JP4792403B2 - 回路基板エレメントの製造方法および回路基板エレメント - Google Patents
回路基板エレメントの製造方法および回路基板エレメント Download PDFInfo
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- JP4792403B2 JP4792403B2 JP2006549760A JP2006549760A JP4792403B2 JP 4792403 B2 JP4792403 B2 JP 4792403B2 JP 2006549760 A JP2006549760 A JP 2006549760A JP 2006549760 A JP2006549760 A JP 2006549760A JP 4792403 B2 JP4792403 B2 JP 4792403B2
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- noble metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49085—Thermally variable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Vending Machines For Individual Products (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Ropes Or Cables (AREA)
Description
a)銅導体層を(通常は、写真平板処理におけるエッチングによって)構築する工程
b)導体層の表面を粗面化する工程
c)貴金属層を付与する工程
d)構成要素(例えば、PTFレジスタ)を付与する工程
e)加圧して多層にする工程
a)導体層を構築する工程
b’)導体層に別個の接着促進剤を(通常は、酸化処理によって、および、有機成分の助けによって)付与する工程
c’)フォトレジスト層を付与および構築する工程
c’’)貴金属層を部分的に付与する工程
c’’’)フォトレジスト層を除去する工程
d)構成要素を付与する工程
e)加圧して多層にする工程
Claims (18)
- 少なくとも1つの導体層(13)を備えるプリント回路基板支持体(12)から開始するプリント回路基板エレメントの製造方法であって、該導体層は、構築され、ならびに、表面部分が粗面化され、そして、該構築および粗面化した導体層(13)の全体に貴金属層(16)を付与し、対応する凹凸(8’)を該貴金属層の表面に提供した後、表面が粗い貴金属層(16)の部分に少なくとも1つのPTF電気構成要素(4)を刷込によって付与することを特徴とする、製造方法。
- 0.05μm〜5μm、例えば、0.3μm〜3μm、好ましくは0.5μm〜1μmの範囲の凹凸(8)を伴って、導体層(13)の表面を粗面化することを特徴とする、請求項1に記載の方法。
- 導体層(13)の表面を化学エッチング、イオンエッチング、機械加工または電気的に電気メッキによって粗面化することを特徴とする、請求項1または2に記載の方法。
- 0.02μm〜1μm、好ましくは0.02μm〜0.5μmの厚さの貴金属層(16)を導体層(13)に付与することを特徴とする、請求項1〜3のいずれか1項に記載の方法。
- 貴金属層(16)を導体層(13)に化学的な電流なしの様式によって、電気的な様式の電気メッキによって、カソードエバポレーションによって、あるいは、スパッタリングによって、付与することを特徴とする、請求項1〜4のいずれか1項に記載の方法。
- 銀、金、パラジウムおよび白金からなる群の少なくとも1つの金属で作製された層を貴金属層(16)として使用することを特徴とする、請求項1〜5のいずれか1項に記載の方法。
- PTF電気構成要素(4)が、レジスタであることを特徴とする、請求項1〜6のいずれか1項に記載の方法。
- 粗面化した導体層(13)に貴金属層(16)を付与した後、なおかつ、PTF電気構成要素(4)と、表面が粗い貴金属層(16)とが重なるようにPTF電気構成要素(4)をプリント回路基板支持体(12)の上側に載置した後、さらなるプリント回路基板構造(1’)を付与し、そしてこのようにして形成された多層体を加圧することを特徴とする、請求項1〜7のいずれか1項に記載の方法。
- 粗面化した導体層(13)に貴金属層(16)を付与した後、なおかつ、PTF電気構成要素(4)と、表面が粗い貴金属層(16)とが重なるようにPTF電気構成要素(4)をプリント回路基板支持体(12)の上側に載置した後、ソルダーストップマスクを付与することを特徴とする、請求項1〜7のいずれか1項に記載の方法。
- 2つの導体層(13、13’)を備えたプリント回路基板支持体(12)を使用することを特徴とし、少なくとも1つの導体層が構築および粗面化されている、請求項1〜9のいずれか1項に記載の方法。
- 構築した後、導体層の表面部分を粗面化することを特徴とする、請求項1〜10のいずれか1項に記載の方法。
- 支持体(12)と、該支持体(12)上に構築された少なくとも1つの導体層(13)とを備えたプリント回路基板エレメントであって、導体層(13)が、粗面化された表面(8)を有し、粗面化した導体層(13)の全体に、表面が粗い貴金属層(16)が配置され、そして、表面が粗い貴金属層(16)の部分に、少なくとも1つの刷り込まれたPTF電気構成要素(4)を付与し、表面が粗い貴金属層(16)が、接着を促進する層として形成され、なおかつ、接触を促進して接触を安定化させる層となることを特徴とする、プリント回路基板エレメント。
- 表面が粗い貴金属層(16)にさらなるプリント回路基板構造(1’)を提供し、多層配置を形成していることを特徴とする、請求項12に記載のプリント回路基板エレメント。
- PTF電気構成要素(4)が、レジスタであることを特徴とする、請求項12または13に記載のプリント回路基板エレメント。
- 導体層(13)および貴金属層(16)が、それぞれ、0.05μm〜5μm、例えば、0.3μm〜3μm、好ましくは0.5μm〜1μmの表面凹凸(8、8’)を有する
ことを特徴とする、請求項12〜14のいずれか1項に記載のプリント回路基板エレメント。 - 貴金属層(16)が、0.02μm〜1μm、好ましくは0.02μm〜0.5μmの厚さを有することを特徴とする、請求項12〜15のいずれか1項に記載のプリント回路基板エレメント。
- 貴金属層(16)が、銀、金、パラジウムおよび白金からなる群から選ばれる少なくとも1つの金属を有することを特徴とする、請求項12〜16のいずれか1項に記載のプリント回路基板エレメント。
