JP4843123B2 - 窒化物系半導体素子およびその製造方法 - Google Patents
窒化物系半導体素子およびその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 213
- 150000004767 nitrides Chemical class 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 91
- 239000000758 substrate Substances 0.000 claims description 76
- 238000010438 heat treatment Methods 0.000 claims description 67
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 29
- 229910052763 palladium Inorganic materials 0.000 claims description 17
- 229910052697 platinum Inorganic materials 0.000 claims description 17
- 229910052750 molybdenum Inorganic materials 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
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- 238000005275 alloying Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 229910002601 GaN Inorganic materials 0.000 description 170
- 239000011777 magnesium Substances 0.000 description 101
- 229910045601 alloy Inorganic materials 0.000 description 51
- 239000000956 alloy Substances 0.000 description 51
- 239000010931 gold Substances 0.000 description 35
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 25
- 239000013078 crystal Substances 0.000 description 24
- 239000013598 vector Substances 0.000 description 14
- 125000004429 atom Chemical group 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 239000012299 nitrogen atmosphere Substances 0.000 description 9
- 125000004433 nitrogen atom Chemical group N* 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- 229910052984 zinc sulfide Inorganic materials 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- -1 gallium nitride compound Chemical class 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 2
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- MHYQBXJRURFKIN-UHFFFAOYSA-N C1(C=CC=C1)[Mg] Chemical compound C1(C=CC=C1)[Mg] MHYQBXJRURFKIN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
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- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
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- 230000000052 comparative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Description
図12は、本実施形態の窒化ガリウム系化合物半導体発光素子100aを示す断面図である。m面から1°以上の角度で傾斜した面を主面とするp型半導体領域を形成するため、本実施形態に係る窒化ガリウム系化合物半導体発光素子100aは、m面から1°以上の角度で傾斜した面を主面とするGaN基板10aを用いている。主面がm面から1°以上の角度で傾斜している基板は、一般に「オフ基板」と称される。オフ基板は、単結晶インゴットから基板をスライスし、基板の表面を研磨する工程で、意図的にm面から特定方位に傾斜した面を主面とするように作製され得る。このGaN基板10a上に、半導体積層構造20aを形成する。図12に示す半導体層22a、24a、26aは主面がm面から1°以上の角度で傾斜している。これは傾斜した基板の主面上に、各種半導体層が積層されると、これらの半導体層の表面(主面)もm面から傾斜するからである。GaN基板10aの代わりに、例えば、m面から特定方向に傾斜した面を表面とするサファイア基板やSiC基板を用いてもよい。また、本実施形態の構成においては、少なくとも半導体積層構造20aのうち、p型電極30aと接触するp型半導体領域の表面がm面から1°以上の角度で傾斜していればよい。
