimated ultraviolet light.
  • the light shielding film 102a is formed on the photomask 102 as a pattern corresponding to the desired shape and arrangement of the through holes.
  • a photomask is placed on the photosensitive glass 100, and collimated ultraviolet light 103 is irradiated.
  • an exposed crystallized portion 10 la is formed as a latent image in the photosensitive glass 100.
  • the latent image pattern corresponds to the negative pattern of the light shielding film 102a pattern of the photomask, as shown in FIG. 8 (a).
  • the exposed crystallized portion 101a is removed by etching with a hydrofluoric acid-based solution, as shown in FIG. 8 (b). A desired through-hole pattern is obtained.
  • Patent Document 2 is the same as the method disclosed in Patent Document 1 and a laser.
  • This is a method using a through hole forming method by one process in combination. That is, a through-hole smaller than a desired through-hole diameter is formed in advance by a laser processing method, and then the through-hole is formed through the above-described latent image formation by ultraviolet light irradiation, heat treatment, and etching. .
  • the through-holes that are formed by force serve to improve the circulation of the etchant in the through-holes during the etching removal performed after the heat treatment.
  • Patent Document 1 JP 2001-44639 A
  • Patent Document 2 JP 2001-105398 A
  • the conventional method of forming the through holes in the photosensitive glass uses a photomask having a pattern corresponding to a desired through hole shape or arrangement, and a pattern that follows the photolithographic technique. This was a forming method, and it was not possible to sufficiently cope with the miniaturization of through-holes.
  • FIG. 6 is an explanatory diagram of a latent image forming process by ultraviolet exposure using a conventional photomask.
  • Fig. 6 (a) is a schematic cross-sectional view schematically showing how a latent image is formed by ultraviolet exposure.
  • reference numeral 102b denotes a photomask opening
  • 81 denotes a region where a latent image is formed.
  • AA are lines indicating the surface position of the photosensitive glass 100
  • BB ', CC' are lines indicating arbitrary positions inside the substrate
  • CC ' is from the photomask 102 compared to BB, Located further away.
  • the parts with other numbers are as described above.
  • FIG. 6 (a) shows a so-called contact exposure method in which exposure is performed in a state where the photomask 102 and the photosensitive glass are in close contact with each other.
  • FIGS. 6 (b) to 6 (d) are schematic distribution curves showing the exposure dose distribution in the direction along the lines AA ′, BB ′, and CC ′, and the horizontal axis represents the distance, The vertical axis represents the exposure amount.
  • the origin O is a position corresponding to the center of the opening 102b in the photomask.
  • FIG. 6 (b) is an exposure dose distribution on the surface of the photosensitive glass 100 ( ⁇ ′ line).
  • the exposure amount distribution on the surface is represented by a box function.
  • the portion corresponding to the width of the exposure distribution equal to the width of the opening 102b and the portion immediately below the light shielding film 102a is not exposed.
  • the spread of exposure amount is widened due to the effect of light bleeding, and the light absorption in the photosensitive glass substrate is absorbed. As a result, the exposure amount is attenuated. This situation becomes more obvious at CC 'position, as shown in Fig. 6 (d).
  • FIG. 7 is a view schematically showing holes formed when a latent image forming region is removed by etching through a heat treatment after forming a latent image.
  • FIG. 7 is a schematic sectional side view showing the shape after etching removal, and reference numeral 91 denotes a hole.
  • etching also advances the surface force of the substrate.
  • the etching speed of the portion where the latent image is not formed is lower than the speed of the area where the latent image is formed, but is eroded by the etching solution which is not completely zero.
  • the etching rate of the portion where the latent image is not formed is about 1Z50 of the latent image forming portion. From this, as the etching of the latent image formation region progresses, the planar etching on the surface of the photosensitive glass also proceeds, and as a result, as shown in FIG. It will be distributed in the vertical direction.
  • the diameter of the through hole depends on both the diameter of the opening in the photomask and the light bleeding effect.
  • the opening diameter of the photomask is reduced, the minimum value of the through-hole obtained is also reduced.
  • the uniformity in the depth direction is relatively impaired.
  • the light oozing effect is determined by factors such as the parallelism of the irradiated light, the light diffraction effect, or scattering within the photosensitive glass 100. These factors are almost independent of the size of the opening 102b of the photomask, in other words, the diameter of the through hole.
