DE60037438D1 - Verfahren und vorrichtung zum konditionieren und überwachen von gebrauchten medien aus chemisch-mechanischer planetierung - Google Patents

Verfahren und vorrichtung zum konditionieren und überwachen von gebrauchten medien aus chemisch-mechanischer planetierung

Info

Publication number
DE60037438D1
DE60037438D1 DE60037438T DE60037438T DE60037438D1 DE 60037438 D1 DE60037438 D1 DE 60037438D1 DE 60037438 T DE60037438 T DE 60037438T DE 60037438 T DE60037438 T DE 60037438T DE 60037438 D1 DE60037438 D1 DE 60037438D1
Authority
DE
Germany
Prior art keywords
conditioning
planarizing
planarizing medium
planetation
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60037438T
Other languages
English (en)
Inventor
Scott E Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of DE60037438D1 publication Critical patent/DE60037438D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Lubricants (AREA)
  • Paper (AREA)
DE60037438T 1999-08-31 2000-08-31 Verfahren und vorrichtung zum konditionieren und überwachen von gebrauchten medien aus chemisch-mechanischer planetierung Expired - Lifetime DE60037438D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/387,063 US6306008B1 (en) 1999-08-31 1999-08-31 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
PCT/US2000/024345 WO2001015865A1 (en) 1999-08-31 2000-08-31 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

Publications (1)

Publication Number Publication Date
DE60037438D1 true DE60037438D1 (de) 2008-01-24

Family

ID=23528304

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60037438T Expired - Lifetime DE60037438D1 (de) 1999-08-31 2000-08-31 Verfahren und vorrichtung zum konditionieren und überwachen von gebrauchten medien aus chemisch-mechanischer planetierung
DE10084938T Expired - Fee Related DE10084938B4 (de) 1999-08-31 2000-08-31 Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE10084938T Expired - Fee Related DE10084938B4 (de) 1999-08-31 2000-08-31 Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden

Country Status (8)

Country Link
US (9) US6306008B1 (de)
EP (1) EP1222056B1 (de)
JP (1) JP4596228B2 (de)
KR (1) KR100708227B1 (de)
AT (1) ATE380628T1 (de)
AU (1) AU7114600A (de)
DE (2) DE60037438D1 (de)
WO (1) WO2001015865A1 (de)

