JP4596228B2 - マイクロエレクトロニクス基板の平坦化に使用される研磨パッドの研磨面の表面状態を調整およびモニターするための装置および方法 - Google Patents

マイクロエレクトロニクス基板の平坦化に使用される研磨パッドの研磨面の表面状態を調整およびモニターするための装置および方法 Download PDF

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JP4596228B2
JP4596228B2 JP2001520262A JP2001520262A JP4596228B2 JP 4596228 B2 JP4596228 B2 JP 4596228B2 JP 2001520262 A JP2001520262 A JP 2001520262A JP 2001520262 A JP2001520262 A JP 2001520262A JP 4596228 B2 JP4596228 B2 JP 4596228B2
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Prior art keywords
polishing pad
adjustment body
adjustment
polishing
cylinder
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Expired - Fee Related
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JP2001520262A
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Japanese (ja)
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JP2003508904A (ja
JP2003508904A5 (enExample
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スコット イー． ムーア，
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マイクロン テクノロジー， インク．
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Lubricants (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Paper (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2001520262A 1999-08-31 2000-08-31 マイクロエレクトロニクス基板の平坦化に使用される研磨パッドの研磨面の表面状態を調整およびモニターするための装置および方法 Expired - Fee Related JP4596228B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/387,063 1999-08-31
US09/387,063 US6306008B1 (en) 1999-08-31 1999-08-31 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
PCT/US2000/024345 WO2001015865A1 (en) 1999-08-31 2000-08-31 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

Publications (3)

Publication Number Publication Date
JP2003508904A JP2003508904A (ja) 2003-03-04
JP2003508904A5 JP2003508904A5 (enExample) 2007-03-22
JP4596228B2 true JP4596228B2 (ja) 2010-12-08

Family

ID=23528304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001520262A Expired - Fee Related JP4596228B2 (ja) 1999-08-31 2000-08-31 マイクロエレクトロニクス基板の平坦化に使用される研磨パッドの研磨面の表面状態を調整およびモニターするための装置および方法

Country Status (8)

Country Link
US (9) US6306008B1 (enExample)
EP (1) EP1222056B1 (enExample)
JP (1) JP4596228B2 (enExample)
KR (1) KR100708227B1 (enExample)
AT (1) ATE380628T1 (enExample)
AU (1) AU7114600A (enExample)
DE (2) DE60037438D1 (enExample)
WO (1) WO2001015865A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180036526A (ko) 2016-09-30 2018-04-09 가부시키가이샤 에바라 세이사꾸쇼 기판 연마 장치

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