JP2016519423A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016519423A5 JP2016519423A5 JP2016501882A JP2016501882A JP2016519423A5 JP 2016519423 A5 JP2016519423 A5 JP 2016519423A5 JP 2016501882 A JP2016501882 A JP 2016501882A JP 2016501882 A JP2016501882 A JP 2016501882A JP 2016519423 A5 JP2016519423 A5 JP 2016519423A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- cleaning composition
- aqueous cleaning
- concentration
- amino
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 16
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical group [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 14
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 150000007530 organic bases Chemical class 0.000 claims description 9
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims description 8
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- GLUUGHFHXGJENI-UHFFFAOYSA-N diethylenediamine Natural products C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 7
- WJLUBOLDZCQZEV-UHFFFAOYSA-M hexadecyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCC[N+](C)(C)C WJLUBOLDZCQZEV-UHFFFAOYSA-M 0.000 claims description 7
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 7
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 7
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims description 6
- 239000007983 Tris buffer Substances 0.000 claims description 5
- JCBPETKZIGVZRE-UHFFFAOYSA-N 2-aminobutan-1-ol Chemical compound CCC(N)CO JCBPETKZIGVZRE-UHFFFAOYSA-N 0.000 claims description 4
- BKMMTJMQCTUHRP-UHFFFAOYSA-N 2-aminopropan-1-ol Chemical compound CC(N)CO BKMMTJMQCTUHRP-UHFFFAOYSA-N 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims description 4
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 4
- SEQKRHFRPICQDD-UHFFFAOYSA-N N-tris(hydroxymethyl)methylglycine Chemical compound OCC(CO)(CO)[NH2+]CC([O-])=O SEQKRHFRPICQDD-UHFFFAOYSA-N 0.000 claims description 4
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000007998 bicine buffer Substances 0.000 claims description 4
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 claims description 4
- 229960001231 choline Drugs 0.000 claims description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 4
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 4
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 4
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 claims description 3
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 3
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 2
- UZMAPBJVXOGOFT-UHFFFAOYSA-N Syringetin Natural products COC1=C(O)C(OC)=CC(C2=C(C(=O)C3=C(O)C=C(O)C=C3O2)O)=C1 UZMAPBJVXOGOFT-UHFFFAOYSA-N 0.000 claims description 2
- 239000007997 Tricine buffer Substances 0.000 claims description 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims description 2
- KCFYHBSOLOXZIF-UHFFFAOYSA-N dihydrochrysin Natural products COC1=C(O)C(OC)=CC(C2OC3=CC(O)=CC(O)=C3C(=O)C2)=C1 KCFYHBSOLOXZIF-UHFFFAOYSA-N 0.000 claims description 2
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 claims description 2
- 229940043276 diisopropanolamine Drugs 0.000 claims description 2
- 229940102253 isopropanolamine Drugs 0.000 claims description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000013110 organic ligand Substances 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- QQVDJLLNRSOCEL-UHFFFAOYSA-N (2-aminoethyl)phosphonic acid Chemical compound [NH3+]CCP(O)([O-])=O QQVDJLLNRSOCEL-UHFFFAOYSA-N 0.000 claims 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical group SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims 2
- 241000555745 Sciuridae Species 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 2
- 125000004193 piperazinyl group Chemical group 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- LMHAGAHDHRQIMB-UHFFFAOYSA-N 1,2-dichloro-1,2,3,3,4,4-hexafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(Cl)C1(F)Cl LMHAGAHDHRQIMB-UHFFFAOYSA-N 0.000 claims 1
- UUWJHAWPCRFDHZ-UHFFFAOYSA-N 1-dodecoxydodecane;phosphoric acid Chemical compound OP(O)(O)=O.CCCCCCCCCCCCOCCCCCCCCCCCC UUWJHAWPCRFDHZ-UHFFFAOYSA-N 0.000 claims 1
- VKZRWSNIWNFCIQ-UHFFFAOYSA-N 2-[2-(1,2-dicarboxyethylamino)ethylamino]butanedioic acid Chemical compound OC(=O)CC(C(O)=O)NCCNC(C(O)=O)CC(O)=O VKZRWSNIWNFCIQ-UHFFFAOYSA-N 0.000 claims 1
- DMQQXDPCRUGSQB-UHFFFAOYSA-N 2-[3-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCN(CC(O)=O)CC(O)=O DMQQXDPCRUGSQB-UHFFFAOYSA-N 0.000 claims 1
- NLBSQHGCGGFVJW-UHFFFAOYSA-N 2-carboxyethylphosphonic acid Chemical compound OC(=O)CCP(O)(O)=O NLBSQHGCGGFVJW-UHFFFAOYSA-N 0.000 claims 1
- FBYBILSNSUSRGL-UHFFFAOYSA-N 2-hydroxyethyl(methyl)azanium hydroxide Chemical compound [OH-].C[NH2+]CCO FBYBILSNSUSRGL-UHFFFAOYSA-N 0.000 claims 1
- FRQQKWGDKVGLFI-UHFFFAOYSA-N 2-methylundecane-2-thiol Chemical class CCCCCCCCCC(C)(C)S FRQQKWGDKVGLFI-UHFFFAOYSA-N 0.000 claims 1
- ZMRFRBHYXOQLDK-UHFFFAOYSA-N 2-phenylethanethiol Chemical class SCCC1=CC=CC=C1 ZMRFRBHYXOQLDK-UHFFFAOYSA-N 0.000 claims 1
- FDQQNNZKEJIHMS-UHFFFAOYSA-N 3,4,5-trimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C FDQQNNZKEJIHMS-UHFFFAOYSA-N 0.000 claims 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 1
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 1
- 239000004471 Glycine Substances 0.000 claims 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 claims 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 229920001213 Polysorbate 20 Polymers 0.000 claims 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims 1
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 claims 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 claims 1
- 235000018417 cysteine Nutrition 0.000 claims 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical class CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 claims 1
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 claims 1
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000004310 lactic acid Substances 0.000 claims 1
- 235000014655 lactic acid Nutrition 0.000 claims 1
- IZXGZAJMDLJLMF-UHFFFAOYSA-N methylaminomethanol Chemical compound CNCO IZXGZAJMDLJLMF-UHFFFAOYSA-N 0.000 claims 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims 1
- 229960003330 pentetic acid Drugs 0.000 claims 1
- MEUIIHOXOWVKNP-UHFFFAOYSA-N phosphanylformic acid Chemical compound OC(P)=O MEUIIHOXOWVKNP-UHFFFAOYSA-N 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- -1 THEMAH Chemical compound 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361793073P | 2013-03-15 | 2013-03-15 | |
| US61/793,073 | 2013-03-15 | ||
| PCT/US2014/025563 WO2014151361A1 (en) | 2013-03-15 | 2014-03-13 | Aqueous cleaning composition for post copper chemical mechanical planarization |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016519423A JP2016519423A (ja) | 2016-06-30 |
| JP2016519423A5 true JP2016519423A5 (https=) | 2019-01-31 |
| JP6751015B2 JP6751015B2 (ja) | 2020-09-02 |
Family
ID=51523479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016501882A Active JP6751015B2 (ja) | 2013-03-15 | 2014-03-13 | 銅の化学的機械的平坦化後のための水性清浄化組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140264151A1 (https=) |
| EP (1) | EP2971248B1 (https=) |
| JP (1) | JP6751015B2 (https=) |
| KR (1) | KR102237745B1 (https=) |
| CN (1) | CN105264117B (https=) |
| TW (1) | TWI515339B (https=) |
| WO (1) | WO2014151361A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6568198B2 (ja) * | 2014-07-18 | 2019-08-28 | キャボット マイクロエレクトロニクス コーポレイション | Ｃｍｐ後の洗浄組成物及びそれに関連する方法 |
| JP6599464B2 (ja) * | 2015-01-05 | 2019-10-30 | インテグリス・インコーポレーテッド | 化学機械研磨後製剤および使用方法 |
| US9490142B2 (en) * | 2015-04-09 | 2016-11-08 | Qualsig Inc. | Cu-low K cleaning and protection compositions |
| US20160304815A1 (en) * | 2015-04-20 | 2016-10-20 | Intermolecular, Inc. | Methods and chemical solutions for cleaning photomasks using quaternary ammonium hydroxides |
| WO2018098139A1 (en) * | 2016-11-25 | 2018-05-31 | Entegris, Inc. | Cleaning compositions for removing post etch residue |
| KR20210090294A (ko) * | 2017-01-18 | 2021-07-19 | 엔테그리스, 아이엔씨. | 표면으로부터 세리아 입자를 제거하기 위한 조성물 및 방법 |
| US10731109B2 (en) * | 2017-04-11 | 2020-08-04 | Entegris, Inc. | Post chemical mechanical polishing formulations and method of use |
| US11446708B2 (en) | 2017-12-04 | 2022-09-20 | Entegris, Inc. | Compositions and methods for reducing interaction between abrasive particles and a cleaning brush |
| WO2020117269A1 (en) * | 2018-12-07 | 2020-06-11 | Halliburton Energy Services, Inc. | Controlling the formation of polymer-metal complexes in wellbore operations |
| KR102881892B1 (ko) * | 2019-02-19 | 2025-11-05 | 미쯔비시 케미컬 주식회사 | 세륨 화합물 제거용 세정액, 세정 방법 및 반도체 웨이퍼의 제조 방법 |
| JP7220808B2 (ja) * | 2019-12-26 | 2023-02-10 | 富士フイルム株式会社 | 洗浄液、洗浄方法 |
| WO2021131451A1 (ja) * | 2019-12-26 | 2021-07-01 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 洗浄方法、洗浄液 |
| US11584900B2 (en) | 2020-05-14 | 2023-02-21 | Corrosion Innovations, Llc | Method for removing one or more of: coating, corrosion, salt from a surface |
| CN112663065A (zh) * | 2020-11-24 | 2021-04-16 | 苏州美源达环保科技股份有限公司 | 一种碱性蚀刻液的再生循环利用方法 |
| CN113774390B (zh) * | 2021-08-12 | 2023-08-04 | 上海新阳半导体材料股份有限公司 | 一种用于化学机械抛光后的清洗液及其制备方法 |
| JP7756561B2 (ja) | 2021-12-28 | 2025-10-20 | 東京応化工業株式会社 | 洗浄液、及び基板の洗浄方法 |
| EP4709519A1 (en) * | 2023-05-11 | 2026-03-18 | CCI North America Corporation | Pre-treated ion exchange resin for alternative energy power source heat transfer systems with low conductivity coolant requirements |
| CN121175402A (zh) * | 2023-06-05 | 2025-12-19 | 陶氏环球技术有限责任公司 | 具有n-取代哌嗪的清洁组合物 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2119722A1 (en) * | 1993-03-17 | 1994-09-18 | Edward A. Rodzewich | Non-toxic organic corrosion inhibitor |
