JP4666583B2 - 保護被膜の被覆方法 - Google Patents

保護被膜の被覆方法 Download PDF

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Publication number
JP4666583B2
JP4666583B2 JP2005009820A JP2005009820A JP4666583B2 JP 4666583 B2 JP4666583 B2 JP 4666583B2 JP 2005009820 A JP2005009820 A JP 2005009820A JP 2005009820 A JP2005009820 A JP 2005009820A JP 4666583 B2 JP4666583 B2 JP 4666583B2
Authority
JP
Japan
Prior art keywords
coating
wafer
spinner table
protective film
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005009820A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006198450A (ja
Inventor
信康 北原
仁志 星野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2005009820A priority Critical patent/JP4666583B2/ja
Priority to TW095101459A priority patent/TWI368254B/zh
Priority to DE200610002240 priority patent/DE102006002240B4/de
Publication of JP2006198450A publication Critical patent/JP2006198450A/ja
Application granted granted Critical
Publication of JP4666583B2 publication Critical patent/JP4666583B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2005009820A 2005-01-18 2005-01-18 保護被膜の被覆方法 Active JP4666583B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005009820A JP4666583B2 (ja) 2005-01-18 2005-01-18 保護被膜の被覆方法
TW095101459A TWI368254B (en) 2005-01-18 2006-01-13 Protective film forming method
DE200610002240 DE102006002240B4 (de) 2005-01-18 2006-01-17 Schutzfilmausbildungsverfahren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005009820A JP4666583B2 (ja) 2005-01-18 2005-01-18 保護被膜の被覆方法

Publications (2)

Publication Number Publication Date
JP2006198450A JP2006198450A (ja) 2006-08-03
JP4666583B2 true JP4666583B2 (ja) 2011-04-06

Family

ID=36746128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005009820A Active JP4666583B2 (ja) 2005-01-18 2005-01-18 保護被膜の被覆方法

Country Status (3)

Country Link
JP (1) JP4666583B2 (zh)
DE (1) DE102006002240B4 (zh)
TW (1) TWI368254B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130818A (ja) * 2006-11-21 2008-06-05 Disco Abrasive Syst Ltd レーザー加工装置
JP6061710B2 (ja) * 2013-02-01 2017-01-18 株式会社ディスコ 樹脂被覆装置
JP6411142B2 (ja) * 2014-09-09 2018-10-24 株式会社ディスコ 保護被膜の被覆方法
JP6655882B2 (ja) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 遮光層付きレンズの製造装置
JP6655881B2 (ja) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 遮光層付きレンズの製造方法
JP6987448B2 (ja) * 2017-11-14 2022-01-05 株式会社ディスコ 小径ウェーハの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294252A (ja) * 1997-04-17 1998-11-04 Sony Corp スピンコーティング装置
JP2001176775A (ja) * 1999-12-16 2001-06-29 Mitsumi Electric Co Ltd 半導体ウェハの塗膜形成方法
JP2003078069A (ja) * 2001-09-05 2003-03-14 Sony Corp マルチチップモジュール作製用の疑似ウエハ、及びその作製方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294252A (ja) * 1997-04-17 1998-11-04 Sony Corp スピンコーティング装置
JP2001176775A (ja) * 1999-12-16 2001-06-29 Mitsumi Electric Co Ltd 半導体ウェハの塗膜形成方法
JP2003078069A (ja) * 2001-09-05 2003-03-14 Sony Corp マルチチップモジュール作製用の疑似ウエハ、及びその作製方法

Also Published As

Publication number Publication date
JP2006198450A (ja) 2006-08-03
TW200705512A (en) 2007-02-01
DE102006002240A1 (de) 2006-08-17
TWI368254B (en) 2012-07-11
DE102006002240B4 (de) 2014-08-21

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