JP4675666B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP4675666B2
JP4675666B2 JP2005118641A JP2005118641A JP4675666B2 JP 4675666 B2 JP4675666 B2 JP 4675666B2 JP 2005118641 A JP2005118641 A JP 2005118641A JP 2005118641 A JP2005118641 A JP 2005118641A JP 4675666 B2 JP4675666 B2 JP 4675666B2
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JP
Japan
Prior art keywords
housing
circuit board
fan
air
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005118641A
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English (en)
Japanese (ja)
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JP2006301715A5 (cg-RX-API-DMAC10.html
JP2006301715A (ja
Inventor
丈治 草本
雄二 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2005118641A priority Critical patent/JP4675666B2/ja
Priority to US11/392,347 priority patent/US7310227B2/en
Priority to CNB2006100747922A priority patent/CN100377036C/zh
Publication of JP2006301715A publication Critical patent/JP2006301715A/ja
Publication of JP2006301715A5 publication Critical patent/JP2006301715A5/ja
Application granted granted Critical
Publication of JP4675666B2 publication Critical patent/JP4675666B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2005118641A 2005-04-15 2005-04-15 電子機器 Expired - Fee Related JP4675666B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005118641A JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器
US11/392,347 US7310227B2 (en) 2005-04-15 2006-03-29 Electronic apparatus
CNB2006100747922A CN100377036C (zh) 2005-04-15 2006-04-14 电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005118641A JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010275677A Division JP5197725B2 (ja) 2010-12-10 2010-12-10 電子機器

Publications (3)

Publication Number Publication Date
JP2006301715A JP2006301715A (ja) 2006-11-02
JP2006301715A5 JP2006301715A5 (cg-RX-API-DMAC10.html) 2008-05-29
JP4675666B2 true JP4675666B2 (ja) 2011-04-27

Family

ID=37077627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005118641A Expired - Fee Related JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器

Country Status (3)

Country Link
US (1) US7310227B2 (cg-RX-API-DMAC10.html)
JP (1) JP4675666B2 (cg-RX-API-DMAC10.html)
CN (1) CN100377036C (cg-RX-API-DMAC10.html)