12、12a 基板の表面(m面)
20、20a 半導体積層構造
22、22a AluGavInwN層
24、24a 活性層
26、26a AldGaeN層
30、30a p型電極
32 Mg合金層
34 金属層(Pt層)
40、40a n型電極
42、42a 凹部
100、100a 窒化物系半導体発光素子
200 樹脂層
220 支持部材
240 反射部材
Claims (21)
- p型GaN系半導体領域を有する窒化物系半導体積層構造と、
前記p型GaN系半導体領域上に設けられた電極と
を備え、
前記p型GaN系半導体領域における主面の法線とm面の法線とが形成する角度が1°以上5°以下であり、
前記電極は、前記p型GaN系半導体領域の前記主面に接触し、Pt、MoおよびPdからなる群から選択される金属とMgとから構成されるMg合金層を含む、窒化物系半導体素子。 - 前記p型GaN系半導体領域は、AlxInyGazN(x+y+z=1,x≧0,y≧0,z≧0)半導体から形成される請求項1に記載の窒化物系半導体素子。
- 前記電極は、前記Mg合金層と、前記Mg合金層の上に形成された金属層とを含み、
前記金属層は、Pt、MoおよびPdのうち前記Mg合金層に含まれる金属から形成されている、請求項1または2に記載の窒化物系半導体素子。 - 前記窒化物系半導体積層構造は、
AlaInbGacN層(a+b+c=1,a≧0,b≧0,c≧0)を含む活性層を有し、前記活性層は光を発する、請求項1から3の何れか一つに記載の窒化物系半導体素子。 - 前記p型GaN系半導体領域はp型コンタクト層である、請求項1から4の何れか一つに記載の窒化物系半導体素子。
- 前記Mg合金層の厚さは0.1nm以上5nm以下である、請求項1から5の何れか一つに記載の窒化物系半導体素子。
- 前記Mg合金層の厚さは前記金属層の厚さ以下である、請求項3に記載の窒化物系半導体素子。
- 前記Mg合金層中のN濃度はGa濃度よりも低い、請求項1から7の何れか一つに記載の窒化物系半導体素子。
- 前記Mg合金層はアイランド状である請求項1から8の何れか一つに記載の窒化物系半導体素子。
- 前記窒化物系半導体積層構造を支持する半導体基板を有している、請求項1から9の何れか一つに記載の窒化物系半導体素子。
- 窒化物系半導体発光素子と、
前記窒化物系半導体発光素子から放射された光の波長を変換する蛍光物質を含む波長変換部と
を備える光源であって、
前記窒化物系半導体発光素子は、
p型GaN系半導体領域を有する窒化物系半導体積層構造と、
前記p型GaN系半導体領域上に設けられた電極とを備え、
前記p型GaN系半導体領域における主面の法線とm面の法線とが形成する角度が1°以上5°以下であり、
前記電極は、前記p型GaN系半導体領域の前記主面に接触し、Pt、MoおよびPdからなる群から選択される金属とMgとから構成されるMg合金層を含む、光源。 - 前記p型GaN系半導体領域は、AlxInyGazN(x+y+z=1,x≧0,y≧0,z≧0)半導体から形成される請求項11に記載の光源。
- 基板を用意する工程(a)と、
GaN系半導体からなり、前記半導体の主面の法線とm面の法線とが形成する角度が1°以上5°以下であるp型GaN系半導体領域を有する窒化物系半導体積層構造を前記基板上に形成する工程(b)と、
前記窒化物系半導体積層構造の前記p型GaN系半導体領域の前記主面上に電極を形成する工程(c)と
を含み、
前記工程(c)は、
前記p型GaN系半導体領域の前記主面上に、Pt、MoおよびPdからなる群から選択される金属とMgとから構成されるMg合金層を形成する工程を含む、窒化物系半導体素子の製造方法。 - 前記p型GaN系半導体領域は、AlxInyGazN(x+y+z=1,x≧0,y≧0,z≧0)半導体から形成される請求項13に記載の窒化物系半導体素子の製造方法。
- 前記Mg合金層を形成する工程は、
前記p型GaN系半導体領域の前記主面上に、Mg層を形成する工程と、
前記Mg層の上に、Pt、MoおよびPdからなる群から選択される導電層を形成する工程と、
加熱処理を行なうことにより、前記Mg層と前記導電層の少なくとも一部とを合金化する工程とを含む、請求項13または14に記載の窒化物系半導体素子の製造方法。 - 前記加熱処理は、500℃以上700℃以下の温度で実行される、請求項15に記載の窒化物系半導体素子の製造方法。
- 前記加熱処理は、550℃以上650℃以下の温度で実行される、請求項16に記載の窒化物系半導体素子の製造方法。
- 前記Mg層を形成する工程は、パルス的に電子ビームを照射することによってMgを前記p型GaN系半導体領域の前記主面の上に蒸着させることを実行する、請求項15から17の何れか一つに記載の窒化物系半導体素子の製造方法。
- 前記Mg層は0.1nm以上5nm以下の厚さで前記窒化物系半導体積層構造の上に堆積される、請求項15から18の何れか一つに記載の窒化物系半導体素子の製造方法。
- 前記工程(b)を実行した後において、前記基板を除去する工程を含む、請求項13から19の何れか一つに記載の窒化物系半導体素子の製造方法。
- 前記Mg合金層を形成する工程は、
Mgと、Pt、MoおよびPdからなる群から選択される金属との混合物または化合物を、前記p型GaN系半導体領域の前記主面上に蒸着する工程と、
加熱処理を行なう工程とを含む、請求項13または14に記載の窒化物系半導体素子の製造方法。
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