JP4614075B2 - エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置 - Google Patents
エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置 Download PDFInfo
- Publication number
- JP4614075B2 JP4614075B2 JP2005081054A JP2005081054A JP4614075B2 JP 4614075 B2 JP4614075 B2 JP 4614075B2 JP 2005081054 A JP2005081054 A JP 2005081054A JP 2005081054 A JP2005081054 A JP 2005081054A JP 4614075 B2 JP4614075 B2 JP 4614075B2
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- Prior art keywords
- component
- epoxy
- diglycidyl ether
- emitting semiconductor
- light emitting
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005081054A JP4614075B2 (ja) | 2005-03-22 | 2005-03-22 | エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置 |
TW095109697A TWI418591B (zh) | 2005-03-22 | 2006-03-21 | Epoxy. Polysiloxane mixed resin composition and its manufacturing method and light emitting semiconductor device |
KR1020060025617A KR101252301B1 (ko) | 2005-03-22 | 2006-03-21 | 에폭시ㆍ실리콘 혼성 수지 조성물, 그의 제조 방법, 및발광 반도체 장치 |
CN2006100682631A CN1837284B (zh) | 2005-03-22 | 2006-03-22 | 环氧-有机硅混合树脂组合物及其制造方法、以及发光半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005081054A JP4614075B2 (ja) | 2005-03-22 | 2005-03-22 | エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006265274A JP2006265274A (ja) | 2006-10-05 |
JP4614075B2 true JP4614075B2 (ja) | 2011-01-19 |
Family
ID=37014798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005081054A Active JP4614075B2 (ja) | 2005-03-22 | 2005-03-22 | エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4614075B2 (ko) |
KR (1) | KR101252301B1 (ko) |
CN (1) | CN1837284B (ko) |
TW (1) | TWI418591B (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4844732B2 (ja) * | 2005-05-24 | 2011-12-28 | 信越化学工業株式会社 | 発光半導体装置 |
JP2007191697A (ja) * | 2005-12-19 | 2007-08-02 | Shin Etsu Chem Co Ltd | エポキシ・シリコーン混成樹脂組成物及び光半導体装置 |
JP5010247B2 (ja) * | 2006-11-20 | 2012-08-29 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
JP5608955B2 (ja) * | 2007-02-06 | 2014-10-22 | 日亜化学工業株式会社 | 発光装置及びその製造方法並びに発光装置用成形体 |
US9102786B2 (en) | 2007-09-27 | 2015-08-11 | Mitsubishi Gas Chemical Company, Inc. | Epoxy resin composition, cured object obtained therefrom, and light-emitting diode |
JP2010248385A (ja) * | 2009-04-16 | 2010-11-04 | Jsr Corp | 組成物、硬化体、および光半導体封止材 |
JP5373696B2 (ja) * | 2010-05-07 | 2013-12-18 | 信越化学工業株式会社 | 新規シルフェニレン骨格含有シリコーン型高分子化合物及びその製造方法 |
JP2012049519A (ja) * | 2010-07-26 | 2012-03-08 | Mitsubishi Chemicals Corp | 半導体発光装置用パッケージ及び発光装置 |
JP6232714B2 (ja) * | 2013-03-08 | 2017-11-22 | 日本ゼオン株式会社 | エポキシ樹脂組成物、封止材、および光半導体装置 |
CN103694478B (zh) * | 2013-12-10 | 2016-01-13 | 广东聚合有机硅材料有限公司 | 一种聚硅氧烷的合成方法 |
EP3158595B1 (en) | 2014-06-19 | 2021-12-01 | Inkron Oy | Led lamp with siloxane particle material |
JP5972433B1 (ja) * | 2015-07-21 | 2016-08-17 | 古河電気工業株式会社 | 電子デバイス封止用硬化性吸湿性樹脂組成物、樹脂硬化物および電子デバイス |
JP6010210B2 (ja) * | 2015-12-10 | 2016-10-19 | 株式会社カネカ | 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置 |
TWI784922B (zh) * | 2015-12-18 | 2022-12-01 | 香港商英克倫股份有限公司 | Led燈、led燈之製造方法以及led裝置之密封方法 |
CN116925624B (zh) * | 2023-08-24 | 2024-02-23 | 湖南庆润新材料有限公司 | 一种自清洁减反射涂料、涂层及制备方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57133120A (en) * | 1981-02-12 | 1982-08-17 | Toshiba Corp | Manufacturing of cast epoxy resin |
JPS6189221A (ja) * | 1984-10-08 | 1986-05-07 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH03294331A (ja) * | 1990-04-11 | 1991-12-25 | Toshiba Silicone Co Ltd | 封止用エポキシ樹脂組成物およびその製造方法 |
