CN201327829Y - 整流发光二极管装置 - Google Patents

整流发光二极管装置 Download PDF

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Publication number
CN201327829Y
CN201327829Y CNU2008201804908U CN200820180490U CN201327829Y CN 201327829 Y CN201327829 Y CN 201327829Y CN U2008201804908 U CNU2008201804908 U CN U2008201804908U CN 200820180490 U CN200820180490 U CN 200820180490U CN 201327829 Y CN201327829 Y CN 201327829Y
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light
emitting diode
led
rectifier
assembly
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刘天明
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MLS Co Ltd
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Mls Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)

Abstract

一种发光二极管装置，包括基座，封装体，其中封装体内具有整流二极管芯片和发光二极管芯片，整流二极管芯片和发光二极管芯片通过金属连接线串联。此发光二极管体积小，操作方便，可直接插入LED灯串灯座使用，插件及更换比较方便，要实现半波、全波、桥式整流等功能，透过不同的LED连接即可达到预期之效果。

Description

整流发光二极管装置
技术领域
本实用新型涉及一种发光二极管(Light Emitting Diode，LED)装置，尤其是涉及一种兼具整流作用的发光二极管装置。
背景技术
发光二极管目前广泛应用于灯饰产业，与小白炽灯泡和氖灯相比，发光二极管的特点是：工作电压很低(有的仅一点几伏)；工作电流很小(有的仅零点几毫安即可发光)；抗冲击和抗震性能好，可靠性高，寿命长；通过调制通过的电流强弱可以方便地调制发光的强弱。
但是，现有LED灯的发光二极管，只可发光不具备整流功能，客户在接电使用时须外接整流二极管电路或者内接整流二极管方可使用，在实际应用中，此方案有结构繁琐、器件众多、体积过大等缺点。价格也较高。
实用新型内容
针对现有技术的上述缺陷，本实用新型目的是提供一种体积小，成本低，外形结构简单，使用方便的发光二极管装置，其可通过不同的连接方式实现相应的整流功能。
为了实现以上目的，本实用新型的具体实现方案为：
一种发光二极管装置，包括基座，封装体，所述封装体内具有整流二极管芯片和发光二极管芯片，所述整流二极管芯片和发光二极管芯片通过金属连接线串联。
其中，所述封装体为环氧树脂封装体。
其中，所述发光二极管芯片可发射380-1000nm波长的光源。
根据本实用新型，还提供了一种LED桥接整流控制器，包括插头，LED发光组合体，桥式整流件，电阻，所述桥式整流件由四个发光二极管装置桥接而成。
根据本实用新型，还提供了一种LED半波整流控制器，包括插头，LED发光组合体，半波整流件，电阻，所述半波整流件由一个发光二极管装置组成。
根据本实用新型，还提供了一种LED全波整流控制器，包括插头，LED发光组合体，全波整流件，电阻，所述全波整流件由两个发光二极管装置组成。
其中，所述LED发光组合体由至少两个LED发光管串联组合而成。
本实用新型的有益效果在于：1)采用此发光二极管装置，LED灯无需外接整流二极管，即可在正常发光的同时实现整流的功能。2)此发光二极管体积小，操作方便，可直接插入LED灯串灯座使用，插件及更换比较方便，要实现半波、全波、桥式整流等功能，透过不同的LED连接即可达到预期之效果。3)此LED由于和整流二极管芯片串联，其反向耐压比一般的LED高100倍。
附图说明
图1是本实用新型的发光二极管装置的结构图。
图2是本实用新型的桥式整流控制器的电路图。
图3是本实用新型的半波整流控制器的电路图。
图4是本实用新型的全波整流控制器的电路图。
图5是本实用新型的发光二极管装置的伏安特性曲线图。
具体实施方式
下面将结合附图对本实用新型进行详细说明：
图1表示本实用新型的发光二极管装置，它是在现有的发光二极管的基础上，整合了一个整流二极管构成的组合装置，其结构就是在封装体1的内部，封装两个二极管管芯，一个是整流二极管芯片2，另一个是发光二极管芯片3，两个管芯通过金属接4极性相同的串联在一起，然后通过基座5，6引出。该发光二极管的封装体可为玻璃封装体，金属封装体或者塑料封装体，本实用新型的封装体为塑料封装体，是环氧树脂封装体。该发光二极管芯片3可发射380-1000nm波长的光源。采用这种结构的发光二极管装置，LED灯无需外接整流二极管，即可在正常发光的同时实现整流的功能。此外，发光二极管由于和整流二极管芯片串联，其反向耐压比一般的LED高100倍，图5本实用新型的发光二极管装置的伏安特性曲线。其反向击穿电压可达400多伏，最高反向工作电压可达200多伏。
此外，通过对此发光二极管装置进行不同的连接，可实现半波、全波、桥式整流等功能。图2，图3和图4是利用本实用新型的发光二极管装置分别进行不同的电路连接后组成的控制器。由插头7，LED发光组合体8，电阻10，以及相应的由本实用新型的发光二极管组成的桥式整流电路9，半波整流电路11和全波整流电路12组成，从而实现相应的桥式整流、半波整流和全波整流的功能。这样，本实用新型的发光二极管装置便可同时实现发光和整流的功能，且体积小，操作方便，可直接插入LED灯串灯座使用，插件及更换比较方便。
以上公开的仅为本实用新型的一个具体实施例，但是，本实用新型并非局限于此。在不背离本实用新型精神及其实质的情况下，熟悉本领域的技术人员可以根据本实用新型进行各种相应的改动和变形，但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。