  • the ratio between the through-hole diameter and the amount of enlargement of the through-hole diameter due to the light oozing effect, or the ratio between the through-hole diameter and the lack of uniformity of the through-hole diameter is small. Become. Therefore, if the through-hole diameter is sufficiently large, These fluctuations of the through-hole diameter due to the oozing-out effect are negligible values. However, the ratio increases as the through-hole diameter decreases, and as a result, it becomes very difficult to form a through-hole having a uniform diameter.
  • the present invention has been made in view of the above problems, and is a glass component using a photosensitive glass substrate as a base material, having a high aspect ratio and uniform fine through-holes having a diameter of 30 ⁇ m or less. And its manufacturing method.
  • the base of the glass part has a photosensitive glass force, and the diameter of the through hole is substantially constant regardless of the part of the through hole.
  • a glass part having a through hole characterized in that the ratio (LZd) to the diameter (d) of the hole is 15 or more and the diameter (d) is 30 ⁇ m or less.
  • the glass component provided by the present invention is
  • the photosensitive glass contains, as photosensitive materials, 0.001—0.05 wt% Au, 0.001—0.5 wt% Ag, 0.001—1 wt% Cu 0, 0.001— 0. 1% by weight of Pt
  • the first means for manufacturing the glass part is:
  • the latent image is formed by irradiating the part of the photosensitive glass substrate where the through-hole is formed with a condensed light beam to form a latent image.
  • the first step the photosensitive glass irradiated with the condensed light beam in the first step is heat-treated.
  • a glass having a through-hole characterized by comprising a second step of crystallizing the formed portion, and a third step of forming a through-hole by dissolving and removing the portion crystallized in the second step. It is a manufacturing method of components.
  • the second means is a method of manufacturing a glass part having a through-hole that is effective against the first means, and when the condensed light beam is irradiated in the first step, the beam waist of the condensed light beam is the photosensitive light beam. It is a manufacturing method of the glass component which has a through-hole characterized by being located inside the property glass.
  • the third means is
  • the position of the beam waist of the condensed light beam is on the optical axis of the condensed light beam.
  • the diameter of the through-hole, aspect ratio, or The shape of the through-hole which is the uniformity of the diameter in the depth direction, depends on both condition factors of the latent image formation process and the etching removal process, and in some cases, the latter effect is more likely to affect the former. It is considered large compared.
  • the present inventors determined the minimum value of the through-hole diameter that can be realized when forming a fine through-hole.
  • the present invention it is possible to form a through-hole having a fine and fine pore diameter and a high aspect ratio (the ratio is 15 or more) in the photosensitive glass, and the photosensitive glass having the through-hole is used as a substrate. It is possible to provide glass parts.
  • FIG. 1 is an explanatory view of a method for manufacturing a glass component having a through hole that is effective in the first embodiment of the present invention.
  • Fig. 1 (a) is a schematic side cross-sectional view schematically showing the light irradiation state during exposure
  • Fig. 1 (b) schematically shows the exposure dose distribution in each part of the photosensitive glass. It is.
  • reference numeral 21 is a condensed light beam
  • 21a is a beam waist of the condensed light beam
  • AA ' is a line indicating the central portion of the substrate-shaped photosensitive glass 100
  • BB' is a position on the surface of the photosensitive glass 100.
  • CC is a line indicating the position of the back side of the photosensitive glass 100
  • 22 is AA
  • 23 is the same distribution in the direction along BB '
  • E R Is the exposure dose and position at the intersection of the exposure distributions 22 and 23.
  • the origin position where the distance is 0
  • the horizontal axis represents AA 'or
  • the vertical axis indicates the exposure amount.
  • bundle 21 is used.
  • the exposure distribution by the condensed light beam is approximated by a Gaussian distribution.
  • the distribution at the position of the beam waist 21a (corresponding to AA, line) is the sharpest, and the peak value of the exposure amount is also the maximum.
  • the shape is as shown by reference numeral 23 in FIG. The peak value of quantity also decreases.
  • the exposure dose distribution has a point-symmetrical relationship with the beam waist position as the center of symmetry.
  • the exposure dose distribution along the CC 'line is equal to the distribution along the BB' line.
