JP4776154B2 - 圧電体素子、インクジェット記録ヘッド、圧電体素子の製造方法 - Google Patents
圧電体素子、インクジェット記録ヘッド、圧電体素子の製造方法 Download PDFInfo
- Publication number
- JP4776154B2 JP4776154B2 JP2003311305A JP2003311305A JP4776154B2 JP 4776154 B2 JP4776154 B2 JP 4776154B2 JP 2003311305 A JP2003311305 A JP 2003311305A JP 2003311305 A JP2003311305 A JP 2003311305A JP 4776154 B2 JP4776154 B2 JP 4776154B2
- Authority
- JP
- Japan
- Prior art keywords
- lower electrode
- diaphragm
- piezoelectric element
- piezoelectric film
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14298—Structure of print heads with piezoelectric elements of disc type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1617—Production of print heads with piezoelectric elements of disc type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003311305A JP4776154B2 (ja) | 2003-09-03 | 2003-09-03 | 圧電体素子、インクジェット記録ヘッド、圧電体素子の製造方法 |
| US10/928,277 US7399066B2 (en) | 2003-09-03 | 2004-08-30 | Piezoelectric element, ink jet recording head and producing method for piezoelectric element |
| CNB2004100686169A CN100376395C (zh) | 2003-09-03 | 2004-09-03 | 压电体元件、喷墨记录头和压电体元件的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003311305A JP4776154B2 (ja) | 2003-09-03 | 2003-09-03 | 圧電体素子、インクジェット記録ヘッド、圧電体素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005079507A JP2005079507A (ja) | 2005-03-24 |
| JP2005079507A5 JP2005079507A5 (enExample) | 2006-09-14 |
| JP4776154B2 true JP4776154B2 (ja) | 2011-09-21 |
Family
ID=34412908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003311305A Expired - Fee Related JP4776154B2 (ja) | 2003-09-03 | 2003-09-03 | 圧電体素子、インクジェット記録ヘッド、圧電体素子の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7399066B2 (enExample) |
| JP (1) | JP4776154B2 (enExample) |
| CN (1) | CN100376395C (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005083809A1 (en) | 2004-02-27 | 2005-09-09 | Canon Kabushiki Kaisha | Piezoelectric thin film, method of manufacturing piezoelectric thin film, piezoelectric element, and ink jet recording head |
| CN1968815B (zh) * | 2004-06-28 | 2013-05-01 | 佳能株式会社 | 排液头制造方法,和使用该方法得到的排液头 |
| JP4793568B2 (ja) * | 2005-07-08 | 2011-10-12 | セイコーエプソン株式会社 | アクチュエータ装置、液体噴射ヘッド及び液体噴射装置 |
| US8669694B2 (en) * | 2005-11-29 | 2014-03-11 | Kyocera Corporation | Multi-layer electronic component and method for manufacturing the same |
| US8623737B2 (en) * | 2006-03-31 | 2014-01-07 | Intel Corporation | Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same |
| US7456548B2 (en) * | 2006-05-09 | 2008-11-25 | Canon Kabushiki Kaisha | Piezoelectric element, piezoelectric actuator, and ink jet recording head |
| JP5300184B2 (ja) * | 2006-07-18 | 2013-09-25 | キヤノン株式会社 | 圧電体、圧電体素子、圧電体素子を用いた液体吐出ヘッド及び液体吐出装置 |
| JP2010167570A (ja) * | 2009-01-20 | 2010-08-05 | Seiko Epson Corp | 液体噴射ヘッドの製造方法、アクチュエーター装置の製造方法、液体噴射ヘッド及び液体噴射装置 |
