JP4616863B2 - 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板 - Google Patents

感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板 Download PDF

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Publication number
JP4616863B2
JP4616863B2 JP2007148647A JP2007148647A JP4616863B2 JP 4616863 B2 JP4616863 B2 JP 4616863B2 JP 2007148647 A JP2007148647 A JP 2007148647A JP 2007148647 A JP2007148647 A JP 2007148647A JP 4616863 B2 JP4616863 B2 JP 4616863B2
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Japan
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group
carbon atoms
resin composition
photosensitive resin
substituted
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JP2007148647A
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English (en)
Japanese (ja)
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JP2008299293A (ja
JP2008299293A5 (enrdf_load_stackoverflow
Inventor
愛子 岩佐
聖夫 有馬
一善 米田
裕 横山
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Priority to JP2007148647A priority Critical patent/JP4616863B2/ja
Priority to TW097120484A priority patent/TWI426347B/zh
Priority to KR1020080052168A priority patent/KR100997862B1/ko
Priority to CN2008101086803A priority patent/CN101320213B/zh
Publication of JP2008299293A publication Critical patent/JP2008299293A/ja
Publication of JP2008299293A5 publication Critical patent/JP2008299293A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2007148647A 2007-06-04 2007-06-04 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板 Active JP4616863B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007148647A JP4616863B2 (ja) 2007-06-04 2007-06-04 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板
TW097120484A TWI426347B (zh) 2007-06-04 2008-06-02 A photosensitive resin composition, and a flexible circuit board using the same
KR1020080052168A KR100997862B1 (ko) 2007-06-04 2008-06-03 감광성 수지 조성물 및 그것을 이용하여 얻어지는 플렉시블배선판
CN2008101086803A CN101320213B (zh) 2007-06-04 2008-06-04 感光性树脂组合物及使用其得到的挠性电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007148647A JP4616863B2 (ja) 2007-06-04 2007-06-04 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板

Publications (3)

Publication Number Publication Date
JP2008299293A JP2008299293A (ja) 2008-12-11
JP2008299293A5 JP2008299293A5 (enrdf_load_stackoverflow) 2010-07-15
JP4616863B2 true JP4616863B2 (ja) 2011-01-19

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Family Applications (1)

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JP2007148647A Active JP4616863B2 (ja) 2007-06-04 2007-06-04 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板

Country Status (4)

