TWI368254B - Protective film forming method - Google Patents

Protective film forming method

Info

Publication number
TWI368254B
TWI368254B TW095101459A TW95101459A TWI368254B TW I368254 B TWI368254 B TW I368254B TW 095101459 A TW095101459 A TW 095101459A TW 95101459 A TW95101459 A TW 95101459A TW I368254 B TWI368254 B TW I368254B
Authority
TW
Taiwan
Prior art keywords
protective film
film forming
forming method
protective
forming
Prior art date
Application number
TW095101459A
Other languages
Chinese (zh)
Other versions
TW200705512A (en
Inventor
Nobuyasu Kitahara
Hitoshi Hoshino
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200705512A publication Critical patent/TW200705512A/en
Application granted granted Critical
Publication of TWI368254B publication Critical patent/TWI368254B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
TW095101459A 2005-01-18 2006-01-13 Protective film forming method TWI368254B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005009820A JP4666583B2 (en) 2005-01-18 2005-01-18 Protective coating method

Publications (2)

Publication Number Publication Date
TW200705512A TW200705512A (en) 2007-02-01
TWI368254B true TWI368254B (en) 2012-07-11

Family

ID=36746128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101459A TWI368254B (en) 2005-01-18 2006-01-13 Protective film forming method

Country Status (3)

Country Link
JP (1) JP4666583B2 (en)
DE (1) DE102006002240B4 (en)
TW (1) TWI368254B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130818A (en) * 2006-11-21 2008-06-05 Disco Abrasive Syst Ltd Laser processing apparatus
JP6061710B2 (en) * 2013-02-01 2017-01-18 株式会社ディスコ Resin coating equipment
JP6411142B2 (en) * 2014-09-09 2018-10-24 株式会社ディスコ Protective coating method
JP6655882B2 (en) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 Manufacturing equipment for lenses with light-blocking layers
JP6655881B2 (en) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 Manufacturing method of lens with light-shielding layer
JP6987448B2 (en) * 2017-11-14 2022-01-05 株式会社ディスコ Manufacturing method for small diameter wafers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10294252A (en) * 1997-04-17 1998-11-04 Sony Corp Spin coating device
JP2001176775A (en) * 1999-12-16 2001-06-29 Mitsumi Electric Co Ltd Method for forming coating film on semiconductor wafer
JP4724988B2 (en) * 2001-09-05 2011-07-13 ソニー株式会社 Method of manufacturing a pseudo wafer for manufacturing a multichip module

Also Published As

Publication number Publication date
DE102006002240B4 (en) 2014-08-21
JP4666583B2 (en) 2011-04-06
JP2006198450A (en) 2006-08-03
TW200705512A (en) 2007-02-01
DE102006002240A1 (en) 2006-08-17

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