DE69739038D1 - Poliervorrichtung mit Verriegelungsfunktion - Google Patents

Poliervorrichtung mit Verriegelungsfunktion

Info

Publication number
DE69739038D1
DE69739038D1 DE69739038T DE69739038T DE69739038D1 DE 69739038 D1 DE69739038 D1 DE 69739038D1 DE 69739038 T DE69739038 T DE 69739038T DE 69739038 T DE69739038 T DE 69739038T DE 69739038 D1 DE69739038 D1 DE 69739038D1
Authority
DE
Germany
Prior art keywords
polishing device
locking function
locking
function
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69739038T
Other languages
English (en)
Inventor
Katsuhide Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69739038D1 publication Critical patent/DE69739038D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
    • G05B19/4063—Monitoring general control system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/416—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control of velocity, acceleration or deceleration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37434—Measuring vibration of machine or workpiece or tool
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45199—Polish
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50113—Short stroke, retract tool, safe distance from workpiece surface, hover height
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50205—On tool breakage stop machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50276—Detect wear or defect tool, breakage and change tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE69739038T 1996-05-30 1997-05-28 Poliervorrichtung mit Verriegelungsfunktion Expired - Lifetime DE69739038D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16114696 1996-05-30

Publications (1)

Publication Number Publication Date
DE69739038D1 true DE69739038D1 (de) 2008-11-20

Family

ID=15729474

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69739038T Expired - Lifetime DE69739038D1 (de) 1996-05-30 1997-05-28 Poliervorrichtung mit Verriegelungsfunktion
DE69715726T Expired - Lifetime DE69715726T2 (de) 1996-05-30 1997-05-28 Poliervorrichtung mit Verriegelungsfunktion

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69715726T Expired - Lifetime DE69715726T2 (de) 1996-05-30 1997-05-28 Poliervorrichtung mit Verriegelungsfunktion

Country Status (4)

Country Link
US (1) US5904608A (de)
EP (3) EP0810064B1 (de)
KR (1) KR100429299B1 (de)
DE (2) DE69739038D1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3705670B2 (ja) 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
JP3761673B2 (ja) 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP3292835B2 (ja) * 1998-05-06 2002-06-17 信越半導体株式会社 薄板ワークの平面研削方法およびその研削装置
JP2956694B1 (ja) * 1998-05-19 1999-10-04 日本電気株式会社 研磨装置及び研磨方法
US6000998A (en) * 1998-05-29 1999-12-14 Seh America, Inc. System for calibrating wafer edge-grinder
JP2000015549A (ja) * 1998-06-30 2000-01-18 Nidek Co Ltd 眼鏡レンズ加工装置
US6783428B1 (en) * 1999-01-18 2004-08-31 Nsk Ltd. Method for forming grooves on workpiece and for dressing a grindstone used in the groove formation
US6361410B1 (en) * 1999-01-18 2002-03-26 Nsk Ltd. Grinding apparatus for forming grooves on a workpiece and a method for dressing a grindstone used in the apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6896583B2 (en) 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
JP4102081B2 (ja) * 2002-02-28 2008-06-18 株式会社荏原製作所 研磨装置及び研磨面の異物検出方法
US6931330B1 (en) * 2003-06-30 2005-08-16 Lam Research Corporation Methods for monitoring and controlling chemical mechanical planarization
DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
DE10361636B4 (de) * 2003-12-30 2009-12-10 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines seismischen Signals eines seismischen Sensors
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US7090560B2 (en) * 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
KR100541821B1 (ko) * 2004-09-09 2006-01-11 삼성전자주식회사 폴리싱장치의 패드컨디셔너 오동작 감지장치 및 그 방법
US7040954B1 (en) 2004-09-28 2006-05-09 Lam Research Corporation Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing
JP2007152499A (ja) * 2005-12-06 2007-06-21 Fujikoshi Mach Corp ワーク研磨方法
JP5191312B2 (ja) * 2008-08-25 2013-05-08 東京エレクトロン株式会社 プローブの研磨方法、プローブ研磨用プログラム及びプローブ装置
JP5454513B2 (ja) 2011-05-27 2014-03-26 信越半導体株式会社 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
WO2013183799A1 (ko) * 2012-06-07 2013-12-12 이화다이아몬드공업 주식회사 Ｃｍｐ 장치
US9902038B2 (en) 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
CN108803500A (zh) * 2018-06-08 2018-11-13 大连理工大学 一种环抛机的多电机运动控制系统及其控制方法
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3829750A (en) * 1971-02-12 1974-08-13 Bendix Corp Self-adaptive process control
US3813828A (en) * 1973-01-05 1974-06-04 Westinghouse Electric Corp Method for controlling finished thickness of planetary-lapped parts
US4193226A (en) * 1977-09-21 1980-03-18 Kayex Corporation Polishing apparatus
JPS63212465A (ja) * 1987-02-25 1988-09-05 Hoya Corp 研摩方法
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5070655A (en) * 1990-11-30 1991-12-10 Aggarwal Trilok R Machining process monitor
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5222329A (en) * 1992-03-26 1993-06-29 Micron Technology, Inc. Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials
JPH05277929A (ja) * 1992-04-01 1993-10-26 Mitsubishi Materials Corp ポリッシング装置の上軸機構
KR940022734A (ko) * 1993-03-15 1994-10-21 사또 후미오 연마 방법 및 연마 장치
JP3120921B2 (ja) * 1993-03-24 2000-12-25 株式会社村田製作所 ラップ盤の異常検出装置
JP3285663B2 (ja) * 1993-05-11 2002-05-27 ファナック株式会社 工具破損検出装置
JP3119054B2 (ja) * 1993-10-20 2000-12-18 株式会社村田製作所 浮遊砥粒式研磨装置
JPH07112365A (ja) * 1993-10-20 1995-05-02 Murata Mfg Co Ltd 浮遊砥粒式研磨装置
US5653623A (en) * 1993-12-14 1997-08-05 Ebara Corporation Polishing apparatus with improved exhaust
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5439551A (en) * 1994-03-02 1995-08-08 Micron Technology, Inc. Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes

Also Published As

Publication number Publication date
EP1213094A2 (de) 2002-06-12
EP0810064A2 (de) 1997-12-03
US5904608A (en) 1999-05-18
KR970077291A (ko) 1997-12-12
EP1704962A2 (de) 2006-09-27
EP1704962B1 (de) 2008-10-08
DE69715726T2 (de) 2003-08-14
EP0810064A3 (de) 1998-12-23
EP1213094A3 (de) 2003-01-08
EP0810064B1 (de) 2002-09-25
KR100429299B1 (ko) 2004-08-09
EP1704962A3 (de) 2007-08-01
EP1213094A9 (de) 2002-08-07
DE69715726D1 (de) 2002-10-31

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Legal Events

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8364 No opposition during term of opposition