  • 2 shows the latent image formed when the exposure amount E by the condensed light beam 21 in FIG. 1 is set to the exposure critical value necessary for forming the latent image of the photosensitive glass 100 and the penetration formed based on this latent image. It is explanatory drawing of a hole.
  • FIG. 2a shows a state in which a latent image after exposure is formed
  • FIG. 2 (b) shows a state after the latent image is removed by etching.
  • reference numeral 31a is a latent image forming region
  • 31 is a formed through hole.
  • the position where the exposure dose force 3 ⁇ 4 is located is the inner central part of the photosensitive glass along the line AA ', BB, the substrate surface part along the line, CC, and the line. Back side of photosensitive glass along In part, both are in position R. Accordingly, as shown in FIG. 2A, a cylindrical latent image region 31a having a uniform radius R in the thickness direction of the photosensitive glass 100 is formed. The photosensitive glass 100 in such a state is heated and heat-treated and then etched to form a through hole 31 having a cross-sectional shape as shown in FIG.
  • the reason why the diameter of the through hole 31 is enlarged near the front and back surfaces of the photosensitive glass 100 is that, as described above, in the region where the latent image is not formed, as the etching of the latent image forming region progresses. This is because planar etching on the surface of the photosensitive glass 100 also proceeds.
  • the exposure dose distributions at all positions inside the substrate do not intersect at one point.
  • the exposure dose distribution in the region located between the AA 'line and the BB' line is a distribution showing an intermediate shape between the exposure dose distributions 22 and 23 in Fig. 1 (b).
  • the intersection between this distribution and the exposure dose distributions 22 and 23 is not the distance R in the exposure dose E, but is a different value.
  • the amount of deviation from the distance R is very small, and a cylindrical latent image having a uniform diameter is formed as shown in Fig. 2 (b).
  • FIG. 3 is an explanatory diagram of a method for manufacturing a glass part having a through hole that is effective in the second embodiment of the present invention.
  • Fig. 3a is a schematic side cross-sectional view schematically showing the light irradiation state during exposure
  • Fig. 3b is a dual view showing the exposure dose distribution in each part of the photosensitive glass.
  • DD ' is a line indicating the position where the surface force of the photosensitive glass 100 corresponds to 1Z4 of the thickness of the photosensitive glass
  • EE' corresponds to 3 Z4 of the thickness of the photosensitive glass from the surface of the photosensitive glass 100
  • 24 is the exposure amount distribution along the DD 'line
  • 41a is the latent image forming area
  • E2 is the peak value of the exposure amount distribution
  • R2 is the position where the exposure amount is E2 in the exposure amount distribution 22. is there.
  • the latent image formation region 41a is a latent image obtained when E2 is set to a value that matches the critical exposure amount for forming a latent image in the photosensitive glass 100 and the exposure is performed with the exposure amount E2.
  • the formed latent image forming area 41a has a substantially spheroid shape, and its minor axis is R2 mm. Match. Furthermore, this R2 is smaller than R in the first embodiment. However, in this latent image state, it is not possible to form a through hole that is a hole communicating with the front and back surfaces of the substrate.
  • FIG. 4 is an explanatory diagram of the two-stage exposure process
  • FIG. 5 is a diagram showing a latent image formed by the two-stage exposure.
  • reference numerals 51, 51a, 51b denote latent image forming regions.
  • Fig. 4a shows exposure when the beam waist 21a of the condensed light beam 21 is set to be located on the DD, line
  • Fig. 4b shows exposure when the beam waist 21a is set to be located on the EE 'line.
  • the case is shown schematically.
  • the exposure amount is E2 as in the case described above.
  • the two-step exposure process is a first-stage exposure process that forms a latent image 51 from the surface side to the center of the photosensitive glass 100 as shown in FIG.
  • the central force of the photosensitive glass 100 is also applied to the bottom surface to form a latent image of 5 lb.
  • the photosensitive glass 100 can obtain a continuous latent image forming region with the surface force of the photosensitive glass also on the bottom surface. Similar to the embodiment, by performing heat treatment and etching away the latent image forming region, it is possible to form a through-hole having a smaller diameter than in the first embodiment.
  • the second embodiment can be an exposure process having two or more stages without being limited to the two-stage force described for the two-stage exposure process. That is, in the multi-stage exposure process, the beam position of the condensed light beam can be set at an arbitrary position inside the substrate along the optical axis according to the irradiation exposure amount. It is possible to set the position of the beam waist also outside the substrate. Also, the method of changing the beam waist position can be changed intermittently or continuously.