Country Link
JP (1) JP4616863B2 (enrdf_load_stackoverflow)
KR (1) KR100997862B1 (enrdf_load_stackoverflow)
CN (1) CN101320213B (enrdf_load_stackoverflow)
TW (1) TWI426347B (enrdf_load_stackoverflow)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050711B2 (ja) * 2007-07-30 2012-10-17 日立化成工業株式会社 感光性樹脂組成物及びそれを用いた感光性エレメント、並びにレジストパターンの形成方法及び永久マスク
JP2009251585A (ja) * 2008-04-11 2009-10-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びそれを用いた感光性エレメント
JP5291488B2 (ja) * 2009-02-18 2013-09-18 京セラケミカル株式会社 感光性熱硬化型樹脂組成物、およびフレキシブルプリント配線板
JP5261242B2 (ja) * 2009-03-23 2013-08-14 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5377021B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5349113B2 (ja) * 2009-03-30 2013-11-20 太陽ホールディングス株式会社 感光性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5549099B2 (ja) * 2009-03-31 2014-07-16 凸版印刷株式会社 感光性樹脂組成物、カラーフィルタ及びカラーフィルタの製造方法
JP5216682B2 (ja) * 2009-04-27 2013-06-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5475350B2 (ja) * 2009-07-02 2014-04-16 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5395552B2 (ja) * 2009-07-28 2014-01-22 京セラケミカル株式会社 感光性熱硬化型樹脂組成物及びフレキシブルプリント配線板
JP5537864B2 (ja) * 2009-08-19 2014-07-02 太陽ホールディングス株式会社 光硬化性樹脂組成物
WO2011034124A1 (ja) * 2009-09-18 2011-03-24 太陽インキ製造株式会社 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2011099919A (ja) * 2009-11-04 2011-05-19 Mitsubishi Chemicals Corp 着色樹脂組成物、カラーフィルタ、液晶表示装置及び有機ｅｌディスプレイ
JP5537566B2 (ja) * 2009-12-14 2014-07-02 太陽ホールディングス株式会社 ソルダーレジストインキ組成物及びその硬化物
JP5415923B2 (ja) * 2009-12-14 2014-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及びそれらを用いたプリント配線板
CN102741751B (zh) * 2010-02-01 2014-07-16 富士胶片株式会社 感光性组合物，感光性膜，感光性层叠体，用于形成永久图案的方法以及印刷电路板
JP6061440B2 (ja) * 2010-02-25 2017-01-18 太陽ホールディングス株式会社 ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP6211780B2 (ja) * 2012-03-27 2017-10-11 太陽インキ製造株式会社 難燃性硬化性樹脂組成物、ドライフィルム、難燃性被膜およびプリント配線板
KR101473556B1 (ko) * 2012-03-27 2014-12-16 다이요 잉키 세이조 가부시키가이샤 난연성 경화성 수지 조성물, 드라이 필름, 난연성 피막 및 인쇄 배선판
JP6211781B2 (ja) * 2012-03-27 2017-10-11 太陽インキ製造株式会社 難燃性硬化性樹脂組成物、ドライフィルム、難燃性被膜およびプリント配線板
JP5506885B2 (ja) * 2012-10-01 2014-05-28 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5688116B2 (ja) * 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5632978B1 (ja) * 2013-06-28 2014-11-26 太陽インキ製造株式会社 光硬化性組成物およびその硬化物
JP6462983B2 (ja) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
CN112888748B (zh) * 2018-10-19 2023-09-22 株式会社钟化 树脂组合物、固化膜、带固化膜的印刷电路板及其制造方法
CN109957283B (zh) * 2019-02-27 2021-09-10 江苏艾森半导体材料股份有限公司 高阻燃性阻焊油墨
CN111665685A (zh) * 2019-03-08 2020-09-15 株式会社田村制作所 感光性树脂组合物
MX2021012381A (es) * 2019-04-12 2022-01-04 Gourgen Ambartsoumian Cartucho de incrustación de tejidos con protector.
CN116107163A (zh) * 2022-12-28 2023-05-12 上海玟昕科技有限公司 一种含纳米粒子的正性光刻胶组合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001213889A (ja) * 2000-01-28 2001-08-07 Nippon Shokubai Co Ltd 反応性リン化合物
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
CN100578359C (zh) * 2003-03-06 2010-01-06 日本化药株式会社 感光树脂组合物和其固化物
JP2006251715A (ja) * 2005-03-14 2006-09-21 Kaneka Corp 難燃性を有する感光性樹脂組成物及び感光性ドライフィルムレジスト
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
JP4826415B2 (ja) * 2005-10-12 2011-11-30 東レ株式会社 感光性樹脂組成物
JP4840017B2 (ja) * 2006-04-13 2011-12-21 日立化成工業株式会社 感光性樹脂組成物及び感光性エレメント
WO2008066101A1 (fr) * 2006-12-01 2008-06-05 Kyocera Chemical Corporation Composition de resine de type thermodurcissable photosensible et tableau de connexions imprime flexible
WO2008087812A1 (ja) * 2007-01-18 2008-07-24 Showa Highpolymer Co., Ltd. リン含有難燃剤及びそれを含む硬化性難燃性樹脂組成物

Also Published As

Publication number Publication date
KR20080106855A (ko) 2008-12-09
JP2008299293A (ja) 2008-12-11
TWI426347B (zh) 2014-02-11
CN101320213A (zh) 2008-12-10
KR100997862B1 (ko) 2010-12-01
CN101320213B (zh) 2012-07-04
TW200912533A (en) 2009-03-16

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