JP4847365B2 - 蒸着源および蒸着装置 - Google Patents
蒸着源および蒸着装置 Download PDFInfo
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- JP4847365B2 JP4847365B2 JP2007043094A JP2007043094A JP4847365B2 JP 4847365 B2 JP4847365 B2 JP 4847365B2 JP 2007043094 A JP2007043094 A JP 2007043094A JP 2007043094 A JP2007043094 A JP 2007043094A JP 4847365 B2 JP4847365 B2 JP 4847365B2
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- JP
- Japan
- Prior art keywords
- vapor deposition
- opening
- deposition source
- vapor
- deposition material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007740 vapor deposition Methods 0.000 title claims description 157
- 239000000463 material Substances 0.000 claims description 84
- 230000008021 deposition Effects 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 43
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 46
- 239000010408 film Substances 0.000 description 31
- 230000008020 evaporation Effects 0.000 description 17
- 238000001704 evaporation Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 12
- 239000002245 particle Substances 0.000 description 10
- 239000002994 raw material Substances 0.000 description 9
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004880 explosion Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
2、32 ドーナツ型平板
10、40 蒸着源
12、42 ヒーター
21 チャンバー
22 基板ホルダー
23 マスク
24 マスクホルダー
25 シャッター
26 膜厚モニター
Claims (4)
- 蒸着材料を内部に収容し、加熱された前記蒸着材料を放出する開口部を上部に有する筐体と、前記筐体内に配設されており前記蒸着材料を載置する複数の載置手段と、を有し、
前記複数の載置手段は上下方向に間隙を置いて複数段に配設されており、各載置手段は平面状の部材であり前記平面内に開口を有している、蒸着源において、
前記間隙は、前記載置された前記蒸着材料から発生した蒸気を前記筐体の前記開口部に導くための流動スペースであり、
各載置手段の前記開口によって、前記流動スペースと前記筐体の前記開口部とを連通する流動路が前記上下方向に形成されており、
前記流動スペースのコンダクタンスおよび前記開口部のコンダクタンスは、前記流動路のコンダクタンスより小さいことを特徴とする蒸着源。 - 各載置手段は前記筐体の前記開口部の真下には配置されておらず、前記筐体によって覆い隠されていることを特徴とする請求項1記載の蒸着源。
- 各載置手段が前記筐体の一部分と一体に形成されていて各載置手段毎に独立した構造体を形成し、前記構造体が、前記上下方向に複数積み重ねられたことを特徴とする請求項1または2記載の蒸着源。
- 請求項1ないし3いずれか1項記載の蒸着源と、チャンバーと、前記蒸着源に載置された蒸着材料を加熱する加熱手段と、被蒸着基板を保持する保持部材と、を有することを特徴とする蒸着装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007043094A JP4847365B2 (ja) | 2006-03-22 | 2007-02-23 | 蒸着源および蒸着装置 |
US11/686,058 US20070221131A1 (en) | 2006-03-22 | 2007-03-14 | Vapor deposition source and vapor deposition apparatus |
KR1020070027400A KR100869199B1 (ko) | 2006-03-22 | 2007-03-21 | 증착원 및 증착장치 |
CN2007100887960A CN101041891B (zh) | 2006-03-22 | 2007-03-22 | 汽相淀积源和汽相淀积装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006077948 | 2006-03-22 | ||
JP2006077948 | 2006-03-22 | ||
JP2007043094A JP4847365B2 (ja) | 2006-03-22 | 2007-02-23 | 蒸着源および蒸着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007284788A JP2007284788A (ja) | 2007-11-01 |
JP4847365B2 true JP4847365B2 (ja) | 2011-12-28 |
Family
ID=38532003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007043094A Active JP4847365B2 (ja) | 2006-03-22 | 2007-02-23 | 蒸着源および蒸着装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070221131A1 (ja) |
JP (1) | JP4847365B2 (ja) |
KR (1) | KR100869199B1 (ja) |
CN (1) | CN101041891B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4906018B2 (ja) * | 2001-03-12 | 2012-03-28 | 株式会社半導体エネルギー研究所 | 成膜方法、発光装置の作製方法及び成膜装置 |