JPH08224833A (ja) * | 1994-11-17 | 1996-09-03 | Shin Etsu Chem Co Ltd | シリコーンゴムとシリコーン−エポキシ樹脂の複合体及びその製造方法 |
JPH10135522A (ja) * | 1996-10-29 | 1998-05-22 | Nippon Perunotsukusu Kk | 発光ダイオードデバイス |
JP2000248182A (ja) * | 1999-03-02 | 2000-09-12 | Dow Corning Toray Silicone Co Ltd | 樹脂用添加剤、硬化性樹脂組成物、および硬化樹脂 |
JP2004289102A (ja) * | 2003-01-29 | 2004-10-14 | Asahi Kasei Chemicals Corp | 発光素子封止用熱硬化性組成物および発光ダイオード |
JP2004292714A (ja) * | 2003-03-28 | 2004-10-21 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード |
JP2004292807A (ja) * | 2003-03-12 | 2004-10-21 | Shin Etsu Chem Co Ltd | 発光半導体被覆保護材及び発光半導体装置 |
JP2005158766A (ja) * | 2003-11-20 | 2005-06-16 | Shin Etsu Chem Co Ltd | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
JP4300418B2 (ja) * | 2004-04-30 | 2009-07-22 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5618984A (en) * | 1994-06-24 | 1997-04-08 | Mitsui Toatsu Chemicals, Inc. | Phenol aralkyl resins, preparation process thereof and epoxy resin compositions |
CN1155562A (zh) * | 1995-10-11 | 1997-07-30 | 陶氏康宁公司 | 改进粘合性的可固化有机聚硅氧烷组合物 |
CA2236391A1 (en) * | 1997-05-02 | 1998-11-02 | Bayer Aktiengesellschaft | Addition crosslinking silicone rubber mixtures, a process for the preparation thereof, a process for the preparation of composite molded parts and the use thereof |
FR2775481B1 (fr) * | 1998-02-27 | 2003-10-24 | Rhodia Chimie Sa | Composition silicone adhesive reticulable et utilisation de cette composition pour le collage de substrats divers |
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2005
- 2005-03-22 JP JP2005081054A patent/JP4614075B2/ja active Active
-
2006
- 2006-03-21 TW TW095109697A patent/TWI418591B/zh not_active IP Right Cessation
- 2006-03-21 KR KR1020060025617A patent/KR101252301B1/ko active IP Right Grant
- 2006-03-22 CN CN2006100682631A patent/CN1837284B/zh not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57133120A (en) * | 1981-02-12 | 1982-08-17 | Toshiba Corp | Manufacturing of cast epoxy resin |
JPS6189221A (ja) * | 1984-10-08 | 1986-05-07 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH03294331A (ja) * | 1990-04-11 | 1991-12-25 | Toshiba Silicone Co Ltd | 封止用エポキシ樹脂組成物およびその製造方法 |
JPH08224833A (ja) * | 1994-11-17 | 1996-09-03 | Shin Etsu Chem Co Ltd | シリコーンゴムとシリコーン−エポキシ樹脂の複合体及びその製造方法 |
JPH10135522A (ja) * | 1996-10-29 | 1998-05-22 | Nippon Perunotsukusu Kk | 発光ダイオードデバイス |
JP2000248182A (ja) * | 1999-03-02 | 2000-09-12 | Dow Corning Toray Silicone Co Ltd | 樹脂用添加剤、硬化性樹脂組成物、および硬化樹脂 |
JP2004289102A (ja) * | 2003-01-29 | 2004-10-14 | Asahi Kasei Chemicals Corp | 発光素子封止用熱硬化性組成物および発光ダイオード |
JP2004292807A (ja) * | 2003-03-12 | 2004-10-21 | Shin Etsu Chem Co Ltd | 発光半導体被覆保護材及び発光半導体装置 |
JP2004292714A (ja) * | 2003-03-28 | 2004-10-21 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード |
JP2005158766A (ja) * | 2003-11-20 | 2005-06-16 | Shin Etsu Chem Co Ltd | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
JP4300418B2 (ja) * | 2004-04-30 | 2009-07-22 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
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CN1837284A (zh) | 2006-09-27 |
CN1837284B (zh) | 2010-10-06 |
TW200706592A (en) | 2007-02-16 |
JP2006265274A (ja) | 2006-10-05 |
KR20060102287A (ko) | 2006-09-27 |
KR101252301B1 (ko) | 2013-04-08 |
TWI418591B (zh) | 2013-12-11 |
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