JPS56102581A - Etching solution of copper - Google Patents

Etching solution of copper

Info

Publication number
JPS56102581A
JPS56102581A JP378980A JP378980A JPS56102581A JP S56102581 A JPS56102581 A JP S56102581A JP 378980 A JP378980 A JP 378980A JP 378980 A JP378980 A JP 378980A JP S56102581 A JPS56102581 A JP S56102581A
Authority
JP
Japan
Prior art keywords
copper
solution
etching solution
dissolving tank
solution containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP378980A
Other languages
Japanese (ja)
Other versions
JPS6247951B2 (en
Inventor
Toshiko Kurisu
Kunio Okamoto
Noriaki Tsukada
Kaoru Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamatoya and Co Ltd
Original Assignee
Yamatoya and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatoya and Co Ltd filed Critical Yamatoya and Co Ltd
Priority to JP378980A priority Critical patent/JPS56102581A/en
Publication of JPS56102581A publication Critical patent/JPS56102581A/en
Publication of JPS6247951B2 publication Critical patent/JPS6247951B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To obtain an etching solution of copper capable of continuous using and regeneration by providing a seed solution, wherein an oxidizing agent is added to the tetrammine copper chloride solution containing the specified quantity of ammonium salt, adjusted to an specified pH. CONSTITUTION:A seed solution, wherein more than >=one kind of nitrite or nitrate dissolve in from 0.01mol to the solubility limit as an oxidizing agent, is poured into the tetrammine copper chloride solution containing 2-5mol/l of ammonium salt, adjusted to pH7.4-11 with NH4OH in a dissolving tank 2 in an etcher 1; and a pump 4 circulates the solution through a copper ion detector 5 and sprays 6 to the dissolving tank 2. The etching solution 3 from the sprays 6 dissolves and eliminates copper from substrates of print circuit, thus heightening the copper depth value of the etching solution 3 when it is repeated. If this copper depth value exceeds the set value, the copper ion detector 5 issues a signal to the pump 4' to send a supplementary solution containing NH4Cl, NH4OH, NaClO2, NH4NO3 from a supplementary tank 8 to the dissolving tank 2 for regeneration.
JP378980A 1980-01-17 1980-01-17 Etching solution of copper Granted JPS56102581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP378980A JPS56102581A (en) 1980-01-17 1980-01-17 Etching solution of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP378980A JPS56102581A (en) 1980-01-17 1980-01-17 Etching solution of copper

Publications (2)

Publication Number Publication Date
JPS56102581A true JPS56102581A (en) 1981-08-17
JPS6247951B2 JPS6247951B2 (en) 1987-10-12

Family

ID=11566946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP378980A Granted JPS56102581A (en) 1980-01-17 1980-01-17 Etching solution of copper

Country Status (1)

Country Link
JP (1) JPS56102581A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5879246A (en) * 1981-11-05 1983-05-13 Toyobo Co Ltd Formation of metallic image and reducing method for metallic image
JPS6452089A (en) * 1987-05-26 1989-02-28 Yamatoya Shokai Method for etching copper and copper alloy
JP2002363777A (en) * 2001-06-05 2002-12-18 Mec Kk Etching agent for copper or copper alloy, and etching method therefor
JPWO2009066750A1 (en) * 2007-11-22 2011-04-07 出光興産株式会社 Etching solution composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02216458A (en) * 1987-12-28 1990-08-29 Yoshio Tabata Automatic dyeing device for slide sample

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5879246A (en) * 1981-11-05 1983-05-13 Toyobo Co Ltd Formation of metallic image and reducing method for metallic image
JPS6452089A (en) * 1987-05-26 1989-02-28 Yamatoya Shokai Method for etching copper and copper alloy
JP2002363777A (en) * 2001-06-05 2002-12-18 Mec Kk Etching agent for copper or copper alloy, and etching method therefor
JP4706081B2 (en) * 2001-06-05 2011-06-22 メック株式会社 Etching agent and etching method for copper or copper alloy
JPWO2009066750A1 (en) * 2007-11-22 2011-04-07 出光興産株式会社 Etching solution composition
JP5642967B2 (en) * 2007-11-22 2014-12-17 関東化学株式会社 Etching solution composition

Also Published As

Publication number Publication date
JPS6247951B2 (en) 1987-10-12

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