KR20090128006A (ko) * | 2008-06-10 | 2009-12-15 | 삼성전자주식회사 | 마이크로 히터, 마이크로 히터 어레이, 그 제조 방법 및이를 이용한 패턴 형성 방법 |
CN101619446A (zh) * | 2008-06-30 | 2010-01-06 | 鸿富锦精密工业(深圳)有限公司 | 镀膜蒸发载具及使用该镀膜蒸发载具的真空镀膜装置 |
KR101108152B1 (ko) * | 2009-04-30 | 2012-01-31 | 삼성모바일디스플레이주식회사 | 증착 소스 |
JP4782219B2 (ja) * | 2009-07-02 | 2011-09-28 | 三菱重工業株式会社 | 真空蒸着装置 |
JP5244723B2 (ja) * | 2009-07-10 | 2013-07-24 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
KR101094307B1 (ko) * | 2010-02-02 | 2011-12-19 | 삼성모바일디스플레이주식회사 | 표시 장치를 제조하기 위한 장치 및 방법 |
WO2012124524A1 (ja) * | 2011-03-11 | 2012-09-20 | シャープ株式会社 | 蒸着粒子射出装置および蒸着装置 |
JP2014029005A (ja) * | 2012-07-05 | 2014-02-13 | Tokyo Electron Ltd | 成膜装置 |
TWI495748B (zh) * | 2013-11-28 | 2015-08-11 | Metal Ind Res & Dev Ct | 鍍膜設備 |
JP2017537228A (ja) * | 2014-11-26 | 2017-12-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 蒸発を目的としたるつぼアセンブリ |
CN106567043B (zh) * | 2016-09-18 | 2021-05-07 | 湖畔光电科技(江苏)有限公司 | 蒸镀装置及方法 |
CN107012434A (zh) * | 2017-05-27 | 2017-08-04 | 武汉天马微电子有限公司 | 一种蒸发源及真空蒸镀装置 |
US20190048460A1 (en) * | 2017-08-14 | 2019-02-14 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Evaporation Crucible and Evaporation System |
KR20220124148A (ko) * | 2020-01-07 | 2022-09-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 증발 방법, 증발 장치, 및 증발 소스 |
CN115287605B (zh) * | 2022-09-13 | 2023-11-17 | 京东方科技集团股份有限公司 | 坩埚结构及蒸镀源装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3003275B2 (ja) * | 1991-06-06 | 2000-01-24 | 松下電器産業株式会社 | 分子線源容器 |
JP3719830B2 (ja) | 1997-07-31 | 2005-11-24 | 株式会社アルバック | 金属材料用蒸発源及びこれを用いた真空処理装置 |
US6202591B1 (en) * | 1998-11-12 | 2001-03-20 | Flex Products, Inc. | Linear aperture deposition apparatus and coating process |
JP2002146516A (ja) * | 2000-11-07 | 2002-05-22 | Sony Corp | 有機薄膜の蒸着方法 |
KR100804521B1 (ko) * | 2001-10-26 | 2008-02-20 | 삼성에스디아이 주식회사 | 진공 증착장치의 가열용기 |
ATE326555T1 (de) * | 2002-07-19 | 2006-06-15 | Lg Electronics Inc | Quelle zur thermischen pvd-beschichtung für organische elektrolumineszente schichten |
KR100590235B1 (ko) * | 2002-09-17 | 2006-06-15 | 삼성에스디아이 주식회사 | 유기물 증착장치의 증착원 |
US7484315B2 (en) * | 2004-11-29 | 2009-02-03 | Tokyo Electron Limited | Replaceable precursor tray for use in a multi-tray solid precursor delivery system |
US7638002B2 (en) * | 2004-11-29 | 2009-12-29 | Tokyo Electron Limited | Multi-tray film precursor evaporation system and thin film deposition system incorporating same |
-
2007
- 2007-02-23 JP JP2007043094A patent/JP4847365B2/ja active Active
- 2007-03-14 US US11/686,058 patent/US20070221131A1/en not_active Abandoned
- 2007-03-21 KR KR1020070027400A patent/KR100869199B1/ko active IP Right Grant
- 2007-03-22 CN CN2007100887960A patent/CN101041891B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101041891B (zh) | 2010-04-21 |
JP2007284788A (ja) | 2007-11-01 |
US20070221131A1 (en) | 2007-09-27 |
KR20070095798A (ko) | 2007-10-01 |
KR100869199B1 (ko) | 2008-11-18 |
CN101041891A (zh) | 2007-09-26 |
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