| JP5463816B2 (ja) * | 2009-09-16 | 2014-04-09 | セイコーエプソン株式会社 | 液滴噴射ヘッド、液滴噴射装置及び圧電アクチュエーター |
| US8499453B2 (en) * | 2009-11-26 | 2013-08-06 | Canon Kabushiki Kaisha | Method of manufacturing liquid discharge head, and method of manufacturing discharge port member |
| JP5734040B2 (ja) * | 2011-03-22 | 2015-06-10 | 京セラ株式会社 | インクジェットヘッド及び記録装置 |
| JP2012054560A (ja) * | 2011-09-02 | 2012-03-15 | Seiko Epson Corp | 圧電素子の製造方法、インクジェット式記録ヘッドの製造方法およびインクジェットプリンタの製造方法 |
| US10618285B2 (en) | 2016-06-17 | 2020-04-14 | Canon Kabushiki Kaisha | Piezoelectric substrate and method of manufacturing the piezoelectric substrate, and liquid ejection head |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992897A (ja) | 1995-09-28 | 1997-04-04 | Seiko Epson Corp | 圧電体薄膜素子及びその製造方法、及び圧電体薄膜素子を用いたインクジェット記録ヘッド |
| JPH09109392A (ja) | 1995-10-13 | 1997-04-28 | Canon Inc | インクジェット記録ヘッドの製造方法および同方法により製造されたインクジェット記録ヘッド、並びにインクジェット記録装置 |
| JPH10139594A (ja) | 1996-10-30 | 1998-05-26 | Seiko Epson Corp | 圧電体薄膜およびその製造法ならびにそれを用いたインクジェット記録ヘッド |
| JPH10290035A (ja) | 1997-04-16 | 1998-10-27 | Seiko Epson Corp | 圧電体素子及びその製造方法 |
| JP3379479B2 (ja) * | 1998-07-01 | 2003-02-24 | セイコーエプソン株式会社 | 機能性薄膜、圧電体素子、インクジェット式記録ヘッド、プリンタ、圧電体素子の製造方法およびインクジェット式記録ヘッドの製造方法、 |
| US6688729B1 (en) | 1999-06-04 | 2004-02-10 | Canon Kabushiki Kaisha | Liquid discharge head substrate, liquid discharge head, liquid discharge apparatus having these elements, manufacturing method of liquid discharge head, and driving method of the same |
| US6402302B1 (en) | 1999-06-04 | 2002-06-11 | Canon Kabushiki Kaisha | Liquid discharge head, manufacturing method thereof, and microelectromechanical device |
| JP2001196547A (ja) * | 2000-01-12 | 2001-07-19 | Fujitsu Ltd | 半導体装置 |
| JP2002047011A (ja) * | 2000-08-02 | 2002-02-12 | Mitsubishi Materials Corp | 緻密質ペロブスカイト型金属酸化物薄膜の形成方法及び緻密質ペロブスカイト型金属酸化物薄膜 |
| JP2002151656A (ja) * | 2000-11-14 | 2002-05-24 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2003136715A (ja) * | 2001-11-05 | 2003-05-14 | Hitachi Metals Ltd | 液体吐出ヘッドおよびその製造方法 |
| JP3817729B2 (ja) * | 2001-11-08 | 2006-09-06 | セイコーエプソン株式会社 | 圧電アクチュエータ及び液体吐出ヘッド |
| JP3817730B2 (ja) * | 2001-12-10 | 2006-09-06 | セイコーエプソン株式会社 | 圧電アクチュエータの製造方法、インクジェット式記録ヘッド、及びプリンタ |
| JP2003282987A (ja) * | 2002-03-25 | 2003-10-03 | Seiko Epson Corp | 電子デバイスおよびインクジェットプリンタ |
| JP3974096B2 (ja) | 2002-09-20 | 2007-09-12 | キヤノン株式会社 | 圧電体素子及びインクジェット記録ヘッド |
-
2003
- 2003-09-03 JP JP2003311305A patent/JP4776154B2/ja not_active Expired - Fee Related
-
2004
- 2004-08-30 US US10/928,277 patent/US7399066B2/en not_active Expired - Lifetime
- 2004-09-03 CN CNB2004100686169A patent/CN100376395C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1590102A (zh) | 2005-03-09 |
| JP2005079507A (ja) | 2005-03-24 |
| US20050082943A1 (en) | 2005-04-21 |
| US7399066B2 (en) | 2008-07-15 |
| CN100376395C (zh) | 2008-03-26 |
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