JP4781961B2 - 電子装置及び照明器具 - Google Patents

電子装置及び照明器具 Download PDF

Info

Publication number
JP4781961B2
JP4781961B2 JP2006273796A JP2006273796A JP4781961B2 JP 4781961 B2 JP4781961 B2 JP 4781961B2 JP 2006273796 A JP2006273796 A JP 2006273796A JP 2006273796 A JP2006273796 A JP 2006273796A JP 4781961 B2 JP4781961 B2 JP 4781961B2
Authority
JP
Japan
Prior art keywords
heat
solder
case
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006273796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008091817A (ja
JP2008091817A5 (https=
Inventor
信一 芝原
典明 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp
Priority to JP2006273796A priority Critical patent/JP4781961B2/ja
Publication of JP2008091817A publication Critical patent/JP2008091817A/ja
Publication of JP2008091817A5 publication Critical patent/JP2008091817A5/ja
Application granted granted Critical
Publication of JP4781961B2 publication Critical patent/JP4781961B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006273796A 2006-10-05 2006-10-05 電子装置及び照明器具 Expired - Fee Related JP4781961B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006273796A JP4781961B2 (ja) 2006-10-05 2006-10-05 電子装置及び照明器具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006273796A JP4781961B2 (ja) 2006-10-05 2006-10-05 電子装置及び照明器具

Publications (3)

Publication Number Publication Date
JP2008091817A JP2008091817A (ja) 2008-04-17
JP2008091817A5 JP2008091817A5 (https=) 2009-11-12
JP4781961B2 true JP4781961B2 (ja) 2011-09-28

Family

ID=39375627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006273796A Expired - Fee Related JP4781961B2 (ja) 2006-10-05 2006-10-05 電子装置及び照明器具

Country Status (1)

Country Link
JP (1) JP4781961B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130099313A (ko) * 2012-02-29 2013-09-06 엘지이노텍 주식회사 조명 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5343542B2 (ja) * 2008-12-08 2013-11-13 三菱電機株式会社 点灯装置及びこの点灯装置を備える照明器具
KR101229656B1 (ko) * 2011-08-24 2013-02-04 김근배 스위칭 모드 파워 서플라이의 방열구조
JP6200693B2 (ja) * 2013-05-24 2017-09-20 日立オートモティブシステムズ株式会社 電子制御装置
JP2013254742A (ja) * 2013-07-30 2013-12-19 Mitsubishi Electric Corp 点灯装置
JP2024078656A (ja) * 2022-11-30 2024-06-11 パナソニックＩｐマネジメント株式会社 照明器具

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2567974B2 (ja) * 1990-06-30 1996-12-25 株式会社テック 放電灯点灯装置
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JPH10224065A (ja) * 1997-02-05 1998-08-21 Japan Servo Co Ltd 電子回路の放熱構造
JPH10308484A (ja) * 1997-05-08 1998-11-17 Casio Comput Co Ltd 電子機器の放熱構造
JPH11213737A (ja) * 1998-01-22 1999-08-06 Toshiba Tec Corp 放電灯器具
JP4200876B2 (ja) * 2003-10-28 2008-12-24 株式会社明電舎 電子機器の冷却構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130099313A (ko) * 2012-02-29 2013-09-06 엘지이노텍 주식회사 조명 장치

Also Published As

Publication number Publication date
JP2008091817A (ja) 2008-04-17

Similar Documents

Publication Publication Date Title
TWI413221B (zh) 電子封裝結構
JPWO2010067725A1 (ja) 回路モジュール
KR20090028415A (ko) 소켓
JP2009272487A (ja) 電子部品
CN101361185B (zh) 半导体封装的安装装置
JP2020047765A (ja) 電気機器及び放熱器
CN107251669A (zh) 基板单元
TWI495423B (zh) 散熱模組及採用該散熱模組之電子裝置
JP5222838B2 (ja) 制御装置
JP2012253135A (ja) 放熱構造
JP5068098B2 (ja) 放熱装置
JP4781961B2 (ja) 電子装置及び照明器具
JP2008072062A (ja) 実装構造、およびこれを備えた電子機器
JP2011187729A (ja) 電界放射低減構造
CN113268127A (zh) 电子设备
JP2019075415A (ja) 半導体装置
JPH077109A (ja) パッケージの実装構造
JP2006286757A (ja) 電子機器の放熱構造
JP2002290091A (ja) 放熱構造を有する電子回路装置
JP2006041199A (ja) 電子装置
TWI413889B (zh) 散熱裝置
JP2011066281A (ja) 発熱デバイス
JP2005347436A (ja) ドライバｉｃの放熱構造及び発熱部品の放熱構造。
JP2008288379A (ja) 半導体パッケージ
WO2023276647A1 (ja) 回路構成体及び電気接続箱

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090925

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090925

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110222

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110705

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110706

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140715

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4781961

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees