TW200705512A - Protective film forming method - Google Patents

Protective film forming method

Info

Publication number
TW200705512A
TW200705512A TW095101459A TW95101459A TW200705512A TW 200705512 A TW200705512 A TW 200705512A TW 095101459 A TW095101459 A TW 095101459A TW 95101459 A TW95101459 A TW 95101459A TW 200705512 A TW200705512 A TW 200705512A
Authority
TW
Taiwan
Prior art keywords
wafer
processed
protective film
film forming
center area
Prior art date
Application number
TW095101459A
Other languages
Chinese (zh)
Other versions
TWI368254B (en
Inventor
Nobuyasu Kitahara
Hitoshi Hoshino
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200705512A publication Critical patent/TW200705512A/en
Application granted granted Critical
Publication of TWI368254B publication Critical patent/TWI368254B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A method of forming a protective film of a resin on the surface to be processed of a wafer, comprising a wafer holding step for holding the wafer on a spinner table in such a manner that the surface to be processed faces up; a resin dropping step for dropping a predetermined amount of a liquid resin onto the center area of the surface to be processed of the wafer held on the spinner table; and a protective film forming step for blowing air toward the periphery through the center area of the surface to be processed of the wafer while rotating the spinner table, to cause the liquid resin dropped on the center area of the surface to be processed of the wafer to flow toward the periphery.
TW095101459A 2005-01-18 2006-01-13 Protective film forming method TWI368254B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005009820A JP4666583B2 (en) 2005-01-18 2005-01-18 Protective coating method

Publications (2)

Publication Number Publication Date
TW200705512A true TW200705512A (en) 2007-02-01
TWI368254B TWI368254B (en) 2012-07-11

Family

ID=36746128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101459A TWI368254B (en) 2005-01-18 2006-01-13 Protective film forming method

Country Status (3)

Country Link
JP (1) JP4666583B2 (en)
DE (1) DE102006002240B4 (en)
TW (1) TWI368254B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405753A (en) * 2014-09-09 2016-03-16 株式会社迪思科 Covering method of protective coverage film
TWI594808B (en) * 2013-02-01 2017-08-11 Disco Corp Resin coating device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130818A (en) * 2006-11-21 2008-06-05 Disco Abrasive Syst Ltd Laser processing apparatus
JP6655881B2 (en) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 Manufacturing method of lens with light-shielding layer
JP6655882B2 (en) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 Manufacturing equipment for lenses with light-blocking layers
JP6987448B2 (en) * 2017-11-14 2022-01-05 株式会社ディスコ Manufacturing method for small diameter wafers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294252A (en) * 1997-04-17 1998-11-04 Sony Corp Spin coating device
JP2001176775A (en) * 1999-12-16 2001-06-29 Mitsumi Electric Co Ltd Method for forming coating film on semiconductor wafer
JP4724988B2 (en) * 2001-09-05 2011-07-13 ソニー株式会社 Method of manufacturing a pseudo wafer for manufacturing a multichip module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594808B (en) * 2013-02-01 2017-08-11 Disco Corp Resin coating device
CN105405753A (en) * 2014-09-09 2016-03-16 株式会社迪思科 Covering method of protective coverage film
CN105405753B (en) * 2014-09-09 2020-09-18 株式会社迪思科 Method for covering protective cover film

Also Published As

Publication number Publication date
DE102006002240A1 (en) 2006-08-17
DE102006002240B4 (en) 2014-08-21
JP2006198450A (en) 2006-08-03
TWI368254B (en) 2012-07-11
JP4666583B2 (en) 2011-04-06

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