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KR20070015399A (ko) * 2004-03-12 2007-02-02 니폰 제온 가부시키가이샤 광확산판 및 그의 제조방법
TW200622566A (en) * 2004-11-18 2006-07-01 Ind Origami Llc A heat dissipation assembly and method for cooling heat-generating components in an electrical device
JP2008532775A (ja) 2005-03-17 2008-08-21 インダストリアル オリガミ インコーポレイテッド 正確折りされた高強度の耐疲労性の構造体およびそのためのシート
US9047066B2 (en) 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
US7542293B2 (en) * 2006-04-10 2009-06-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
JP4213729B2 (ja) * 2006-05-23 2009-01-21 株式会社東芝 電子機器
JP4167700B2 (ja) * 2006-05-31 2008-10-15 株式会社東芝 電子機器
CN101106888B (zh) * 2006-07-14 2012-06-13 富准精密工业(深圳)有限公司 散热模组
JP4921096B2 (ja) * 2006-09-28 2012-04-18 富士通株式会社 電子機器および冷却部品
JP5113363B2 (ja) * 2006-09-28 2013-01-09 富士通株式会社 電子機器
MX2009004478A (es) 2006-10-26 2009-05-28 Ind Origami Inc Formacion de objeto tridimensional.
JP4199795B2 (ja) * 2006-10-30 2008-12-17 レノボ・シンガポール・プライベート・リミテッド 電子機器の筐体温度抑制構造および携帯式コンピュータ
US7764514B2 (en) * 2006-12-08 2010-07-27 Intel Corporation Electromagnetic interference shielding for device cooling
EP2118553A4 (en) 2007-02-09 2014-04-16 Ind Origami Inc LOAD-LOADING THREE-DIMENSIONAL STRUCTURE
WO2008109805A2 (en) * 2007-03-07 2008-09-12 Asetek Usa Inc. Hybrid liquid-air cooled graphics display adapter
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
US7589973B2 (en) * 2007-09-05 2009-09-15 Sun Microsystems, Inc. Air duct flow optimization device
US7602607B2 (en) * 2007-09-28 2009-10-13 Intel Corporation External protrusion for air flow distribution
KR101425680B1 (ko) * 2007-11-15 2014-07-31 엘지전자 주식회사 휴대용 컴퓨터의 방열구조
US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
JP4998417B2 (ja) * 2008-09-12 2012-08-15 富士通株式会社 電子機器
CN101742875B (zh) * 2008-11-20 2011-10-05 英业达股份有限公司 散热组件
US8107239B2 (en) 2009-02-27 2012-01-31 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan
JP2015038897A (ja) * 2009-03-30 2015-02-26 株式会社東芝 電子機器
JP4693925B2 (ja) * 2009-09-30 2011-06-01 株式会社東芝 電子機器
JP4802272B2 (ja) * 2009-09-30 2011-10-26 株式会社東芝 電子機器
JP4999943B2 (ja) * 2010-01-27 2012-08-15 東芝テック株式会社 情報処理端末
US8233280B2 (en) * 2010-03-15 2012-07-31 Lincoln Global, Inc. Electronic module with center mounting fasteners
JP4892078B2 (ja) * 2010-05-11 2012-03-07 株式会社東芝 電子機器
JP4823374B1 (ja) * 2010-05-11 2011-11-24 株式会社東芝 電子機器
JP5445507B2 (ja) * 2010-06-03 2014-03-19 株式会社デンソー 電力変換装置
JP4818452B2 (ja) * 2010-07-23 2011-11-16 株式会社東芝 電子機器
US8953313B2 (en) * 2010-09-24 2015-02-10 Intel Corporation Method and apparatus for enhanced cooling of mobile computing device surfaces
US9052868B2 (en) * 2010-09-29 2015-06-09 Siemens Aktiengesellschaft Subsea control system
US20120162903A1 (en) * 2010-12-23 2012-06-28 Macdonald Mark Electro-hydrodynamic cooling for handheld mobile computing device
JP5238841B2 (ja) * 2011-03-08 2013-07-17 株式会社東芝 電子機器
JP2012190060A (ja) * 2011-03-08 2012-10-04 Toshiba Corp 電子機器
JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
JP4922473B2 (ja) * 2011-10-07 2012-04-25 株式会社東芝 電子機器
TWI505073B (zh) * 2012-03-22 2015-10-21 仁寶電腦工業股份有限公司 電子裝置
JP5306511B1 (ja) * 2012-04-27 2013-10-02 株式会社東芝 電子機器
US8936164B2 (en) 2012-07-06 2015-01-20 Industrial Origami, Inc. Solar panel rack
CN202870717U (zh) * 2012-08-27 2013-04-10 高亿实业有限公司 笔记本电脑散热装置
US9538632B2 (en) * 2012-10-18 2017-01-03 Apple Inc. Printed circuit board features of a portable computer
JP6201511B2 (ja) * 2013-08-15 2017-09-27 富士通株式会社 電子機器
WO2015047615A1 (en) * 2013-09-26 2015-04-02 Intel Corporation Partitioned cooling for electronic devices and systems
WO2015149212A1 (en) * 2014-03-31 2015-10-08 Intel Corporation Sonic dust remediation
KR102568676B1 (ko) * 2016-12-14 2023-08-22 삼성전자주식회사 방음 구조를 구비한 전자 장치
CN109362207A (zh) * 2018-10-26 2019-02-19 努比亚技术有限公司 一种风冷散热装置及终端
US10969838B2 (en) * 2019-09-05 2021-04-06 Dell Products, L.P. Hybrid cooling system with multiple outlet blowers
US11681340B2 (en) * 2020-03-17 2023-06-20 Nvidia Corporation Blow-through axial fan for a graphics processing unit
TWI763256B (zh) * 2021-01-15 2022-05-01 宏碁股份有限公司 可攜式電子裝置的散熱系統
US11429164B1 (en) * 2021-02-10 2022-08-30 Dell Products L.P. Cooling system for an information handling system
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
US12207029B2 (en) * 2022-10-03 2025-01-21 Hitron Technologies Inc. Heat dissipating device
TWI870136B (zh) * 2023-10-20 2025-01-11 仁寶電腦工業股份有限公司 電子裝置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3663706B2 (ja) * 1995-01-27 2005-06-22 株式会社日立製作所 パーソナルコンピュータ
US5725622A (en) * 1996-09-04 1998-03-10 Electronic Cable Specialists, Inc. Hood for use on Avionic line replaceable unit
JPH11194859A (ja) * 1998-01-05 1999-07-21 Matsushita Electric Ind Co Ltd 情報処理装置
JP2000223876A (ja) * 1999-01-29 2000-08-11 Toshiba Corp 電子機器
JP2000323878A (ja) * 1999-05-12 2000-11-24 Matsushita Electric Ind Co Ltd 電子機器の冷却構造
JP4195952B2 (ja) * 1999-09-03 2008-12-17 パナソニック株式会社 冷却構造を有する携帯型情報処理装置
JP2001142574A (ja) * 1999-11-18 2001-05-25 Hitachi Ltd 電子装置
JP2002009214A (ja) * 2000-06-26 2002-01-11 Toshiba Corp 放熱部材取付構造
JP3530151B2 (ja) * 2001-06-08 2004-05-24 株式会社東芝 発熱体を内蔵する電子機器およびこの電子機器に用いる冷却装置
JP3690658B2 (ja) * 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション ヒートシンク、冷却部材、半導体基板冷却装置、コンピュータ、および放熱方法
JP4896359B2 (ja) * 2003-01-28 2012-03-14 富士通株式会社 電子装置
JP2005107122A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 電子機器
US20050276018A1 (en) * 2004-06-14 2005-12-15 Moore Earl W Thermal management system for a portable computing device
JP4504760B2 (ja) * 2004-08-09 2010-07-14 富士通株式会社 電子機器
JP2006207881A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
JP2007149007A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 電子機器

Also Published As

Publication number Publication date
US20060232934A1 (en) 2006-10-19
CN1848039A (zh) 2006-10-18
US7310227B2 (en) 2007-12-18
CN100377036C (zh) 2008-03-26
JP2006301715A (ja) 2006-11-02

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