JP4729483B2 - 酸素および／または水気体混合物を用いる空中分子汚染物質の除去方法 - Google Patents

酸素および／または水気体混合物を用いる空中分子汚染物質の除去方法 Download PDF

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Publication number
JP4729483B2
JP4729483B2 JP2006515059A JP2006515059A JP4729483B2 JP 4729483 B2 JP4729483 B2 JP 4729483B2 JP 2006515059 A JP2006515059 A JP 2006515059A JP 2006515059 A JP2006515059 A JP 2006515059A JP 4729483 B2 JP4729483 B2 JP 4729483B2
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Prior art keywords
purge gas
purified
gas
volume
amc
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Expired - Fee Related
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Japanese (ja)
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JP2006526901A (ja
JP2006526901A5 (enExample
Inventor
スピーゲルマン，ジエフリー・ジエイ
アルバレス，ダニエル・ジエイ，ジユニア
ホルムズ，ラツセル・ジエイ
トラム，アラン
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Entegris Inc
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Entegris Inc
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Priority claimed from PCT/US2004/017251 external-priority patent/WO2004112117A1/en
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Publication of JP2006526901A5 publication Critical patent/JP2006526901A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/72—Organic compounds not provided for in groups B01D53/48 - B01D53/70, e.g. hydrocarbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Separation Of Gases By Adsorption (AREA)
  • Gas Separation By Absorption (AREA)
JP2006515059A 2003-06-02 2004-06-01 酸素および／または水気体混合物を用いる空中分子汚染物質の除去方法 Expired - Fee Related JP4729483B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US47514503P 2003-06-02 2003-06-02
US60/475,145 2003-06-02
US10/683,904 US6913654B2 (en) 2003-06-02 2003-10-10 Method for the removal of airborne molecular contaminants using water gas mixtures
US10/683,903 US7189291B2 (en) 2003-06-02 2003-10-10 Method for the removal of airborne molecular contaminants using oxygen gas mixtures
US10/683,904 2003-10-10
US10/683,903 2003-10-10
PCT/US2004/017251 WO2004112117A1 (en) 2003-06-02 2004-06-01 Method for the removal of airborne molecular contaminants using oxygen and/or water gas mixtures

Publications (3)

Publication Number Publication Date
JP2006526901A JP2006526901A (ja) 2006-11-24
JP2006526901A5 JP2006526901A5 (enExample) 2009-06-04
JP4729483B2 true JP4729483B2 (ja) 2011-07-20

Family

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JP2006515059A Expired - Fee Related JP4729483B2 (ja) 2003-06-02 2004-06-01 酸素および／または水気体混合物を用いる空中分子汚染物質の除去方法

Country Status (6)

Country Link
US (5) US7189291B2 (enExample)
EP (1) EP1629528A1 (enExample)
JP (1) JP4729483B2 (enExample)
KR (1) KR20060017623A (enExample)
CN (2) CN100533676C (enExample)
TW (1) TWI337102B (enExample)

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US7377982B2 (en) 2008-05-27
US6913654B2 (en) 2005-07-05
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KR20060017623A (ko) 2006-02-24
US20060118138A1 (en) 2006-06-08
US20050205114A1 (en) 2005-09-22
CN100533676C (zh) 2009-08-26
TW200512048A (en) 2005-04-01
US20040237777A1 (en) 2004-12-02
US8075704B2 (en) 2011-12-13
US7189291B2 (en) 2007-03-13
CN101599432A (zh) 2009-12-09
CN1830071A (zh) 2006-09-06
US20070137676A1 (en) 2007-06-21
TWI337102B (en) 2011-02-11
US20040238013A1 (en) 2004-12-02

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