SG157999A1 - Protective film forming apparatus and laser processing apparatus - Google Patents

Protective film forming apparatus and laser processing apparatus

Info

Publication number
SG157999A1
SG157999A1 SG200806865-2A SG2008068652A SG157999A1 SG 157999 A1 SG157999 A1 SG 157999A1 SG 2008068652 A SG2008068652 A SG 2008068652A SG 157999 A1 SG157999 A1 SG 157999A1
Authority
SG
Singapore
Prior art keywords
wafer
protective film
film forming
forming apparatus
laser processing
Prior art date
Application number
SG200806865-2A
Inventor
Tomoaki Endo
Nobuyasu Kitahara
Tatsuya Inaoka
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG157999A1 publication Critical patent/SG157999A1/en

Links

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

FILM FORMING APPARATUS AND LASER PROCESSING APPARATUS A protective film forming apparatus for forming a protective film on the subject surface of a wafer. The protective film forming apparatus includes a spinner table for holding the wafer thereon under suction vacuum and rotating the wafer in a held condition thereof and resin applying means for applying a liquid resin to the wafer held on the spinner table. The resin applying means includes spraying means for spraying the liquid resin, an arm for supporting the spraying means, and swinging means for horizontally swinging the spraying means supported to the arm in a minimum required range from the center of rotation of the wafer to the outer circumference of the wafer.
SG200806865-2A 2008-07-07 2008-09-16 Protective film forming apparatus and laser processing apparatus SG157999A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008176536A JP2010012508A (en) 2008-07-07 2008-07-07 Protective film covering device and laser beam machining device

Publications (1)

Publication Number Publication Date
SG157999A1 true SG157999A1 (en) 2010-01-29

Family

ID=41519763

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200806865-2A SG157999A1 (en) 2008-07-07 2008-09-16 Protective film forming apparatus and laser processing apparatus

Country Status (5)

Country Link
JP (1) JP2010012508A (en)
KR (1) KR20100005643A (en)
CN (1) CN101623685A (en)
SG (1) SG157999A1 (en)
TW (1) TW201002463A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5591560B2 (en) * 2010-03-02 2014-09-17 株式会社ディスコ Laser processing equipment
JP5681452B2 (en) * 2010-11-08 2015-03-11 株式会社ディスコ Measuring method and measuring device
JP2013021211A (en) * 2011-07-13 2013-01-31 Disco Abrasive Syst Ltd Method for processing wafer
JP5902529B2 (en) * 2012-03-28 2016-04-13 株式会社ディスコ Laser processing method
JP6137798B2 (en) * 2012-09-26 2017-05-31 株式会社ディスコ Laser processing apparatus and protective film coating method
JP2014217805A (en) * 2013-05-08 2014-11-20 株式会社ディスコ Liquid resin coating device
JP6570910B2 (en) 2015-07-24 2019-09-04 株式会社ディスコ Wafer processing method
CN106183415A (en) * 2016-06-30 2016-12-07 天津市鸿禄食品有限公司 A kind of preparation method of food bag spray code spraying apparatus
CN106941074B (en) * 2017-04-27 2023-03-03 林文华 Square wafer processing device and working method thereof
CN110784949B (en) * 2019-10-24 2022-04-19 大同新成新材料股份有限公司 High-strength ultrahigh-power graphite electrode device
CN113275293B (en) * 2021-04-02 2022-09-23 湖南冉旭能源科技有限公司 New energy battery is based on cleaning device of oxalic acid solution performance

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004322168A (en) * 2003-04-25 2004-11-18 Disco Abrasive Syst Ltd Laser machining apparatus
US20050074552A1 (en) * 2003-10-07 2005-04-07 Howard Ge Photoresist coating process for microlithography
CN1707752A (en) * 2004-06-09 2005-12-14 中国科学院上海硅酸盐研究所 Spray pyrolyzation processing method for nitride mixing hole type zinc oxide thin film material
JP4621053B2 (en) * 2005-03-30 2011-01-26 株式会社テックインテック Substrate processing apparatus, substrate processing system, and substrate processing method
JP4648056B2 (en) * 2005-03-31 2011-03-09 株式会社ディスコ Wafer laser processing method and laser processing apparatus
JP5008849B2 (en) * 2005-09-08 2012-08-22 ソニーモバイルディスプレイ株式会社 Laser processing method and manufacturing method of display device having transparent resin layer
JP4777783B2 (en) * 2006-01-26 2011-09-21 株式会社ディスコ Laser processing equipment

Also Published As

Publication number Publication date
CN101623685A (en) 2010-01-13
KR20100005643A (en) 2010-01-15
TW201002463A (en) 2010-01-16
JP2010012508A (en) 2010-01-21

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