JP4706081B2 - 銅または銅合金のエッチング剤ならびにエッチング法 - Google Patents

銅または銅合金のエッチング剤ならびにエッチング法 Download PDF

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Publication number
JP4706081B2
JP4706081B2 JP2001169718A JP2001169718A JP4706081B2 JP 4706081 B2 JP4706081 B2 JP 4706081B2 JP 2001169718 A JP2001169718 A JP 2001169718A JP 2001169718 A JP2001169718 A JP 2001169718A JP 4706081 B2 JP4706081 B2 JP 4706081B2
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JP
Japan
Prior art keywords
copper
etching
ammonium
etching agent
chlorite
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Expired - Lifetime
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JP2001169718A
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English (en)
Japanese (ja)
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JP2002363777A (ja
JP2002363777A5 (https=
Inventor
秀一郎 小野
幸子 中村
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MEC Co Ltd
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MEC Co Ltd
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Priority to JP2001169718A priority Critical patent/JP4706081B2/ja
Priority to CNB021222509A priority patent/CN1324164C/zh
Priority to TW91111830A priority patent/TWI242608B/zh
Publication of JP2002363777A publication Critical patent/JP2002363777A/ja
Publication of JP2002363777A5 publication Critical patent/JP2002363777A5/ja
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JP2001169718A 2001-06-05 2001-06-05 銅または銅合金のエッチング剤ならびにエッチング法 Expired - Lifetime JP4706081B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001169718A JP4706081B2 (ja) 2001-06-05 2001-06-05 銅または銅合金のエッチング剤ならびにエッチング法
CNB021222509A CN1324164C (zh) 2001-06-05 2002-06-03 铜或铜合金的腐蚀剂及腐蚀方法
TW91111830A TWI242608B (en) 2001-06-05 2002-06-03 Etching agent for copper or copper alloy and etching method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001169718A JP4706081B2 (ja) 2001-06-05 2001-06-05 銅または銅合金のエッチング剤ならびにエッチング法

Publications (3)

Publication Number Publication Date
JP2002363777A JP2002363777A (ja) 2002-12-18
JP2002363777A5 JP2002363777A5 (https=) 2008-06-26
JP4706081B2 true JP4706081B2 (ja) 2011-06-22

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JP2001169718A Expired - Lifetime JP4706081B2 (ja) 2001-06-05 2001-06-05 銅または銅合金のエッチング剤ならびにエッチング法

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JP (1) JP4706081B2 (https=)
CN (1) CN1324164C (https=)
TW (1) TWI242608B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11453953B2 (en) 2017-06-01 2022-09-27 Mitsubishi Materials Corporation High-purity electrolytic copper

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329365B2 (en) * 2004-08-25 2008-02-12 Samsung Electronics Co., Ltd. Etchant composition for indium oxide layer and etching method using the same
RU2301981C1 (ru) * 2005-10-07 2007-06-27 Государственное образовательное учреждение высшего профессионального образования Томский политехнический университет Способ металлографического травления оловянистых бронз
JP4822519B2 (ja) * 2006-06-26 2011-11-24 Ｊｘ日鉱日石金属株式会社 半導体ウェハーの前処理剤及び前処理方法
JP5559956B2 (ja) * 2007-03-15 2014-07-23 東進セミケム株式会社 薄膜トランジスタ液晶表示装置のエッチング液組成物
JP5219304B2 (ja) 2010-12-14 2013-06-26 メック株式会社 エッチング剤及びこれを用いたエッチング方法
JP5885971B2 (ja) * 2011-09-08 2016-03-16 関東化學株式会社 銅および銅合金のエッチング液
KR101461180B1 (ko) 2012-04-26 2014-11-18 (주)삼성화학 비과산화수소형 구리 에칭제
CN103695908A (zh) * 2013-12-27 2014-04-02 东莞市广华化工有限公司 一种新型的有机碱微蚀液
CN104694909B (zh) * 2014-07-03 2017-01-25 广东丹邦科技有限公司 一种铜表面粗化剂
KR102367814B1 (ko) * 2016-03-30 2022-02-25 동우 화인켐 주식회사 몰리브덴 함유 금속막의 식각액 조성물 및 이를 이용한 액정표시 장치용 어레이 기판의 제조방법
CN111485263B (zh) * 2019-01-25 2023-02-17 上海新阳半导体材料股份有限公司 一种引线框架去氧化剂、其制备方法和应用
JP6806405B1 (ja) * 2020-04-27 2021-01-06 ナミックス株式会社 複合銅部材
JP2022184639A (ja) 2021-06-01 2022-12-13 上村工業株式会社 銅エッチング液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102581A (en) * 1980-01-17 1981-08-17 Yamatoya Shokai:Kk Etching solution of copper
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
JPH0866373A (ja) * 1995-10-03 1996-03-12 Terumo Corp 脈拍測定機能付き温度測定器具
JPH1129883A (ja) * 1997-07-08 1999-02-02 Mec Kk 銅および銅合金のマイクロエッチング剤
US5897375A (en) * 1997-10-20 1999-04-27 Motorola, Inc. Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture
JP2000282265A (ja) * 1999-03-31 2000-10-10 Mec Kk 銅または銅合金のマイクロエッチング剤およびそれを用いる表面処理法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11453953B2 (en) 2017-06-01 2022-09-27 Mitsubishi Materials Corporation High-purity electrolytic copper
US11753733B2 (en) * 2017-06-01 2023-09-12 Mitsubishi Materials Corporation Method for producing high-purity electrolytic copper

Also Published As

Publication number Publication date
JP2002363777A (ja) 2002-12-18
CN1324164C (zh) 2007-07-04
TWI242608B (en) 2005-11-01
CN1389596A (zh) 2003-01-08

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