JP4841550B2 - 発光素子及びその製造方法並びにこれを用いた発光装置 - Google Patents

発光素子及びその製造方法並びにこれを用いた発光装置 Download PDF

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Publication number
JP4841550B2
JP4841550B2 JP2007519123A JP2007519123A JP4841550B2 JP 4841550 B2 JP4841550 B2 JP 4841550B2 JP 2007519123 A JP2007519123 A JP 2007519123A JP 2007519123 A JP2007519123 A JP 2007519123A JP 4841550 B2 JP4841550 B2 JP 4841550B2
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Japan
Prior art keywords
light emitting
semiconductor layer
type semiconductor
substrate
emitting cells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2007519123A
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English (en)
Japanese (ja)
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JP2008505478A (ja
JP2008505478A5 (enExample
Inventor
ジョン−フン イ，
イ，ゴン−ヨン
イブ，ラクロイク
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Seoul Viosys Co Ltd
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Seoul Viosys Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35783103&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4841550(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from KR1020040087379A external-priority patent/KR100961483B1/ko
Priority claimed from KR20040104569A external-priority patent/KR20060065954A/ko
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of JP2008505478A publication Critical patent/JP2008505478A/ja
Publication of JP2008505478A5 publication Critical patent/JP2008505478A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/36—Circuits for reducing or suppressing harmonics, ripples or electromagnetic interferences [EMI]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2007519123A 2004-06-30 2005-06-29 発光素子及びその製造方法並びにこれを用いた発光装置 Expired - Fee Related JP4841550B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR10-2004-0049906 2004-06-30
KR20040049906 2004-06-30
KR10-2004-0087379 2004-10-29
KR1020040087379A KR100961483B1 (ko) 2004-06-30 2004-10-29 다수의 셀이 결합된 발광 소자 및 이의 제조 방법 및 이를이용한 발광 장치
KR20040104569A KR20060065954A (ko) 2004-12-11 2004-12-11 다수의 셀이 결합된 발광 소자 및 이의 제조 방법
KR10-2004-0104569 2004-12-11
PCT/KR2005/002033 WO2006004337A1 (en) 2004-06-30 2005-06-29 Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2009263499A Division JP2010034610A (ja) 2004-06-30 2009-11-19 発光素子及びその製造方法並びにこれを用いた発光装置
JP2010114024A Division JP2010177712A (ja) 2004-06-30 2010-05-18 発光素子及びその製造方法並びにこれを用いた発光装置
JP2011138196A Division JP5777948B2 (ja) 2004-06-30 2011-06-22 発光ダイオード

Publications (3)

Publication Number Publication Date
JP2008505478A JP2008505478A (ja) 2008-02-21
JP2008505478A5 JP2008505478A5 (enExample) 2010-01-14
JP4841550B2 true JP4841550B2 (ja) 2011-12-21

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JP2007519123A Expired - Fee Related JP4841550B2 (ja) 2004-06-30 2005-06-29 発光素子及びその製造方法並びにこれを用いた発光装置
JP2009263499A Withdrawn JP2010034610A (ja) 2004-06-30 2009-11-19 発光素子及びその製造方法並びにこれを用いた発光装置
JP2010114024A Withdrawn JP2010177712A (ja) 2004-06-30 2010-05-18 発光素子及びその製造方法並びにこれを用いた発光装置
JP2011138196A Expired - Lifetime JP5777948B2 (ja) 2004-06-30 2011-06-22 発光ダイオード

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Application Number Title Priority Date Filing Date
JP2009263499A Withdrawn JP2010034610A (ja) 2004-06-30 2009-11-19 発光素子及びその製造方法並びにこれを用いた発光装置
JP2010114024A Withdrawn JP2010177712A (ja) 2004-06-30 2010-05-18 発光素子及びその製造方法並びにこれを用いた発光装置
JP2011138196A Expired - Lifetime JP5777948B2 (ja) 2004-06-30 2011-06-22 発光ダイオード

Country Status (4)

Country Link
US (7) US7804098B2 (enExample)
EP (3) EP2733744A1 (enExample)
JP (4) JP4841550B2 (enExample)
WO (1) WO2006004337A1 (enExample)

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