  • either laser light or normal ultraviolet light can be used as the light source.
  • the present invention will be described in more detail based on examples.
  • Example 1 This example is an example of the first embodiment described above.
  • a glass substrate (trade name: PEG 3 manufactured by HOYA Corporation) having the following composition and a thickness of 0.5 mm was used.
  • the light source used is a third harmonic of a YAG laser having a wavelength of 355 nm.
  • the NA of the condensed light flux was set to 0.4.
  • pulsed light pulse width: about 6 nsec
  • the beam waist of the condensed light beam was set so as to be located at the inner central part of the photosensitive glass (the substrate surface force was also at a position of 0.25 mm).
  • the entire photosensitive glass substrate was heat-treated at 580 ° C. for 4 hours.
  • the rate of temperature rise is 1 ° CZ and the rate of temperature drop is 0.2 ° CZ.
  • a dilute hydrofluoric acid aqueous solution (about 7%) was used as an etching solution, and the etching solution was sprayed on the front and back of the photosensitive glass substrate to form through holes.
  • Table 1 shows the relationship between the integrated exposure and the through-hole diameter and aspect ratio in the vicinity of the center of the photosensitive glass substrate.
  • the shape of the through hole formed in this example is the same as the shape shown in FIG. 2b.
  • the hole diameter in the vicinity of the front and back surfaces of the substrate is larger than that in the vicinity of the center of the substrate, and the uniform through hole is formed.
  • the part where the diameter was obtained was the surface force on the front and back of the substrate as well as the partial force entering inside about 75 m. As described above, this is caused by the latent image forming area even in the area where the latent image is not formed. This is because, along with the progress of etching, planar etching on the surface of the photosensitive glass also proceeds.
  • the aspect ratios shown in Table 1 are calculated with the substrate thickness set to 0.35 mm. As shown in the table, the diameter of the through hole is increased with the increase of the integrated exposure amount. This is because the area where the latent image is formed is enlarged as the integrated exposure amount is increased.
  • This example is an example according to the second embodiment described above.
  • the conditions for forming the through holes in this example are the same as those described in Example 1 except for the exposure process.
  • the photosensitive glass substrate was exposed to the first and second exposure processes.
  • the position of the beam waist of the condensed light beam is set to the position of 1Z4 of the substrate thickness from the surface of the photosensitive glass substrate, and the second exposure process is performed.
  • the same position was set at the position 3Z4 of the surface force and substrate thickness of the photosensitive glass substrate.
  • the exposure conditions such as the first and second integrated exposure amounts are the same.
  • Table 2 shows the relationship between the integrated exposure and the through-hole diameter and aspect ratio at the center of the photosensitive glass substrate. The method for obtaining the aspect ratio is the same as in Example 1.
  • the present invention relates to a glass component having a through hole having a uniform and fine diameter and a method for producing the same, and can be used as a printed wiring board, an inkjet printing head, a gas flow meter component, or the like. .
  • FIG. 1 is an explanatory diagram of a method for manufacturing a glass part having a through hole that is effective in the first embodiment of the present invention.
  • FIG. 2 A latent image formed when the exposure amount E by the condensed light beam 21 in FIG. 1 is set to an exposure critical value necessary for forming a latent image of the photosensitive glass 100, and a latent image formed based on this latent image. It is explanatory drawing of a through-hole.
  • FIG. 3 is an explanatory diagram of a method for manufacturing a glass part having a through hole that is powerful in the second embodiment of the present invention.
  • FIG. 4 is an explanatory diagram of a two-step exposure process.
  • FIG. 5 is an explanatory diagram of a two-stage exposure process.
  • FIG. 6 is an explanatory diagram of a latent image forming process by ultraviolet exposure using a conventional photomask.
  • FIG. 7 is a diagram schematically showing holes formed when a latent image forming region is removed by etching through a heat treatment after forming a latent image.
  • FIG. 8 is an explanatory diagram of a method for producing a glass part having a through hole disclosed in Patent Document 1. Explanation of symbols

