JP4607755B2 - 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 - Google Patents

基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 Download PDF

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Publication number
JP4607755B2
JP4607755B2 JP2005364966A JP2005364966A JP4607755B2 JP 4607755 B2 JP4607755 B2 JP 4607755B2 JP 2005364966 A JP2005364966 A JP 2005364966A JP 2005364966 A JP2005364966 A JP 2005364966A JP 4607755 B2 JP4607755 B2 JP 4607755B2
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Japan
Prior art keywords
substrate
cleaning
liquid
wafer
gas
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Expired - Lifetime
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JP2005364966A
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English (en)
Japanese (ja)
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JP2007173308A (ja
Inventor
宏光 難波
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005364966A priority Critical patent/JP4607755B2/ja
Priority to KR1020060124421A priority patent/KR101061937B1/ko
Priority to TW095147503A priority patent/TW200738358A/zh
Priority to US11/641,038 priority patent/US7699939B2/en
Publication of JP2007173308A publication Critical patent/JP2007173308A/ja
Application granted granted Critical
Publication of JP4607755B2 publication Critical patent/JP4607755B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
JP2005364966A 2005-12-19 2005-12-19 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体 Expired - Lifetime JP4607755B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005364966A JP4607755B2 (ja) 2005-12-19 2005-12-19 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
KR1020060124421A KR101061937B1 (ko) 2005-12-19 2006-12-08 기판 세정 방법 및 기판 세정 장치
TW095147503A TW200738358A (en) 2005-12-19 2006-12-18 Substrate cleaning method and substrate cleaning apparatus
US11/641,038 US7699939B2 (en) 2005-12-19 2006-12-19 Substrate cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005364966A JP4607755B2 (ja) 2005-12-19 2005-12-19 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
JP2007173308A JP2007173308A (ja) 2007-07-05
JP4607755B2 true JP4607755B2 (ja) 2011-01-05

Family

ID=38172014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005364966A Expired - Lifetime JP4607755B2 (ja) 2005-12-19 2005-12-19 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体

Country Status (4)

Country Link
US (1) US7699939B2 (enExample)
JP (1) JP4607755B2 (enExample)
KR (1) KR101061937B1 (enExample)
TW (1) TW200738358A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4708243B2 (ja) * 2006-03-28 2011-06-22 東京エレクトロン株式会社 液処理装置および液処理方法ならびにコンピュータ読取可能な記憶媒体
KR20090010809A (ko) * 2007-07-24 2009-01-30 삼성전자주식회사 기판 처리 방법
JP5192206B2 (ja) 2007-09-13 2013-05-08 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
US20090241995A1 (en) * 2008-03-31 2009-10-01 Tokyo Electron Limited Substrate cleaning method and apparatus
JP5242508B2 (ja) 2009-06-26 2013-07-24 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
KR101806191B1 (ko) * 2010-06-17 2017-12-07 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치
KR101596750B1 (ko) 2010-06-23 2016-02-23 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치
JP5669461B2 (ja) * 2010-07-01 2015-02-12 株式会社ディスコ スピンナ洗浄装置
JP5985943B2 (ja) * 2012-09-21 2016-09-06 東京エレクトロン株式会社 液処理方法、液処理装置及び液処理用記録媒体
JP5973901B2 (ja) * 2012-12-13 2016-08-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5680705B2 (ja) * 2013-05-17 2015-03-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6379400B2 (ja) 2013-09-26 2018-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP5977727B2 (ja) 2013-11-13 2016-08-24 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
KR101673061B1 (ko) * 2013-12-03 2016-11-04 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP5994804B2 (ja) * 2014-03-17 2016-09-21 東京エレクトロン株式会社 基板洗浄方法
KR101885107B1 (ko) * 2015-06-30 2018-08-06 세메스 주식회사 기판 처리 방법 및 장치
KR101817211B1 (ko) * 2016-05-27 2018-01-11 세메스 주식회사 기판 처리 장치 및 방법
KR102073339B1 (ko) * 2017-03-02 2020-02-05 무진전자 주식회사 웨이퍼 세정방법
KR102891364B1 (ko) * 2017-10-23 2025-11-25 램 리서치 아게 고 종횡비 구조체들의 정지 마찰을 방지하고 그리고/또는 고 종횡비 구조체들을 복구하기 위한 시스템들 및 방법들
CN115475794A (zh) * 2022-10-10 2022-12-16 安徽光智科技有限公司 镜头的清洗方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960555A (en) * 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
JP3691227B2 (ja) * 1996-10-07 2005-09-07 東京エレクトロン株式会社 液処理方法及びその装置
JP3322853B2 (ja) 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
JP2003197590A (ja) * 2001-12-21 2003-07-11 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP3993048B2 (ja) * 2002-08-30 2007-10-17 大日本スクリーン製造株式会社 基板処理装置
JP2004111857A (ja) * 2002-09-20 2004-04-08 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4057396B2 (ja) * 2002-11-01 2008-03-05 大日本スクリーン製造株式会社 基板処理装置
US20050026455A1 (en) * 2003-05-30 2005-02-03 Satomi Hamada Substrate processing apparatus and substrate processing method
CN100423205C (zh) * 2003-11-18 2008-10-01 东京毅力科创株式会社 基板清洗方法、基板清洗装置
JP2005327936A (ja) * 2004-05-14 2005-11-24 Canon Inc 基板の洗浄方法及びその製造方法
EP1763072A4 (en) * 2004-06-04 2010-02-24 Tokyo Electron Ltd SUBSTRATE PURIFICATION METHOD AND COMPUTER READABLE RECORDING MEDIUM
JP2006066501A (ja) * 2004-08-25 2006-03-09 Tokyo Seimitsu Co Ltd スピン洗浄乾燥装置及びスピン洗浄乾燥方法

Also Published As

Publication number Publication date
US20070137677A1 (en) 2007-06-21
JP2007173308A (ja) 2007-07-05
TWI324091B (enExample) 2010-05-01
US7699939B2 (en) 2010-04-20
TW200738358A (en) 2007-10-16
KR101061937B1 (ko) 2011-09-05
KR20070065214A (ko) 2007-06-22

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