JP4754850B2 - Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法 - Google Patents

Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法 Download PDF

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Publication number
JP4754850B2
JP4754850B2 JP2005064801A JP2005064801A JP4754850B2 JP 4754850 B2 JP4754850 B2 JP 4754850B2 JP 2005064801 A JP2005064801 A JP 2005064801A JP 2005064801 A JP2005064801 A JP 2005064801A JP 4754850 B2 JP4754850 B2 JP 4754850B2
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Japan
Prior art keywords
reflector
led
module
resin material
printed circuit
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Expired - Lifetime
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JP2005064801A
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English (en)
Japanese (ja)
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JP2005311314A5 (enExample
JP2005311314A (ja
Inventor
恵司 西本
秀男 永井
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005064801A priority Critical patent/JP4754850B2/ja
Priority to US10/591,081 priority patent/US7621654B2/en
Priority to PCT/JP2005/005603 priority patent/WO2005093862A2/en
Priority to EP05721530.3A priority patent/EP1730792B1/en
Priority to TW094109109A priority patent/TWI343461B/zh
Publication of JP2005311314A publication Critical patent/JP2005311314A/ja
Publication of JP2005311314A5 publication Critical patent/JP2005311314A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H10H20/856—Reflecting means

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2005064801A 2004-03-26 2005-03-09 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法 Expired - Lifetime JP4754850B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005064801A JP4754850B2 (ja) 2004-03-26 2005-03-09 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
US10/591,081 US7621654B2 (en) 2004-03-26 2005-03-18 LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
PCT/JP2005/005603 WO2005093862A2 (en) 2004-03-26 2005-03-18 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
EP05721530.3A EP1730792B1 (en) 2004-03-26 2005-03-18 Manufacturing method of led mounting module, and manufacturing method of led module
TW094109109A TWI343461B (en) 2004-03-26 2005-03-24 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004093896 2004-03-26
JP2004093896 2004-03-26
JP2005064801A JP4754850B2 (ja) 2004-03-26 2005-03-09 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2005311314A JP2005311314A (ja) 2005-11-04
JP2005311314A5 JP2005311314A5 (enExample) 2008-01-31
JP4754850B2 true JP4754850B2 (ja) 2011-08-24

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JP2005064801A Expired - Lifetime JP4754850B2 (ja) 2004-03-26 2005-03-09 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法

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US (1) US7621654B2 (enExample)
EP (1) EP1730792B1 (enExample)
JP (1) JP4754850B2 (enExample)
TW (1) TWI343461B (enExample)
WO (1) WO2005093862A2 (enExample)

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JP4434840B2 (ja) * 2004-05-31 2010-03-17 キヤノン株式会社 照明装置および撮影装置
US7719021B2 (en) * 2005-06-28 2010-05-18 Lighting Science Group Corporation Light efficient LED assembly including a shaped reflective cavity and method for making same
US8079743B2 (en) * 2005-06-28 2011-12-20 Lighting Science Group Corporation Display backlight with improved light coupling and mixing
TWI297784B (en) * 2005-09-22 2008-06-11 Lite On Technology Corp Optical module having a lens formed without contacting a reflector and method of manufacturing the same
KR101171186B1 (ko) * 2005-11-10 2012-08-06 삼성전자주식회사 고휘도 발광 다이오드 및 이를 이용한 액정 표시 장치
JP2007288097A (ja) * 2006-04-20 2007-11-01 Showa Denko Kk フリップチップ型半導体発光素子用の実装基板、フリップチップ型半導体発光素子の実装構造及び発光ダイオードランプ
JP4828248B2 (ja) 2006-02-16 2011-11-30 新光電気工業株式会社 発光装置及びその製造方法
KR100738933B1 (ko) * 2006-03-17 2007-07-12 (주)대신엘이디 조명용 ｌｅｄ 모듈
KR100797716B1 (ko) * 2006-03-21 2008-01-23 삼성전기주식회사 회로기판이 없는 ｌｅｄ-백라이트유닛 및 그 제조방법
US7985005B2 (en) * 2006-05-30 2011-07-26 Journée Lighting, Inc. Lighting assembly and light module for same
USD611628S1 (en) * 2006-06-20 2010-03-09 Panasonic Corporation Lighting apparatus
JP4812543B2 (ja) * 2006-06-28 2011-11-09 株式会社小糸製作所 車両用灯具
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