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Glass Compositions (AREA)

Abstract

L'invention concerne un composant en verre comprenant un orifice traversant uniforme et de petit diamètre. La partie permettant de former un orifice traversant en verre (100) photosensible est irradié par un flux lumineux (21) condensé, de manière à former une image latente, ledit verre photosensible étant traité à la chaleur, de manière à cristalliser la partie formée par l'image latente, et la partie cristallisée est fondue et éliminée, de manière à former un orifice traversant. L'invention concerne également un composant en verre présentant un orifice traversant à diamètre uniforme, l'emplacement de ce dernier n'étant pas pris en compte. Le rapport (L/d) entre la longueur (L) et le diamètre (d) du composant est d'au moins 15, et il présente un diamètre (d) supérieur à 3 νm.
PCT/JP2004/013508 2003-10-06 2004-09-16 Composant en verre presentant un orifice traversant et procede de production associe WO2005033033A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005514386A JP4849890B2 (ja) 2003-10-06 2004-09-16 貫通孔を有するガラス部品およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-347091 2003-10-06
JP2003347091 2003-10-06

Publications (1)

Publication Number Publication Date
WO2005033033A1 true WO2005033033A1 (fr) 2005-04-14

Family

ID=34419571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/013508 WO2005033033A1 (fr) 2003-10-06 2004-09-16 Composant en verre presentant un orifice traversant et procede de production associe

Country Status (3)

Country Link
JP (1) JP4849890B2 (fr)
TW (1) TW200520650A (fr)
WO (1) WO2005033033A1 (fr)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319198A (ja) * 2005-05-13 2006-11-24 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
JP2014501686A (ja) * 2010-11-30 2014-01-23 コーニング インコーポレイテッド ガラスに孔の高密度アレイを形成する方法
WO2015025787A1 (fr) * 2013-08-23 2015-02-26 Hoya株式会社 Procédé de fabrication d'un substrat en verre photosensible
JP2017024975A (ja) * 2015-05-18 2017-02-02 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 感光性ガラス体の連続的製造
JP2017036200A (ja) * 2015-05-18 2017-02-16 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 増感された感光性ガラスおよびその製造
JP2017036199A (ja) * 2015-05-18 2017-02-16 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ リドロー法による光構造化可能なガラス体の製造方法
US10077206B2 (en) * 2015-06-10 2018-09-18 Corning Incorporated Methods of etching glass substrates and glass substrates
JP2018199605A (ja) * 2017-05-29 2018-12-20 Ａｇｃ株式会社 ガラス基板の製造方法およびガラス基板
CN110678977A (zh) * 2017-05-25 2020-01-10 康宁股份有限公司 具有轴向可变侧壁锥度的孔的含二氧化硅基材及其形成方法
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
KR20210024689A (ko) * 2017-03-06 2021-03-05 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108710261B (zh) * 2018-06-07 2020-12-25 信利光电股份有限公司 一种摄像模组

