JP4718070B2 - アンダーフィル封止および補修方法 - Google Patents

アンダーフィル封止および補修方法 Download PDF

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Publication number
JP4718070B2
JP4718070B2 JP2001505052A JP2001505052A JP4718070B2 JP 4718070 B2 JP4718070 B2 JP 4718070B2 JP 2001505052 A JP2001505052 A JP 2001505052A JP 2001505052 A JP2001505052 A JP 2001505052A JP 4718070 B2 JP4718070 B2 JP 4718070B2
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Prior art keywords
methylimidazole
circuit board
semiconductor device
thermosetting resin
resin composition
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Expired - Fee Related
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JP2001505052A
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Japanese (ja)
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JP2003502484A (ja
Inventor
孝久 道端
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Henkel Corp
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Henkel Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2001505052A 1999-06-17 2000-06-16 アンダーフィル封止および補修方法 Expired - Fee Related JP4718070B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US13948699P 1999-06-17 1999-06-17
US60/139,486 1999-06-17
US19339200P 2000-03-31 2000-03-31
US19339100P 2000-03-31 2000-03-31
US60/193,391 2000-03-31
US60/193,392 2000-03-31
US21047000P 2000-06-09 2000-06-09
US60/210,470 2000-06-09
PCT/US2000/011878 WO2000079582A1 (en) 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent

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Publication Number Publication Date
JP2003502484A JP2003502484A (ja) 2003-01-21
JP4718070B2 true JP4718070B2 (ja) 2011-07-06

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EP (1) EP1194953A4 (ko)
JP (1) JP4718070B2 (ko)
KR (1) KR100372211B1 (ko)
CN (1) CN1178287C (ko)
AU (1) AU5722700A (ko)
CA (1) CA2374187A1 (ko)
MX (1) MXPA01013054A (ko)
WO (1) WO2000079582A1 (ko)

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Publication number Priority date Publication date Assignee Title
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
AU2002245103A1 (en) 2000-11-14 2002-07-30 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
US6800371B2 (en) 2001-03-07 2004-10-05 3M Innovative Properties Company Adhesives and adhesive compositions containing thioether groups
EP1674495A1 (en) * 2004-12-22 2006-06-28 Huntsman Advanced Materials (Switzerland) GmbH Coating system
KR100671137B1 (ko) 2004-12-30 2007-01-17 제일모직주식회사 재작업이 가능한 반도체 소자 언더필용 액상 에폭시 수지조성물 및 이를 이용한 반도체 소자
JP5721203B2 (ja) * 2005-10-25 2015-05-20 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング アンダーフィル封止剤として有用でありかつリワーク可能な低発熱性の熱硬化性樹脂組成物
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CN1178287C (zh) 2004-12-01
CN1384975A (zh) 2002-12-11
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EP1194953A1 (en) 2002-04-10
CA2374187A1 (en) 2000-12-28
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JP2003502484A (ja) 2003-01-21
KR100372211B1 (ko) 2003-02-14

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