| US5733270A (en) * | 1995-06-07 | 1998-03-31 | Baxter International Inc. | Method and device for precise release of an antimicrobial agent |
| US5716546A (en) * | 1996-10-23 | 1998-02-10 | Osram Sylvania Inc. | Reduction of lag in yttrium tantalate x-ray phosphors |
| US6896826B2 (en) * | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| US5756218A (en) * | 1997-01-09 | 1998-05-26 | Sandia Corporation | Corrosion protective coating for metallic materials |
| KR20010094757A (ko) * | 1999-02-05 | 2001-11-01 | 리씨 알렉산더 디., 조이스 엘. 모리슨 | 세정제 조성물 및 그 사용 방법 |
| US6492308B1 (en) | 1999-11-16 | 2002-12-10 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| US20100009540A1 (en) * | 2002-09-25 | 2010-01-14 | Asahi Glass Company Limited | Polishing compound, its production process and polishing method |
| WO2004100242A1 (ja) * | 2003-05-09 | 2004-11-18 | Sanyo Chemical Industries, Ltd. | Cmpプロセス用研磨液及び研磨方法 |
| US7968465B2 (en) * | 2003-08-14 | 2011-06-28 | Dupont Air Products Nanomaterials Llc | Periodic acid compositions for polishing ruthenium/low K substrates |
| US7241725B2 (en) * | 2003-09-25 | 2007-07-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Barrier polishing fluid |
| US20050090104A1 (en) * | 2003-10-27 | 2005-04-28 | Kai Yang | Slurry compositions for chemical mechanical polishing of copper and barrier films |
| US20050170650A1 (en) * | 2004-01-26 | 2005-08-04 | Hongbin Fang | Electroless palladium nitrate activation prior to cobalt-alloy deposition |
| US20050205835A1 (en) * | 2004-03-19 | 2005-09-22 | Tamboli Dnyanesh C | Alkaline post-chemical mechanical planarization cleaning compositions |
| US7790618B2 (en) * | 2004-12-22 | 2010-09-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Selective slurry for chemical mechanical polishing |
| JP4502206B2 (ja) * | 2004-12-28 | 2010-07-14 | 三洋化成工業株式会社 | 微小気泡発生用界面活性剤 |
| TWI282363B (en) | 2005-05-19 | 2007-06-11 | Epoch Material Co Ltd | Aqueous cleaning composition for semiconductor copper processing |
| US7374592B2 (en) * | 2005-12-15 | 2008-05-20 | Ashland Licensing And Intellectual Property, Llc (Alip) | Cleaning and polishing composition for metallic surfaces |
| CN101410503A (zh) * | 2006-03-27 | 2009-04-15 | 乔治洛德方法研究和开发液化空气有限公司 | 用于后cmp清洗工艺的改良碱性溶液 |
| US20070225186A1 (en) * | 2006-03-27 | 2007-09-27 | Matthew Fisher | Alkaline solutions for post CMP cleaning processes |
| US7531431B2 (en) * | 2006-05-19 | 2009-05-12 | Cree, Inc. | Methods for reducing contamination of semiconductor devices and materials during wafer processing |
| US7947637B2 (en) * | 2006-06-30 | 2011-05-24 | Fujifilm Electronic Materials, U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| US20080241276A1 (en) * | 2006-10-31 | 2008-10-02 | The Procter & Gamble Company | Portable bio-chemical decontaminant system and method of using the same |
| RU2448147C2 (ru) * | 2006-12-13 | 2012-04-20 | Хальдор Топсеэ А/С | Способ синтеза углеводородных компонентов бензина |
| US8076155B2 (en) * | 2007-06-05 | 2011-12-13 | Ecolab Usa Inc. | Wide range kinetic determination of peracid and/or peroxide concentrations |
