JP2002363777A5 - - Google Patents
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- Publication number
- JP2002363777A5 JP2002363777A5 JP2001169718A JP2001169718A JP2002363777A5 JP 2002363777 A5 JP2002363777 A5 JP 2002363777A5 JP 2001169718 A JP2001169718 A JP 2001169718A JP 2001169718 A JP2001169718 A JP 2001169718A JP 2002363777 A5 JP2002363777 A5 JP 2002363777A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- chlorite
- copper
- group
- diethanolamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 12
- 229910001919 chlorite Inorganic materials 0.000 description 9
- 229910052619 chlorite group Inorganic materials 0.000 description 9
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 9
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 7
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 7
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 235000011114 ammonium hydroxide Nutrition 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 7
- 239000007800 oxidant agent Substances 0.000 description 7
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 6
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 description 6
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 6
- GVNHOISKXMSMPX-UHFFFAOYSA-N 2-[butyl(2-hydroxyethyl)amino]ethanol Chemical compound CCCCN(CCO)CCO GVNHOISKXMSMPX-UHFFFAOYSA-N 0.000 description 6
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 6
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 6
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 6
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 6
- 229940102253 isopropanolamine Drugs 0.000 description 6
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 6
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- -1 azole compound Chemical class 0.000 description 4
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 description 4
- 229940005991 chloric acid Drugs 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 150000003863 ammonium salts Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001169718A JP4706081B2 (ja) | 2001-06-05 | 2001-06-05 | 銅または銅合金のエッチング剤ならびにエッチング法 |
| CNB021222509A CN1324164C (zh) | 2001-06-05 | 2002-06-03 | 铜或铜合金的腐蚀剂及腐蚀方法 |
| TW91111830A TWI242608B (en) | 2001-06-05 | 2002-06-03 | Etching agent for copper or copper alloy and etching method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001169718A JP4706081B2 (ja) | 2001-06-05 | 2001-06-05 | 銅または銅合金のエッチング剤ならびにエッチング法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002363777A JP2002363777A (ja) | 2002-12-18 |
| JP2002363777A5 true JP2002363777A5 (https=) | 2008-06-26 |
| JP4706081B2 JP4706081B2 (ja) | 2011-06-22 |
Family
ID=19011757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001169718A Expired - Lifetime JP4706081B2 (ja) | 2001-06-05 | 2001-06-05 | 銅または銅合金のエッチング剤ならびにエッチング法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4706081B2 (https=) |
| CN (1) | CN1324164C (https=) |
| TW (1) | TWI242608B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7329365B2 (en) * | 2004-08-25 | 2008-02-12 | Samsung Electronics Co., Ltd. | Etchant composition for indium oxide layer and etching method using the same |
| RU2301981C1 (ru) * | 2005-10-07 | 2007-06-27 | Государственное образовательное учреждение высшего профессионального образования Томский политехнический университет | Способ металлографического травления оловянистых бронз |
| JP4822519B2 (ja) * | 2006-06-26 | 2011-11-24 | Ｊｘ日鉱日石金属株式会社 | 半導体ウェハーの前処理剤及び前処理方法 |
| JP5559956B2 (ja) * | 2007-03-15 | 2014-07-23 | 東進セミケム株式会社 | 薄膜トランジスタ液晶表示装置のエッチング液組成物 |
| JP5219304B2 (ja) | 2010-12-14 | 2013-06-26 | メック株式会社 | エッチング剤及びこれを用いたエッチング方法 |
| JP5885971B2 (ja) * | 2011-09-08 | 2016-03-16 | 関東化學株式会社 | 銅および銅合金のエッチング液 |
| KR101461180B1 (ko) | 2012-04-26 | 2014-11-18 | (주)삼성화학 | 비과산화수소형 구리 에칭제 |
| CN103695908A (zh) * | 2013-12-27 | 2014-04-02 | 东莞市广华化工有限公司 | 一种新型的有机碱微蚀液 |
| CN104694909B (zh) * | 2014-07-03 | 2017-01-25 | 广东丹邦科技有限公司 | 一种铜表面粗化剂 |
| KR102367814B1 (ko) * | 2016-03-30 | 2022-02-25 | 동우 화인켐 주식회사 | 몰리브덴 함유 금속막의 식각액 조성물 및 이를 이용한 액정표시 장치용 어레이 기판의 제조방법 |
| US11753733B2 (en) * | 2017-06-01 | 2023-09-12 | Mitsubishi Materials Corporation | Method for producing high-purity electrolytic copper |
| CN111485263B (zh) * | 2019-01-25 | 2023-02-17 | 上海新阳半导体材料股份有限公司 | 一种引线框架去氧化剂、其制备方法和应用 |
| JP6806405B1 (ja) * | 2020-04-27 | 2021-01-06 | ナミックス株式会社 | 複合銅部材 |
| JP2022184639A (ja) | 2021-06-01 | 2022-12-13 | 上村工業株式会社 | 銅エッチング液 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56102581A (en) * | 1980-01-17 | 1981-08-17 | Yamatoya Shokai:Kk | Etching solution of copper |
| US5630950A (en) * | 1993-07-09 | 1997-05-20 | Enthone-Omi, Inc. | Copper brightening process and bath |
| JPH0866373A (ja) * | 1995-10-03 | 1996-03-12 | Terumo Corp | 脈拍測定機能付き温度測定器具 |
| JPH1129883A (ja) * | 1997-07-08 | 1999-02-02 | Mec Kk | 銅および銅合金のマイクロエッチング剤 |
| US5897375A (en) * | 1997-10-20 | 1999-04-27 | Motorola, Inc. | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
| JP2000282265A (ja) * | 1999-03-31 | 2000-10-10 | Mec Kk | 銅または銅合金のマイクロエッチング剤およびそれを用いる表面処理法 |
-
2001
- 2001-06-05 JP JP2001169718A patent/JP4706081B2/ja not_active Expired - Lifetime
-
2002
- 2002-06-03 CN CNB021222509A patent/CN1324164C/zh not_active Expired - Fee Related
- 2002-06-03 TW TW91111830A patent/TWI242608B/zh not_active IP Right Cessation
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