Claims (7)

1.一种发光二极管装置，包括基座(5，6)，封装体(1)，其特征在于，所述封装体(1)内具有整流二极管芯片(2)和发光二极管芯片(3)，所述整流二极管芯片(2)和发光二极管芯片(3)通过金属连接线(4)串联。
2.如权利要求1所述的发光二极管装置，其特征在于，所述封装体(1)为环氧树脂封装体。
3.如权利要求2所述的发光二极管装置，其特征在于，所述发光二极管芯片(3)可发射380-1000nm波长的光源。
4.一种LED桥接整流控制器，包括插头(7)，LED发光组合体(8)，桥式整流件(9)，电阻(10)，其特征在于，所述桥式整流件(9)由四个如权利要求3所述的发光二极管装置桥接而成。
5.一种LED半波整流控制器，包括插头(7)，LED发光组合体(8)，半波整流件(11)，电阻(10)，其特征在于，所述半波整流件(11)由一个如权利要求3所述的发光二极管装置组成。
6.一种LED全波整流控制器，包括插头(7)，LED发光组合体(8)，全波整流件(12)，电阻(10)，其特征在于，所述全波整流件(12)由两个如权利要求3所述的发光二极管装置组成。
7.如权利要求4或5或6所述的LED桥接整流控制器，其特征在于，所述LED发光组合体(8)由至少两个LED发光管串联组合而成。
CNU2008201804908U 2008-12-03 2008-12-03 整流发光二极管装置 Expired - Fee Related CN201327829Y (zh)

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US12/626,257 US8267554B2 (en) 2008-12-03 2009-11-25 Light emitting diode device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102006695A (zh) * 2010-12-03 2011-04-06 贵阳世纪天元科技有限公司 Led照明电路的集成方法及led照明集成芯片

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KR101902392B1 (ko) 2011-10-26 2018-10-01 엘지이노텍 주식회사 발광 소자

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US5463280A (en) * 1994-03-03 1995-10-31 National Service Industries, Inc. Light emitting diode retrofit lamp
JP3686569B2 (ja) * 2000-03-02 2005-08-24 シャープ株式会社 半導体発光装置及びそれを用いた表示装置
EP1787336B1 (en) * 2004-06-30 2016-01-20 Seoul Viosys Co., Ltd Light emitting element comprising a plurality of electrically connected light emitting cells and method of manufacturing the same
JP2006352064A (ja) * 2005-05-19 2006-12-28 Toyoda Gosei Co Ltd Ｌｅｄランプ及びｌｅｄランプ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102006695A (zh) * 2010-12-03 2011-04-06 贵阳世纪天元科技有限公司 Led照明电路的集成方法及led照明集成芯片

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