GB1287854A - - Google Patents

Info

Publication number
GB1287854A
GB1287854A GB2590671A GB2590671A GB1287854A GB 1287854 A GB1287854 A GB 1287854A GB 2590671 A GB2590671 A GB 2590671A GB 2590671 A GB2590671 A GB 2590671A GB 1287854 A GB1287854 A GB 1287854A
Authority
GB
United Kingdom
Prior art keywords
derivative
april
alkyl
salt
alternatively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2590671A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4884770A external-priority patent/JPS4829982B1/ja
Priority claimed from JP10060570A external-priority patent/JPS4921228B1/ja
Application filed filed Critical
Publication of GB1287854A publication Critical patent/GB1287854A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1287854 Cleaning metals before soldering SHIKOKU KASEI KOGYO CO Ltd 19 April 1971 [2 April 1970 5 June 1970 13 Nov 1970] 25906/71 Heading C7E Prior to being soldered, a metal is treated with an agent comprising at least one imidazole derivative of formula: wherein R<SP>1</SP> represents C 5-20 alkyl and R<SP>2</SP> and R<SP>3</SP> represent either hydrogen, a halogen, or C 1-4 alkyl; or a salt of such derivative formed with a mineral or organic acid. The derivative or salt may be dissolved in water, an organic solvent, or a mixture thereof; alternatively, it may be applied in the molten state, or suspended in water in combination with a surfactant. The agent may also comprise rosin, vinyl acetate, or novolak, or these compounds may be used to coat the metal surface after treatment. Alternatively, the treated surface may be covered with polyethylene film coated with the derivative. The invention is applicable to copper and alloys thereof (e.g. brass) nickel, silver zinc, and tin.
GB2590671A 1970-04-02 1971-04-19 Expired GB1287854A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2833170 1970-04-02
JP4884770A JPS4829982B1 (en) 1970-06-05 1970-06-05
JP10060570A JPS4921228B1 (en) 1970-11-13 1970-11-13

Publications (1)

Publication Number Publication Date
GB1287854A true GB1287854A (en) 1972-09-06

Family

ID=27286165

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2590671A Expired GB1287854A (en) 1970-04-02 1971-04-19

Country Status (3)

Country Link
DE (1) DE2116012C3 (en)
FR (1) FR2089003A5 (en)
GB (1) GB1287854A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498301A (en) * 1993-05-10 1996-03-12 Shikoku Chemicals Corporation Agent for treating surfaces of copper and copper alloys

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4373656A (en) * 1981-07-17 1983-02-15 Western Electric Company, Inc. Method of preserving the solderability of copper
US4478650A (en) * 1983-10-19 1984-10-23 At&T Technologies, Inc. Water soluble flux
US4731128A (en) * 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion
KR960008153B1 (en) * 1989-10-03 1996-06-20 다찌바나 다이끼찌 Metal surface treatment agents
US5478607A (en) * 1991-05-17 1995-12-26 Hitachi Telecon Technologies Ltd. Method for use of preflux, printed wiring board, and method for production thereof
CN104084711B (en) * 2014-06-20 2016-12-28 青岛申达众创技术服务有限公司 A kind of Pb-free solder weld-aiding cream

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498301A (en) * 1993-05-10 1996-03-12 Shikoku Chemicals Corporation Agent for treating surfaces of copper and copper alloys
US5560785A (en) * 1993-05-10 1996-10-01 Shikoku Chemicals Corporation Method for forming a protective chemical layer on copper and copper alloy surfaces

Also Published As

Publication number Publication date
DE2116012A1 (en) 1971-10-14
DE2116012C3 (en) 1973-11-15
FR2089003A5 (en) 1972-01-07
DE2116012B2 (en) 1973-04-26

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee