JP4618075B2 - ネガ型感光性樹脂組成物及びパターン形成方法 - Google Patents

ネガ型感光性樹脂組成物及びパターン形成方法 Download PDF

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Publication number
JP4618075B2
JP4618075B2 JP2005276496A JP2005276496A JP4618075B2 JP 4618075 B2 JP4618075 B2 JP 4618075B2 JP 2005276496 A JP2005276496 A JP 2005276496A JP 2005276496 A JP2005276496 A JP 2005276496A JP 4618075 B2 JP4618075 B2 JP 4618075B2
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Japan
Prior art keywords
photosensitive resin
group
resin composition
negative photosensitive
component
Prior art date
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Expired - Lifetime
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JP2005276496A
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English (en)
Japanese (ja)
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JP2006189788A5 (enExample
JP2006189788A (ja
Inventor
知典 峯岸
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HD MicroSystems Ltd
Original Assignee
Hitachi Chemical DuPont Microsystems Ltd
HD MicroSystems Ltd
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Priority to JP2005276496A priority Critical patent/JP4618075B2/ja
Application filed by Hitachi Chemical DuPont Microsystems Ltd, HD MicroSystems Ltd filed Critical Hitachi Chemical DuPont Microsystems Ltd
Priority to PCT/JP2006/312357 priority patent/WO2007034604A1/ja
Priority to KR1020087009228A priority patent/KR100981830B1/ko
Priority to US12/067,911 priority patent/US8871422B2/en
Priority to TW095122118A priority patent/TWI407255B/zh
Publication of JP2006189788A publication Critical patent/JP2006189788A/ja
Publication of JP2006189788A5 publication Critical patent/JP2006189788A5/ja
Priority to US13/006,300 priority patent/US8758977B2/en
Application granted granted Critical
Publication of JP4618075B2 publication Critical patent/JP4618075B2/ja
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
JP2005276496A 2004-09-29 2005-09-22 ネガ型感光性樹脂組成物及びパターン形成方法 Expired - Lifetime JP4618075B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005276496A JP4618075B2 (ja) 2004-09-29 2005-09-22 ネガ型感光性樹脂組成物及びパターン形成方法
KR1020087009228A KR100981830B1 (ko) 2005-09-22 2006-06-20 네거티브형 감광성 수지 조성물, 패턴 형성방법 및전자부품
US12/067,911 US8871422B2 (en) 2005-09-22 2006-06-20 Negative-type photosensitive resin composition, pattern forming method and electronic parts
TW095122118A TWI407255B (zh) 2005-09-22 2006-06-20 負片型感光性樹脂組成物、圖案形成方法以及電子零件
PCT/JP2006/312357 WO2007034604A1 (ja) 2005-09-22 2006-06-20 ネガ型感光性樹脂組成物、パターン形成方法及び電子部品
US13/006,300 US8758977B2 (en) 2005-09-22 2011-01-13 Negative-type photosensitive resin composition, pattern forming method and electronic parts

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004283962 2004-09-29
JP2004354071 2004-12-07
JP2005276496A JP4618075B2 (ja) 2004-09-29 2005-09-22 ネガ型感光性樹脂組成物及びパターン形成方法

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JP2006189788A JP2006189788A (ja) 2006-07-20
JP2006189788A5 JP2006189788A5 (enExample) 2009-03-05
JP4618075B2 true JP4618075B2 (ja) 2011-01-26

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JP2005276496A Expired - Lifetime JP4618075B2 (ja) 2004-09-29 2005-09-22 ネガ型感光性樹脂組成物及びパターン形成方法

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099979B2 (ja) * 2005-04-27 2012-12-19 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
TWI407255B (zh) 2005-09-22 2013-09-01 Hitachi Chem Dupont Microsys 負片型感光性樹脂組成物、圖案形成方法以及電子零件
US20100159217A1 (en) * 2006-06-20 2010-06-24 Hitachi Chemical Dupont Microsystems, Ltd Negative-type photosensitive resin composition, method for forming patterns, and electronic parts
JP5076390B2 (ja) * 2006-07-31 2012-11-21 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
EP2133743B1 (en) 2007-03-12 2018-01-24 Hitachi Chemical DuPont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
JP5176872B2 (ja) 2007-10-29 2013-04-03 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パタ−ンの製造方法及び電子部品
JP5290686B2 (ja) * 2008-09-26 2013-09-18 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5142918B2 (ja) * 2008-09-26 2013-02-13 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5571990B2 (ja) * 2009-06-04 2014-08-13 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置
JP5771361B2 (ja) * 2010-04-22 2015-08-26 富士フイルム株式会社 パターン形成方法、化学増幅型レジスト組成物、及び、レジスト膜
US10204803B2 (en) 2013-09-17 2019-02-12 Deca Technologies Inc. Two step method of rapid curing a semiconductor polymer layer
US9159547B2 (en) * 2013-09-17 2015-10-13 Deca Technologies Inc. Two step method of rapid curing a semiconductor polymer layer
US9519221B2 (en) * 2014-01-13 2016-12-13 Applied Materials, Inc. Method for microwave processing of photosensitive polyimides
JP6583258B2 (ja) 2014-02-19 2019-10-02 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、それによって形成される硬化膜及びパターン硬化膜、及びそれらの製造方法
US10777633B2 (en) * 2017-09-29 2020-09-15 Sharp Kabushiki Kaisha Display device, display device manufacturing method, and display device manufacturing apparatus
JPWO2024147289A1 (enExample) * 2023-01-06 2024-07-11

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966590B2 (ja) * 1997-11-20 2007-08-29 旭化成エレクトロニクス株式会社 感光性組成物
JP2001033964A (ja) * 1999-07-15 2001-02-09 Hitachi Chem Co Ltd ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
JP4288796B2 (ja) * 1999-10-29 2009-07-01 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2002169286A (ja) * 2000-11-30 2002-06-14 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物、パターンの製造法及び電子部品
JP4211225B2 (ja) * 2001-02-27 2009-01-21 日本ゼオン株式会社 感放射線性樹脂組成物
JP2003121998A (ja) * 2001-10-11 2003-04-23 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物及びパターン製造法及び電子部品

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