JP4608297B2 - 積層配線基板の製造方法 - Google Patents
積層配線基板の製造方法 Download PDFInfo
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- JP4608297B2 JP4608297B2 JP2004353236A JP2004353236A JP4608297B2 JP 4608297 B2 JP4608297 B2 JP 4608297B2 JP 2004353236 A JP2004353236 A JP 2004353236A JP 2004353236 A JP2004353236 A JP 2004353236A JP 4608297 B2 JP4608297 B2 JP 4608297B2
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- via hole
- circuit
- layer
- insulating layer
- forming
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000002184 metal Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 30
- 239000003990 capacitor Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000010408 film Substances 0.000 description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 20
- 239000010949 copper Substances 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 230000003071 parasitic effect Effects 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
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- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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- H05K2203/04—Soldering or other types of metallurgic bonding
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
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- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Production Of Multi-Layered Print Wiring Board (AREA)
Description
11,12 内側回路層
13 内蔵抵抗
14,16 外側絶縁層
15,17 銅箔
20,141,142,143,161,162 ビアホール
22 下層金属膜
23 上層金属膜
24 半田ペースト
26,27 外側回路層
30 バンプ電極
32 内蔵コンデンサ
100 積層配線基板
101,112,126 所定領域
111,121-124 ビアランド
125,181-183,191 穴
LB1〜LB3 レーザビーム
Claims (5)
- バンプ電極を有する集積回路チップの実装が可能な積層配線基板の製造方法であって、
第1の絶縁層の表裏面上にそれぞれ第1及び第2の回路層を形成する工程と、
前記第1の回路層上に第2の絶縁層を形成する工程と、
前記第2の絶縁層の表面上に第3の回路層を形成する工程と、
前記集積回路チップのバンプ電極を挿入可能な第1のビアホールを前記第1及び第2の絶縁層に、前記集積回路チップの他のバンプ電極を挿入可能な第2のビアホールを前記第2の絶縁層に、前記集積回路チップのバンプ電極のピッチと同じピッチで形成する工程と、
前記第1乃至第3の回路層のうち少なくとも1つと接触する第1の導電膜を前記第1のビアホールの内側面上に、前記第1及び第3の回路層のうち少なくとも1つと接触する第2の導電膜を前記第2のビアホールの内側面上に全面にわたって形成する工程と、
前記第1及び第2のビアホール内にそれぞれ前記導電膜に接して金属ペーストを充填する工程と、
前記第3の回路層上の前記導電膜を回路パターンに加工する工程と、
前記第3の回路層上の加工された前記導電膜をマスクとして、前記第3の回路層をエッチングする工程と
を含み、
前記導電膜を形成する工程は、前記第3の回路層、前記第1のビアホールおよび前記第2のビアホールの内側面上の全面にわたって導電膜を形成する工程を含み、
前記第1のビアホールは、前記第1の絶縁層に形成された第1のサブビアホールと、前記第2の絶縁層に形成され前記第1のサブビアホールと連通する第2のサブビアホールとから構成されることを特徴とする積層配線基板の製造方法。 - 請求項1に記載の積層配線基板の製造方法であって、
前記第1及び第2の回路層を形成する工程は、内蔵コンデンサを形成するために、前記第1の絶縁層の所定領域を挟むように前記第1及び第2の回路層のうち所定領域が互いに対向するように前記第1及び第2の回路層を形成することを特徴とする積層配線基板の製造方法。 - 請求項1または請求項2に記載の積層配線基板の製造方法であってさらに、
内蔵抵抗を前記第1又は第2の回路層内に形成する工程を含むことを特徴とする積層配線基板の製造方法。 - 請求項1〜請求項3のいずれか1項に記載の積層配線基板の製造方法であって、
前記第3の回路層は第1の穴を有し、前記第1の回路層は前記第1の穴と対向する位置に前記第1の穴よりも小さい第2の穴を有し、
前記ビアホールを形成する工程は、前記第3の回路層の上方からレーザビームを照射することにより、前記第3の回路層をマスクとして前記第1の穴と連通する前記第2のサブビアホールを前記第2の絶縁層に形成し、さらに前記第1の回路層をマスクとして前記第
2の穴と連通する前記第1のサブビアホールを前記第1の絶縁層に形成することを特徴とする積層配線基板の製造方法。 - バンプ電極を有する積層回路チップの実装が可能な積層配線基板の製造方法であって、
第1の絶縁層の表裏面上にそれぞれ第1及び第2の回路層を形成する工程と、
前記第1の回路層上に第2の絶縁層を形成する工程と、
前記第2の絶縁層の表面上に第3の回路層を形成する工程と、
前記集積回路チップのバンプ電極を挿入可能な第1のビアホールを前記第1及び第2の絶縁層に、前記集積回路チップの他のバンプ電極を挿入可能な第2のビアホールを前記第2の絶縁層に、前記集積回路チップのバンプ電極のピッチと同じピッチで形成する工程と、
前記第3の回路層、前記第1のビアホールおよび前記第2のビアホールの内側面上の全面にわたって、互いに異なる種類の金属を用いた2つの層を含む導電膜を形成して、前記第1乃至第3の回路層のうち少なくとも1つと接触する第1の導電膜を前記第1のビアホールの内側面上に、前記第1及び第3の回路層のうち少なくとも1つと接触する第2の導電膜を前記第2のビアホールの内側面上に形成する工程と、
前記第1及び第2のビアホール内にそれぞれ前記導電膜に接して金属ペーストを充填する工程と、
前記第3の回路層上の導電膜を回路パターンに加工する工程と、
前記第3の回路層上の加工された前記導電膜をマスクとして、前記第3の回路層をエッチングする工程と
を含み、
前記第1及び第2の回路層を形成する工程は、内蔵コンデンサを形成するために、前記第1の絶縁層の所定領域を挟むように前記第1及び第2の回路層のうち所定領域が互いに対向するように前記第1及び第2の回路層を形成し、
前記第1及び第2の回路層は、内蔵抵抗を含み、
前記第3の回路層は第1の穴を有し、前記第1の回路層は前記第1の穴と対向する位置に前記第1の穴よりも小さい第2の穴を有し、
前記第1のビアホールは、前記第1の絶縁層に形成された第1のサブビアホールと、前記第2の絶縁層に形成され前記第1のサブビアホールと連通する第2のサブビアホールとを含み、
前記ビアホールを形成する工程は、前記第3の回路層の上方からレーザビームを照射することにより、前記第3の回路層をマスクとして前記第1の穴と連通する前記第2のサブビアホールを前記第2の絶縁層に形成し、さらに前記第1の回路層をマスクとして前記第2の穴と連通する前記第1のサブビアホールを前記第1の絶縁層に形成することを特徴とする積層配線基板の製造方法。
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JP2004353236A JP4608297B2 (ja) | 2004-12-06 | 2004-12-06 | 積層配線基板の製造方法 |
US11/164,791 US7605075B2 (en) | 2004-12-06 | 2005-12-06 | Multilayer circuit board and method of manufacturing the same |
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US7605075B2 (en) | 2009-10-20 |
US20060226537A1 (en) | 2006-10-12 |
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