| US8404626B2 (en) * | 2007-12-21 | 2013-03-26 | Lam Research Corporation | Post-deposition cleaning methods and formulations for substrates with cap layers |
| US7919446B1 (en) * | 2007-12-28 | 2011-04-05 | Intermolecular, Inc. | Post-CMP cleaning compositions and methods of using same |
| JP2009194049A (ja) * | 2008-02-13 | 2009-08-27 | Sanyo Chem Ind Ltd | 銅配線半導体用洗浄剤 |
| JP2009212383A (ja) * | 2008-03-05 | 2009-09-17 | Sanyo Chem Ind Ltd | 洗浄剤組成物及び半導体基板の製造方法 |
| US20100006511A1 (en) * | 2008-07-11 | 2010-01-14 | Walterick Jr Gerald C | Treatment additives and methods for treating an aqueous medium |
| US9074170B2 (en) * | 2008-10-21 | 2015-07-07 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
| US8361237B2 (en) * | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
| KR20110127244A (ko) * | 2009-03-11 | 2011-11-24 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 표면 상의 잔류물을 제거하기 위한 세정 조성물 |
| US8557125B2 (en) * | 2010-06-07 | 2013-10-15 | General Electric Company | Treatment additives, methods for making and methods for clarifying aqueous media |
| JP5833652B2 (ja) * | 2010-08-02 | 2015-12-16 | ダウ グローバル テクノロジーズ エルエルシー | ビニルアリールモノマーの重合抑制組成物及び抑制方法 |
| JPWO2012073909A1 (ja) * | 2010-11-29 | 2014-05-19 | 和光純薬工業株式会社 | 銅配線用基板洗浄剤及び銅配線半導体基板の洗浄方法 |
| US9714374B2 (en) * | 2011-07-15 | 2017-07-25 | Exxonmobil Upstream Research Company | Protecting a fluid stream from fouling |
| KR101983868B1 (ko) * | 2011-10-24 | 2019-05-29 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 그것을 사용한 연마 방법 및 기판의 제조 방법 |
-
2014
- 2014-03-13 EP EP14769942.5A patent/EP2971248B1/en active Active
- 2014-03-13 CN CN201480028326.3A patent/CN105264117B/zh active Active
- 2014-03-13 KR KR1020157029297A patent/KR102237745B1/ko active Active
- 2014-03-13 US US14/208,059 patent/US20140264151A1/en not_active Abandoned
- 2014-03-13 JP JP2016501882A patent/JP6751015B2/ja active Active
- 2014-03-13 WO PCT/US2014/025563 patent/WO2014151361A1/en not_active Ceased
- 2014-03-14 TW TW103109382A patent/TWI515339B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016519423A5 (https=) | ||
| JP6751015B2 (ja) | 銅の化学的機械的平坦化後のための水性清浄化組成物 | |
| US7235188B2 (en) | Aqueous phosphoric acid compositions for cleaning semiconductor devices | |
| TWI796289B (zh) | 化學機械研磨後清洗組合物及清洗方法 | |
| CN101434894B (zh) | 用于清洗半导体基质上无机残渣含有铜特效腐蚀抑制剂的含水清洗组合物 | |
| TWI286570B (en) | Cleaning composition and method for removing residues | |
| WO2013076587A4 (ja) | 銅または銅合金用エッチング液 | |
| WO2020131313A1 (en) | Compositions and methods for post-cmp cleaning of cobalt substrates | |
| TW202227603A (zh) | 化學機械研磨後(post cmp)清潔組合物 | |
| WO2021100353A1 (ja) | 洗浄液、洗浄方法 | |
| CN104946429A (zh) | 一种低蚀刻的去除光阻蚀刻残留物的清洗液 | |
| WO2021054009A1 (ja) | 洗浄方法 | |
| CN102399651A (zh) | 具有改进的基板相容性的无氨碱性微电子清洗组合物 | |
| US8148311B2 (en) | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid | |
| EP1381656A1 (en) | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | |
| JP2001051429A (ja) | 剥離剤組成物 | |
| JP2009141311A (ja) | アルファ−ヒドロキシカルボニル化合物／アミンまたはアンモニア反応の結合体のオリゴマー型またはポリマー型物質を含有するフッ化物不含フォトレジスト剥離剤または残渣除去洗浄組成物 | |
| JP7395795B1 (ja) | 処理液およびその使用方法 | |
| CN100529014C (zh) | 清洗半导体装置的磷酸组合物水溶液 | |
| JP2003155586A (ja) | 電子部品用洗浄液 | |
| TWI434928B (zh) | Wash the liquid composition | |
| JP2002040675A (ja) | レジスト剥離剤 |