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137345A (ja) * 1983-01-21 1984-08-07 Konishiroku Photo Ind Co Ltd 結晶化ガラス
JPH01278433A (ja) * 1988-04-30 1989-11-08 Hoya Corp 感光性ガラス物品の製造方法
JPH02255542A (ja) * 1989-03-29 1990-10-16 Hoya Corp 感光性ガラスのパターン形成方法
JPH1171139A (ja) * 1997-08-26 1999-03-16 Res Dev Corp Of Japan 微結晶分散ガラス及びその製造方法
JP2000313629A (ja) * 1999-04-27 2000-11-14 Japan Science & Technology Corp 微小穴開きガラス及びその製造方法
JP2003226548A (ja) * 2002-02-01 2003-08-12 Hoya Corp 感光性ガラス及びその加工方法並びにインクジェットプリンタ用部品の製造方法及び半導体基板の製造方法
JP2003340579A (ja) * 2002-05-24 2003-12-02 Inst Of Physical & Chemical Res 透明材料内部の処理方法およびその装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137345A (ja) * 1983-01-21 1984-08-07 Konishiroku Photo Ind Co Ltd 結晶化ガラス
JPH01278433A (ja) * 1988-04-30 1989-11-08 Hoya Corp 感光性ガラス物品の製造方法
JPH02255542A (ja) * 1989-03-29 1990-10-16 Hoya Corp 感光性ガラスのパターン形成方法
JPH1171139A (ja) * 1997-08-26 1999-03-16 Res Dev Corp Of Japan 微結晶分散ガラス及びその製造方法
JP2000313629A (ja) * 1999-04-27 2000-11-14 Japan Science & Technology Corp 微小穴開きガラス及びその製造方法
JP2003226548A (ja) * 2002-02-01 2003-08-12 Hoya Corp 感光性ガラス及びその加工方法並びにインクジェットプリンタ用部品の製造方法及び半導体基板の製造方法
JP2003340579A (ja) * 2002-05-24 2003-12-02 Inst Of Physical & Chemical Res 透明材料内部の処理方法およびその装置

