JP4664013B2 - 高周波半導体装置の製造方法 - Google Patents
高周波半導体装置の製造方法 Download PDFInfo
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- JP4664013B2 JP4664013B2 JP2004190110A JP2004190110A JP4664013B2 JP 4664013 B2 JP4664013 B2 JP 4664013B2 JP 2004190110 A JP2004190110 A JP 2004190110A JP 2004190110 A JP2004190110 A JP 2004190110A JP 4664013 B2 JP4664013 B2 JP 4664013B2
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- H—ELECTRICITY
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal
- H01L23/53266—Additional layers associated with refractory-metal layers, e.g. adhesion, barrier, cladding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
12 大型垂直ビアホール
13 絶縁層
14 フォトレジスト層
14P フォトレジストパターン
15 ダマシンパターン
16 拡散障壁層
17 シード層
18 インダクタ
19 ビアコンタクトプラグ
21 第2半導体基板
22 素子分離膜
23 PMOSトランジスタ
24 NMOSトランジスタ
25〜29 第1〜第5金属配線
30 インダクタ連結配線
100 第1ウェーハ
200 第2ウェーハ
Claims (6)
- 第1半導体基板に0.5〜50μmの直径と1〜300μmの深さを有する大型垂直ビアホールを形成する段階と、
前記ビアホールの形成された全体上部の表面に沿って絶縁層を形成する段階と、
前記絶縁層上にフォトレジスト層を形成した後パターニングして、フォトレジストパターンによって定義される前記ビアホールを含むダマシンパターンを形成する段階と、
前記ビアホール及び前記ダマシンパターンを含んだ全体構造上部の表面に沿って拡散障壁層及びシード層を順次形成する段階と、
前記ビアホール及び前記ダマシンパターン内に導電性物質を充填して前記第1半導体基板の前面にビアコンタクトプラグ及びこれを含むインダクタを形成する段階と、
バックサイドグラインディング工程を行うより、第1半導体基板の後面にビアコンタクトプラグの底面部が露出する第1ウェーハを製造する段階と、
第2半導体基板に多層金属配線構造の論理素子を形成する段階と、
前記金属配線を含んだ全体構造の上部にインダクタ連結配線を形成して第2ウェーハを製造する段階と、
前記第1ウェーハのビアコンタクトプラグを前記第2ウェーハのインダクタ連結結線の上部に電気的に接合させる段階とを含む高周波半導体装置の製造方法。 - 前記絶縁層はLTO又はHTOを用いて形成する請求項1記載の高周波半導体装置の製造方法。
- 前記拡散障壁層はionized PVD TiN、CVD TiN、MOCVD TiN、ionized PVD Ta、ionized PVD TaN、CVD Ta、CVD TaN、CVD WN、PVD TiAlN、PVD TiSiN、CVD TiAlN、CVD TiSiN及びCVD TaSiNよるなる群より選択されたいずれか一つを単独で或いは2つ以上を積層させて形成する請求項1記載の高周波半導体装置の製造方法。
- 前記シード層はCu、Ag、Au、Ti及びAlのいずれか一つをPVD法、CVD法、ALD法、電気メッキ法又は無電解メッキ法のいずれか一つの方法を用いて形成する請求項1記載の高周波半導体装置の製造方法。
- 前記導電性物質はCu、Al、Wのようなインダクタとして用いられる物質である請求項1記載の高周波半導体装置の製造方法。
- 前記接合させる工程は、ウェーハとウェーハとの間に100〜10000mbarの圧力を加えてAr、N2、H2+Ar又はH2+N2ガス雰囲気で1分〜2時間、200〜500℃の温度で熱処理する請求項1記載の高周波半導体装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030100166A KR100569590B1 (ko) | 2003-12-30 | 2003-12-30 | 고주파 반도체 장치 및 그 제조방법 |
Publications (2)
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JP2005197638A JP2005197638A (ja) | 2005-07-21 |
JP4664013B2 true JP4664013B2 (ja) | 2011-04-06 |
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JP2004190110A Expired - Fee Related JP4664013B2 (ja) | 2003-12-30 | 2004-06-28 | 高周波半導体装置の製造方法 |
Country Status (4)
Country | Link |
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US (1) | US7037800B2 (ja) |
JP (1) | JP4664013B2 (ja) |
KR (1) | KR100569590B1 (ja) |
CN (1) | CN100337330C (ja) |
Families Citing this family (37)
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JP2006196668A (ja) * | 2005-01-13 | 2006-07-27 | Toshiba Corp | 半導体装置及びその製造方法 |
US7534722B2 (en) * | 2005-06-14 | 2009-05-19 | John Trezza | Back-to-front via process |
US8456015B2 (en) | 2005-06-14 | 2013-06-04 | Cufer Asset Ltd. L.L.C. | Triaxial through-chip connection |
US7989958B2 (en) | 2005-06-14 | 2011-08-02 | Cufer Assett Ltd. L.L.C. | Patterned contact |
US8308053B2 (en) * | 2005-08-31 | 2012-11-13 | Micron Technology, Inc. | Microfeature workpieces having alloyed conductive structures, and associated methods |
KR100694424B1 (ko) * | 2006-02-17 | 2007-03-12 | 주식회사 하이닉스반도체 | 멀티 칩 패키지 장치 및 그 형성 방법 |
US8455350B2 (en) * | 2006-08-18 | 2013-06-04 | Globalfoundries Singapore Pte. Ltd. | Integrated circuit system employing gate shield and/or ground shield |
KR20080018052A (ko) * | 2006-08-23 | 2008-02-27 | 동부일렉트로닉스 주식회사 | 반도체 소자 및 그 제조방법 |
KR100737155B1 (ko) * | 2006-08-28 | 2007-07-06 | 동부일렉트로닉스 주식회사 | 반도체 소자의 고주파 인덕터 제조 방법 |
CN101663742B (zh) * | 2006-12-29 | 2013-11-06 | 丘费尔资产股份有限公司 | 具有贯穿芯片连接的前端处理晶片 |
US7939941B2 (en) * | 2007-06-27 | 2011-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Formation of through via before contact processing |
KR100889556B1 (ko) * | 2007-08-31 | 2009-03-23 | 주식회사 동부하이텍 | 반도체 소자의 인덕터 및 그 제조방법 |
US8853830B2 (en) | 2008-05-14 | 2014-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System, structure, and method of manufacturing a semiconductor substrate stack |
KR100991220B1 (ko) | 2008-07-21 | 2010-11-04 | 삼성전자주식회사 | 접착된 계면을 갖는 기판 내의 콘택 구조체, 이를 구비하는반도체 소자 및 이를 제조하는 방법들 |
JP2010067916A (ja) * | 2008-09-12 | 2010-03-25 | Panasonic Corp | 集積回路装置 |
US8749027B2 (en) * | 2009-01-07 | 2014-06-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Robust TSV structure |
US8691664B2 (en) * | 2009-04-20 | 2014-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Backside process for a substrate |
US9799562B2 (en) * | 2009-08-21 | 2017-10-24 | Micron Technology, Inc. | Vias and conductive routing layers in semiconductor substrates |
US8362599B2 (en) * | 2009-09-24 | 2013-01-29 | Qualcomm Incorporated | Forming radio frequency integrated circuits |
JP5421742B2 (ja) * | 2009-11-24 | 2014-02-19 | パナソニック株式会社 | トランス |
US8304863B2 (en) * | 2010-02-09 | 2012-11-06 | International Business Machines Corporation | Electromigration immune through-substrate vias |
US8288243B2 (en) * | 2010-04-15 | 2012-10-16 | Texas Instruments Incorporated | Method for fabricating through substrate microchannels |
US8466061B2 (en) | 2010-09-23 | 2013-06-18 | Infineon Technologies Ag | Method for forming a through via in a semiconductor element and semiconductor element comprising the same |
CN102136531A (zh) * | 2011-02-12 | 2011-07-27 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制造方法 |
US8587127B2 (en) * | 2011-06-15 | 2013-11-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structures and methods of forming the same |
KR101934045B1 (ko) | 2012-03-22 | 2019-01-02 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
JP6012262B2 (ja) | 2012-05-31 | 2016-10-25 | キヤノン株式会社 | 半導体装置の製造方法 |
KR102031908B1 (ko) * | 2013-02-06 | 2019-10-14 | 삼성전자주식회사 | 관통 전극을 갖는 반도체 소자 및 그 형성 방법 |
CN103165571B (zh) * | 2013-02-28 | 2015-10-28 | 江阴长电先进封装有限公司 | 一种新型硅基低阻电感结构及其晶圆级封装方法 |
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US9048127B2 (en) * | 2013-09-25 | 2015-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three dimensional circuit including shielded inductor and method of forming same |
US9637375B2 (en) * | 2014-04-15 | 2017-05-02 | Taiwan Semiconductor Manufacturing Company Limited | MEMS device having a getter structure and method of forming the same |
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CN107731783A (zh) * | 2017-11-15 | 2018-02-23 | 武汉新芯集成电路制造有限公司 | 一种键合晶圆及其工艺 |
JP7378166B2 (ja) * | 2018-10-30 | 2023-11-13 | 北京航空航天大学 | Memsソレノイドトランス及びその製造方法 |
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KR20220048806A (ko) * | 2020-10-13 | 2022-04-20 | 현대자동차주식회사 | 절연 기판 및 이를 적용한 양면냉각 파워모듈 |
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2003
- 2003-12-30 KR KR1020030100166A patent/KR100569590B1/ko active IP Right Grant
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2004
- 2004-06-28 JP JP2004190110A patent/JP4664013B2/ja not_active Expired - Fee Related
- 2004-06-29 US US10/878,315 patent/US7037800B2/en active Active
- 2004-08-03 CN CNB2004100559816A patent/CN100337330C/zh active Active
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JPH0613256A (ja) * | 1992-03-04 | 1994-01-21 | Toshiba Corp | 平面型磁気素子の製造方法 |
JP2001028354A (ja) * | 1999-05-12 | 2001-01-30 | Sony Corp | 半導体装置の製造方法 |
JP2001077315A (ja) * | 1999-06-30 | 2001-03-23 | Toshiba Corp | 集積回路装置及びその製造方法、並びに回路基板及びその製造方法 |
JP2002057037A (ja) * | 2000-08-09 | 2002-02-22 | Fuji Electric Co Ltd | 複合集積回路およびその製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
US20050139954A1 (en) | 2005-06-30 |
CN100337330C (zh) | 2007-09-12 |
US7037800B2 (en) | 2006-05-02 |
JP2005197638A (ja) | 2005-07-21 |
CN1638124A (zh) | 2005-07-13 |
KR100569590B1 (ko) | 2006-04-10 |
KR20050070527A (ko) | 2005-07-07 |
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