JP4768963B2 - ウェハの転写方法 - Google Patents

ウェハの転写方法 Download PDF

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Publication number
JP4768963B2
JP4768963B2 JP2004055720A JP2004055720A JP4768963B2 JP 4768963 B2 JP4768963 B2 JP 4768963B2 JP 2004055720 A JP2004055720 A JP 2004055720A JP 2004055720 A JP2004055720 A JP 2004055720A JP 4768963 B2 JP4768963 B2 JP 4768963B2
Authority
JP
Japan
Prior art keywords
wafer
frame
adhesive sheet
transfer
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004055720A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007220693A (ja
Inventor
欣也 持田
幹夫 小宮山
健一 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2004055720A priority Critical patent/JP4768963B2/ja
Priority to KR1020067013783A priority patent/KR20060123462A/ko
Priority to DE112005000448T priority patent/DE112005000448T5/de
Priority to PCT/JP2005/003146 priority patent/WO2005083763A1/ja
Priority to TW094106136A priority patent/TW200532786A/zh
Priority to MYPI20050837A priority patent/MY162177A/en
Publication of JP2007220693A publication Critical patent/JP2007220693A/ja
Application granted granted Critical
Publication of JP4768963B2 publication Critical patent/JP4768963B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004055720A 2004-03-01 2004-03-01 ウェハの転写方法 Expired - Lifetime JP4768963B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004055720A JP4768963B2 (ja) 2004-03-01 2004-03-01 ウェハの転写方法
KR1020067013783A KR20060123462A (ko) 2004-03-01 2005-02-25 웨이퍼의 전사방법
DE112005000448T DE112005000448T5 (de) 2004-03-01 2005-02-25 Verfahren zur Umsetzung eines Wafers
PCT/JP2005/003146 WO2005083763A1 (ja) 2004-03-01 2005-02-25 ウェハの転写方法
TW094106136A TW200532786A (en) 2004-03-01 2005-03-01 Wafer transcription method
MYPI20050837A MY162177A (en) 2004-03-01 2005-03-01 Method for transferring a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004055720A JP4768963B2 (ja) 2004-03-01 2004-03-01 ウェハの転写方法

Publications (2)

Publication Number Publication Date
JP2007220693A JP2007220693A (ja) 2007-08-30
JP4768963B2 true JP4768963B2 (ja) 2011-09-07

Family

ID=34908879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004055720A Expired - Lifetime JP4768963B2 (ja) 2004-03-01 2004-03-01 ウェハの転写方法

Country Status (6)

Country Link
JP (1) JP4768963B2 (ru)
KR (1) KR20060123462A (ru)
DE (1) DE112005000448T5 (ru)
MY (1) MY162177A (ru)
TW (1) TW200532786A (ru)
WO (1) WO2005083763A1 (ru)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006229021A (ja) * 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウエーハの分割方法
JP5275553B2 (ja) * 2006-06-27 2013-08-28 スリーエム イノベイティブ プロパティズ カンパニー 分割チップの製造方法
JP2011091293A (ja) * 2009-10-26 2011-05-06 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5533695B2 (ja) * 2011-01-26 2014-06-25 豊田合成株式会社 半導体チップの製造方法および半導体チップの実装方法
JP6044986B2 (ja) * 2012-11-13 2016-12-14 株式会社ディスコ 切削装置
JP5855034B2 (ja) * 2013-02-18 2016-02-09 古河電気工業株式会社 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法
JP5657828B1 (ja) * 2014-07-17 2015-01-21 大宮工業株式会社 転写方法及び転写装置
KR102609560B1 (ko) * 2017-09-08 2023-12-04 삼성전자주식회사 반도체 제조 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2893741B2 (ja) * 1989-08-02 1999-05-24 日本電気株式会社 電歪効果素子
JPH063321B2 (ja) * 1989-10-13 1994-01-12 貞一 阿部 温水ボイラー
JP2877997B2 (ja) * 1991-08-29 1999-04-05 日東電工株式会社 半導体ウエハの処理方法
JP2001110757A (ja) * 1999-10-06 2001-04-20 Toshiba Corp 半導体装置の製造方法
JP2001257222A (ja) * 2000-03-09 2001-09-21 Hitachi Ltd 半導体実装装置およびその製造方法
JP3408805B2 (ja) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2003086540A (ja) * 2001-09-07 2003-03-20 Toshiba Corp 半導体装置の製造方法及びその製造装置
JP3624909B2 (ja) * 2002-03-12 2005-03-02 浜松ホトニクス株式会社 レーザ加工方法

Also Published As

Publication number Publication date
MY162177A (en) 2017-05-31
TW200532786A (en) 2005-10-01
DE112005000448T5 (de) 2007-03-29
JP2007220693A (ja) 2007-08-30
TWI354325B (ru) 2011-12-11
KR20060123462A (ko) 2006-12-01
WO2005083763A1 (ja) 2005-09-09

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