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319198A (ja) * 2005-05-13 2006-11-24 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
JP2014501686A (ja) * 2010-11-30 2014-01-23 コーニング インコーポレイテッド ガラスに孔の高密度アレイを形成する方法
US9802855B2 (en) 2010-11-30 2017-10-31 Corning Incorporated Methods of forming high-density arrays of holes in glass
WO2015025787A1 (fr) * 2013-08-23 2015-02-26 Hoya株式会社 Procédé de fabrication d'un substrat en verre photosensible
US10501363B2 (en) 2015-05-18 2019-12-10 Schott Ag Method for producing photo-structurable glass bodies by a redrawing method
JP2017024975A (ja) * 2015-05-18 2017-02-02 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 感光性ガラス体の連続的製造
JP2017036200A (ja) * 2015-05-18 2017-02-16 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 増感された感光性ガラスおよびその製造
JP2017036199A (ja) * 2015-05-18 2017-02-16 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ リドロー法による光構造化可能なガラス体の製造方法
US10093575B2 (en) 2015-05-18 2018-10-09 Schott Ag Continuous production of photo-sensitive glass bodies
US10077206B2 (en) * 2015-06-10 2018-09-18 Corning Incorporated Methods of etching glass substrates and glass substrates
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR102356415B1 (ko) * 2017-03-06 2022-02-08 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
US11478880B2 (en) 2017-03-06 2022-10-25 Lpkf Laser & Electronics Ag Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process
KR20210024689A (ko) * 2017-03-06 2021-03-05 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
JP2020521332A (ja) * 2017-05-25 2020-07-16 コーニング インコーポレイテッド 軸方向に可変の側壁テーパーを有するビアを備えたシリカ含有基板、およびその形成方法
CN110678977A (zh) * 2017-05-25 2020-01-10 康宁股份有限公司 具有轴向可变侧壁锥度的孔的含二氧化硅基材及其形成方法
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP7182839B2 (ja) 2017-05-25 2022-12-05 コーニング インコーポレイテッド 軸方向に可変の側壁テーパーを有するビアを備えたシリカ含有基板、およびその形成方法
KR102491595B1 (ko) * 2017-05-25 2023-01-25 코닝 인코포레이티드 축의 방향으로 가변적인 측벽 테이퍼를 갖는 비아를 구비한 실리카-함유 기판 및 이를 형성하는 방법
KR20200013701A (ko) * 2017-05-25 2020-02-07 코닝 인코포레이티드 축의 방향으로 가변적인 측벽 테이퍼를 갖는 비아를 구비한 실리카-함유 기판 및 이를 형성하는 방법
CN110678977B (zh) * 2017-05-25 2023-10-20 康宁股份有限公司 具有轴向可变侧壁锥度的孔的含二氧化硅基材及其形成方法
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
JP2018199605A (ja) * 2017-05-29 2018-12-20 Ａｇｃ株式会社 ガラス基板の製造方法およびガラス基板
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

Also Published As

Publication number Publication date
JP4849890B2 (ja) 2012-01-11
JPWO2005033033A1 (ja) 2007-11-15
TW200520650A (en) 2005-06-16
TWI337514B (fr) 2011-02-11

Similar Documents

Publication Publication Date Title
WO2005033033A1 (fr) Composant en verre presentant un orifice traversant et procede de production associe
JP7082042B2 (ja) 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
JP5554838B2 (ja) レーザ加工方法
EP1964820B1 (fr) Procédé de travail de substrat de verre et pièce de verre
US20190362987A1 (en) Substrate with glass sheet, resin layer and through-glass via
JP2003226551A (ja) 微細孔を有するガラス板およびその製造方法
WO2004065660A1 (fr) Produit de photogravure metallique et son procede de production
JP2008156200A (ja) レーザを用いたガラスの加工方法および加工装置
US20100068453A1 (en) Method for producing processed glass substrate
JP4702794B2 (ja) 感光性ガラス基板の貫通孔形成方法
US8703410B2 (en) Substrate having a mark formed on a surface thereof by a CO2 laser beam
KR101165084B1 (ko) 레이저빔을 이용한 감광성 유리 기판의 미세패턴 형성방법
JP6963023B2 (ja) 技術的マスクの製造方法
JP6162975B2 (ja) 微細孔を備えた基板の製造方法
JP2002026466A (ja) 集光光学系及びレーザ加工機用光源
JP2012071325A (ja) 基板の加工方法
JP7020099B2 (ja) 貫通孔形成方法及び貫通孔を有するガラス基板の製造方法
JP4498004B2 (ja) 水晶振動子の製造方法
JPH03232731A (ja) 化学切削性感光性ガラス製品の分割法
JP3301655B2 (ja) 薄膜磁気ヘッドのスライダ加工方法
JP3299345B2 (ja) プリント基板の製造方法
KR101777772B1 (ko) 금속 마스터 몰드 제조방법 및 그 제조방법에 의해 제조된 마스터 몰드
JP2006000911A (ja) レーザによる加工方法
KR20240017553A (ko) 나노 홀 어레이가 형성된 금속판 제조 방법
JP2521893B2 (ja) ワイヤガイドの製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005514386

Country of ref document: JP

122 Ep: pct application non-entry in european phase