AU5722700A - Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent - Google Patents

Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent

Info

Publication number
AU5722700A
AU5722700A AU57227/00A AU5722700A AU5722700A AU 5722700 A AU5722700 A AU 5722700A AU 57227/00 A AU57227/00 A AU 57227/00A AU 5722700 A AU5722700 A AU 5722700A AU 5722700 A AU5722700 A AU 5722700A
Authority
AU
Australia
Prior art keywords
andcuring
carbocyclic
heteroatom
agent
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU57227/00A
Other languages
English (en)
Inventor
Takahisa Doba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Corp
Original Assignee
Loctite Japan Corp
Henkel Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Japan Corp, Henkel Loctite Corp filed Critical Loctite Japan Corp
Publication of AU5722700A publication Critical patent/AU5722700A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L23/293—Organic, e.g. plastic
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Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
AU57227/00A 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent Abandoned AU5722700A (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US13948699P 1999-06-17 1999-06-17
US60139486 1999-06-17
US19339200P 2000-03-31 2000-03-31
US19339100P 2000-03-31 2000-03-31
US60193391 2000-03-31
US60193392 2000-03-31
US21047000P 2000-06-09 2000-06-09
US60210470 2000-06-09
PCT/US2000/011878 WO2000079582A1 (en) 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent

Publications (1)

Publication Number Publication Date
AU5722700A true AU5722700A (en) 2001-01-09

Family

ID=27495368

Family Applications (1)

Application Number Title Priority Date Filing Date
AU57227/00A Abandoned AU5722700A (en) 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent

Country Status (8)

Country Link
EP (1) EP1194953A4 (ko)
JP (1) JP4718070B2 (ko)
KR (1) KR100372211B1 (ko)
CN (1) CN1178287C (ko)
AU (1) AU5722700A (ko)
CA (1) CA2374187A1 (ko)
MX (1) MXPA01013054A (ko)
WO (1) WO2000079582A1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
WO2002058108A2 (en) 2000-11-14 2002-07-25 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
US6800371B2 (en) 2001-03-07 2004-10-05 3M Innovative Properties Company Adhesives and adhesive compositions containing thioether groups
EP1674495A1 (en) * 2004-12-22 2006-06-28 Huntsman Advanced Materials (Switzerland) GmbH Coating system
KR100671137B1 (ko) 2004-12-30 2007-01-17 제일모직주식회사 재작업이 가능한 반도체 소자 언더필용 액상 에폭시 수지조성물 및 이를 이용한 반도체 소자
US8075721B2 (en) * 2005-10-25 2011-12-13 Henkel Corporation Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
JP4923946B2 (ja) * 2006-10-24 2012-04-25 ダイソー株式会社 ポリエーテル系多元共重合体およびその架橋物
JP4931079B2 (ja) * 2007-12-21 2012-05-16 パナソニック株式会社 アンダーフィル用液状熱硬化性樹脂組成物とそれを用いた半導体装置
JP5098997B2 (ja) * 2008-12-22 2012-12-12 富士通株式会社 半導体装置とそのリペア方法、及び半導体装置の製造方法
KR101266540B1 (ko) 2008-12-31 2013-05-23 제일모직주식회사 반도체 소자 언더필용 액상 에폭시 수지 조성물 및 이를 이용한 반도체 소자
CN102153724A (zh) * 2010-02-11 2011-08-17 中国科学院化学研究所 芳香族聚醚缩水甘油醚环氧树脂及其制备方法
SG10201602081SA (en) 2011-05-31 2016-04-28 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminate
SG11201503925QA (en) * 2012-11-28 2015-06-29 Mitsubishi Gas Chemical Co Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board
JP6596412B2 (ja) 2013-03-22 2019-10-23 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ジエン／ジエノフィル対および補修性を有する熱硬化性樹脂組成物
JP6097815B1 (ja) 2015-12-18 2017-03-15 古河電気工業株式会社 接着剤組成物、これを用いた被着体の接合方法および積層体の製造方法
CN106117518A (zh) * 2016-06-22 2016-11-16 柳州市强威锻造厂 一种咪唑类环氧树脂固化配方
CN108530661B (zh) * 2018-02-14 2020-09-25 苏州大学 一种超疏水电热环氧树脂复合材料及其制备与自修复方法
CN110213905B (zh) * 2019-05-27 2021-01-08 维沃移动通信有限公司 一种组装电路板的封装方法、组装电路板及终端
KR20220085616A (ko) 2020-12-15 2022-06-22 삼성전자주식회사 에폭시 화합물, 이로부터 얻어지는 조성물, 반도체 장치, 전자 장치, 물품 및 에폭시 화합물 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842290A (ja) * 1981-09-07 1983-03-11 日立化成工業株式会社 可撓性印刷回路用基板
JPS62295029A (ja) * 1986-06-16 1987-12-22 Hitachi Ltd 液晶表示素子
JPS63159426A (ja) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd 可撓性エポキシ樹脂組成物
JPH0218412A (ja) * 1988-07-07 1990-01-22 Sumitomo Bakelite Co Ltd 可撓性エポキシ樹脂組成物
JP2728106B2 (ja) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
JP3193112B2 (ja) * 1992-03-25 2001-07-30 株式会社タイルメント 一液系可撓性エポキシ樹脂組成物並びにそれからなるシーリング材または接着剤
JP3339083B2 (ja) * 1992-10-27 2002-10-28 新日本理化株式会社 エポキシ樹脂組成物
JP2742190B2 (ja) * 1992-12-18 1998-04-22 株式会社トクヤマ 硬化性導電組成物
JPH06256468A (ja) * 1993-03-08 1994-09-13 Toray Chiokoole Kk 透水性舗装用バインダー樹脂
JP3399095B2 (ja) * 1994-07-04 2003-04-21 新日本理化株式会社 液状エポキシ樹脂組成物
US5932682A (en) * 1995-12-19 1999-08-03 International Business Machines Corporation Cleavable diepoxide for removable epoxy compositions
JPH09316421A (ja) * 1996-03-27 1997-12-09 Sumitomo Seika Chem Co Ltd 接着剤
US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
JPH10120753A (ja) * 1996-10-17 1998-05-12 Hitachi Chem Co Ltd 封止用成形材料及び電子部品
JPH10152554A (ja) * 1996-11-21 1998-06-09 Nippon Kayaku Co Ltd エネルギー線硬化性組成物及びその硬化物
JPH1117074A (ja) * 1997-06-26 1999-01-22 Jsr Corp 半導体封止用組成物および半導体装置

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CN1384975A (zh) 2002-12-11
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WO2000079582A1 (en) 2000-12-28
WO2000079582A9 (en) 2001-03-15
MXPA01013054A (es) 2003-08-20
EP1194953A4 (en) 2002-09-04
CN1178287C (zh) 2004-12-01
KR100372211B1 (ko) 2003-02-14
KR20020027352A (ko) 2002-04-13
EP1194953A1 (en) 2002-04-10
CA2374187A1 (en) 2000-12-28

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