JPS5636527A - Etching solution for polyimide type resin film - Google Patents

Etching solution for polyimide type resin film

Info

Publication number
JPS5636527A
JPS5636527A JP8772380A JP8772380A JPS5636527A JP S5636527 A JPS5636527 A JP S5636527A JP 8772380 A JP8772380 A JP 8772380A JP 8772380 A JP8772380 A JP 8772380A JP S5636527 A JPS5636527 A JP S5636527A
Authority
JP
Japan
Prior art keywords
etching solution
type resin
polyimide type
hydrazine
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8772380A
Other languages
Japanese (ja)
Inventor
Ichisuke Yamanaka
Atsushi Saiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8772380A priority Critical patent/JPS5636527A/en
Publication of JPS5636527A publication Critical patent/JPS5636527A/en
Pending legal-status Critical Current

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  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

PURPOSE: Titled etching solution which can provide high-accuracy working constantly, including hydrazine and a polyamine compound.
CONSTITUTION: The etching solution for selectively etching polyimide type resin films is obtained by using, as main components, (A) hydrazine and (B) a compound selected from polyamine compounds represented by the formula, wherein R is an atomic group containing at least one carbon atom. Examples of component (B) include ethylenediamine, trimethylenediamine, tetramethylenetriamine, pentamethylenediamine, hexamethylenediamine, diethylenetriamine and triethylenetetramine. Component (A) is contained in an amount of 90W20vol%, when calculated as hydrazine hydrate.
COPYRIGHT: (C)1981,JPO&Japio
JP8772380A 1980-06-30 1980-06-30 Etching solution for polyimide type resin film Pending JPS5636527A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8772380A JPS5636527A (en) 1980-06-30 1980-06-30 Etching solution for polyimide type resin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8772380A JPS5636527A (en) 1980-06-30 1980-06-30 Etching solution for polyimide type resin film

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12276876A Division JPS5349071A (en) 1976-10-15 1976-10-15 Selective etching of polyimide system film

Publications (1)

Publication Number Publication Date
JPS5636527A true JPS5636527A (en) 1981-04-09

Family

ID=13922824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8772380A Pending JPS5636527A (en) 1980-06-30 1980-06-30 Etching solution for polyimide type resin film

Country Status (1)

Country Link
JP (1) JPS5636527A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6461681B2 (en) * 2001-01-08 2002-10-08 Hewlett-Packard Company Method of treating a surface of a polyimide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6461681B2 (en) * 2001-01-08 2002-10-08 Hewlett-Packard Company Method of treating a surface of a polyimide

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