- 支持体(12)が、2つの構築された導体層(13、13’)を有し、少なくとも1つの該導体層に貴金属層(16)を付与することを特徴とする、請求項12〜17のいずれか1項に記載のプリント回路基板エレメント。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0008504A AT500807B1 (de) | 2004-01-23 | 2004-01-23 | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement |
ATA85/2004 | 2004-01-23 | ||
PCT/AT2005/000010 WO2005072035A1 (de) | 2004-01-23 | 2005-01-21 | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007519243A JP2007519243A (ja) | 2007-07-12 |
JP4792403B2 true JP4792403B2 (ja) | 2011-10-12 |
Family
ID=34800049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006549760A Expired - Fee Related JP4792403B2 (ja) | 2004-01-23 | 2005-01-21 | 回路基板エレメントの製造方法および回路基板エレメント |
Country Status (7)
Country | Link |
---|---|
US (2) | US7552525B2 (ja) |
EP (1) | EP1707037B1 (ja) |
JP (1) | JP4792403B2 (ja) |
AT (2) | AT500807B1 (ja) |
CA (1) | CA2554113A1 (ja) |
DE (1) | DE502005008821D1 (ja) |
WO (1) | WO2005072035A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8390083B2 (en) | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
US9202782B2 (en) | 2013-01-07 | 2015-12-01 | Intel Corporation | Embedded package in PCB build up |
CN104576883B (zh) | 2013-10-29 | 2018-11-16 | 普因特工程有限公司 | 芯片安装用阵列基板及其制造方法 |
US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
CN113130334B (zh) * | 2019-12-31 | 2024-06-18 | 盛合晶微半导体(江阴)有限公司 | 提高底部金属与焊垫辨识度的方法 |
AT17082U1 (de) * | 2020-04-27 | 2021-05-15 | Zkw Group Gmbh | Verfahren zur befestigung eines elektronischen bauteils |
Citations (4)
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JPS6442896A (en) * | 1987-08-10 | 1989-02-15 | Furukawa Electric Co Ltd | Printed circuit board with printed resistor |
JP2000082871A (ja) * | 1998-07-08 | 2000-03-21 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JP2000315854A (ja) * | 1999-04-30 | 2000-11-14 | Ibiden Co Ltd | プリント配線板とその製造方法 |
JP2001015927A (ja) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
Family Cites Families (19)
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JPS63262476A (ja) * | 1987-04-17 | 1988-10-28 | Meiban Kogei Kk | パタ−ンの形成方法 |
US4870746A (en) * | 1988-11-07 | 1989-10-03 | Litton Systems, Inc. | Method of making a multilayer printed circuit board having screened-on resistors |
JPH02174188A (ja) * | 1988-12-26 | 1990-07-05 | Hitachi Chem Co Ltd | セラミツク配線板の製造法 |
JPH0478471A (ja) * | 1990-07-19 | 1992-03-12 | Shimada Phys & Chem Ind Co Ltd | 超音波振動体及びその製造方法 |
JPH06260741A (ja) * | 1993-03-08 | 1994-09-16 | Denki Kagaku Kogyo Kk | 金属ベース回路基板の製造方法 |
KR100269580B1 (ko) * | 1994-12-01 | 2000-10-16 | 엔도 마사루 | 다층 프린트 배선판 및 그 제조방법(multilayer printed wiring board and process for producing the same) |
US6835895B1 (en) * | 1996-12-19 | 2004-12-28 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
US6242079B1 (en) * | 1997-07-08 | 2001-06-05 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
JPH11121926A (ja) * | 1997-10-14 | 1999-04-30 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
US6376049B1 (en) * | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
US6329899B1 (en) * | 1998-04-29 | 2001-12-11 | Microcoating Technologies, Inc. | Formation of thin film resistors |
EP1102523A4 (en) | 1998-07-08 | 2005-11-30 | Ibiden Co Ltd | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD |
US6256866B1 (en) * | 1999-05-11 | 2001-07-10 | Motorola, Inc. | Polymer thick-film resistor printed on planar circuit board surface |
JP2001121053A (ja) * | 1999-10-26 | 2001-05-08 | Ibiden Co Ltd | 塗布用ロールコータおよびそれを用いたプリント配線板の製造方法 |
DE10050862C2 (de) | 2000-10-06 | 2002-08-01 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
KR100463434B1 (ko) * | 2001-12-04 | 2004-12-23 | 삼성전기주식회사 | 매립된 레지스터를 갖는 인쇄회로기판 및 이의 제조방법 |
CA2468850A1 (en) * | 2001-12-04 | 2003-07-31 | Lifepoint, Inc. | Device and method for the identification of analytes in bodily fluids |
EP1327995A3 (en) | 2002-01-11 | 2005-10-12 | Shipley Co. L.L.C. | Resistor structure |
US7038571B2 (en) * | 2003-05-30 | 2006-05-02 | Motorola, Inc. | Polymer thick film resistor, layout cell, and method |
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2004
- 2004-01-23 AT AT0008504A patent/AT500807B1/de not_active IP Right Cessation
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2005
- 2005-01-21 JP JP2006549760A patent/JP4792403B2/ja not_active Expired - Fee Related
- 2005-01-21 WO PCT/AT2005/000010 patent/WO2005072035A1/de active Application Filing
- 2005-01-21 DE DE502005008821T patent/DE502005008821D1/de active Active
- 2005-01-21 AT AT05700011T patent/ATE454807T1/de not_active IP Right Cessation
- 2005-01-21 US US10/585,476 patent/US7552525B2/en not_active Expired - Fee Related
- 2005-01-21 CA CA002554113A patent/CA2554113A1/en not_active Abandoned
- 2005-01-21 EP EP05700011A patent/EP1707037B1/de active Active
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2009
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6442896A (en) * | 1987-08-10 | 1989-02-15 | Furukawa Electric Co Ltd | Printed circuit board with printed resistor |
JP2000082871A (ja) * | 1998-07-08 | 2000-03-21 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JP2000315854A (ja) * | 1999-04-30 | 2000-11-14 | Ibiden Co Ltd | プリント配線板とその製造方法 |
JP2001015927A (ja) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE502005008821D1 (de) | 2010-02-25 |
AT500807B1 (de) | 2006-11-15 |
US7552525B2 (en) | 2009-06-30 |
US20070143991A1 (en) | 2007-06-28 |
EP1707037B1 (de) | 2010-01-06 |
WO2005072035A1 (de) | 2005-08-04 |
US8039755B2 (en) | 2011-10-18 |
CA2554113A1 (en) | 2005-08-04 |
JP2007519243A (ja) | 2007-07-12 |
US20090229867A1 (en) | 2009-09-17 |
EP1707037A1 (de) | 2006-10-04 |
ATE454807T1 (de) | 2010-01-15 |
AT500807A1 (de) | 2006-03-15 |
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