Families Citing this family (134)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6075606A (en) 1996-02-16 2000-06-13 Doan; Trung T. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
JP3426149B2 (ja) * 1998-12-25 2003-07-14 富士通株式会社 半導体製造における研磨廃液再利用方法及び再利用装置
JP3760064B2 (ja) 1999-08-09 2006-03-29 株式会社日立製作所 半導体装置の製造方法及び半導体装置の平坦化加工装置
US6464824B1 (en) * 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP2001198794A (ja) * 2000-01-21 2001-07-24 Ebara Corp 研磨装置
US6969305B2 (en) 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US6498101B1 (en) 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
US6517414B1 (en) * 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
JP2001274122A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US20020016136A1 (en) * 2000-06-16 2002-02-07 Manoocher Birang Conditioner for polishing pads
US6645046B1 (en) * 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6539277B1 (en) * 2000-07-18 2003-03-25 Agilent Technologies, Inc. Lapping surface patterning system
US6520834B1 (en) 2000-08-09 2003-02-18 Micron Technology, Inc. Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6592443B1 (en) 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6652764B1 (en) 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6623329B1 (en) 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002126998A (ja) 2000-10-26 2002-05-08 Hitachi Ltd 研磨方法および研磨装置
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US6752698B1 (en) * 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
EP1247616B1 (de) * 2001-04-02 2006-07-05 Infineon Technologies AG Verfahren zur Konditionierung der Oberfläche eines Polierkissens
US6910947B2 (en) * 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7047099B2 (en) * 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US20020192966A1 (en) * 2001-06-19 2002-12-19 Shanmugasundram Arulkumar P. In situ sensor based control of semiconductor processing procedure
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6635211B2 (en) * 2001-06-25 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd Reinforced polishing pad for linear chemical mechanical polishing and method for forming
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
US6950716B2 (en) 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US20030037090A1 (en) * 2001-08-14 2003-02-20 Koh Horne L. Tool services layer for providing tool service functions in conjunction with tool functions
US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6722943B2 (en) 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6666749B2 (en) 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6949016B1 (en) * 2002-03-29 2005-09-27 Lam Research Corporation Gimballed conditioning apparatus
AU2003219400A1 (en) * 2002-05-07 2003-11-11 Koninklijke Philips Electronics N.V. Cleaning head
US6702646B1 (en) 2002-07-01 2004-03-09 Nevmet Corporation Method and apparatus for monitoring polishing plate condition
US7004822B2 (en) * 2002-07-31 2006-02-28 Ebara Technologies, Inc. Chemical mechanical polishing and pad dressing method
US7094695B2 (en) * 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US6918301B2 (en) * 2002-11-12 2005-07-19 Micron Technology, Inc. Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
DE10261465B4 (de) * 2002-12-31 2013-03-21 Advanced Micro Devices, Inc. Anordnung zum chemisch-mechanischen Polieren mit einem verbesserten Konditionierwerkzeug
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US6827635B2 (en) * 2003-03-05 2004-12-07 Infineon Technologies Aktiengesellschaft Method of planarizing substrates
US6905399B2 (en) * 2003-04-10 2005-06-14 Applied Materials, Inc. Conditioning mechanism for chemical mechanical polishing
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
US7544113B1 (en) * 2003-05-29 2009-06-09 Tbw Industries, Inc. Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system
DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
GB2420302B (en) * 2003-09-30 2007-03-07 Advanced Micro Devices Inc A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
US7727049B2 (en) * 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
WO2005043132A1 (en) * 2003-10-31 2005-05-12 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
DE10361636B4 (de) * 2003-12-30 2009-12-10 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern des chemisch-mechanischen Polierens mittels eines seismischen Signals eines seismischen Sensors
US6958005B1 (en) * 2004-03-30 2005-10-25 Lam Research Corporation Polishing pad conditioning system
US6969307B2 (en) * 2004-03-30 2005-11-29 Lam Research Corporation Polishing pad conditioning and polishing liquid dispersal system
US6886387B1 (en) * 2004-04-28 2005-05-03 Taiwan Semiconductor Manufacturing Co., Ltd Brush pressure calibration apparatus and method
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7094134B2 (en) * 2004-06-22 2006-08-22 Samsung Austin Semiconductor, L.P. Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
US6953382B1 (en) 2004-06-24 2005-10-11 Novellus Systems, Inc. Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing
US7077722B2 (en) * 2004-08-02 2006-07-18 Micron Technology, Inc. Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US7059939B2 (en) * 2004-09-02 2006-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad conditioner and monitoring method therefor
US7040954B1 (en) 2004-09-28 2006-05-09 Lam Research Corporation Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing
US7959984B2 (en) * 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US7163435B2 (en) * 2005-01-31 2007-01-16 Tech Semiconductor Singapore Pte. Ltd. Real time monitoring of CMP pad conditioning process
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
KR101279819B1 (ko) * 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 방사-편향 연마 패드
US7210981B2 (en) * 2005-05-26 2007-05-01 Applied Materials, Inc. Smart conditioner rinse station
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
US20070032176A1 (en) * 2005-08-04 2007-02-08 Chih-Ming Hsu Method for polishing diamond wafers
JP2007111283A (ja) * 2005-10-21 2007-05-10 Timothy Tamio Nemoto 歯冠研磨装置
JP2007144564A (ja) * 2005-11-28 2007-06-14 Ebara Corp 研磨装置
US8251776B2 (en) * 2006-01-23 2012-08-28 Freescale Semiconductor, Inc. Method and apparatus for conditioning a CMP pad
US8142261B1 (en) 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7473162B1 (en) * 2006-02-06 2009-01-06 Chien-Min Sung Pad conditioner dresser with varying pressure
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
WO2007097046A1 (ja) * 2006-02-24 2007-08-30 Ihi Compressor And Machinery Co., Ltd. シリコン粒子の処理方法及び装置
US20070212983A1 (en) * 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
TWI422798B (zh) * 2006-10-06 2014-01-11 Ebara Corp 加工終點檢測方法、研磨方法及研磨裝置
US20080288252A1 (en) * 2007-03-07 2008-11-20 Cerra Joseph P Speech recognition of speech recorded by a mobile communication facility
US7754612B2 (en) 2007-03-14 2010-07-13 Micron Technology, Inc. Methods and apparatuses for removing polysilicon from semiconductor workpieces
US7476144B2 (en) * 2007-06-13 2009-01-13 Black & Decker Inc. Sander
US7534165B2 (en) * 2007-06-13 2009-05-19 Black & Decker Inc. Sander
US7722435B2 (en) * 2007-06-13 2010-05-25 Black & Decker Inc. Sander
US7485026B2 (en) * 2007-06-13 2009-02-03 Black & Decker Inc. Sander
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
CN100546770C (zh) * 2007-11-20 2009-10-07 浙江工业大学 抛光垫修整装置
US8179629B2 (en) * 2007-12-26 2012-05-15 Nitto Denko Corporation Flexure based shock and vibration sensor for head suspensions in hard disk drives
EP2123146B1 (de) * 2008-05-20 2011-05-18 CNH Belgium N.V. Regelungssystem für Einzugswalzen eines Häckslers
US8337279B2 (en) * 2008-06-23 2012-12-25 Applied Materials, Inc. Closed-loop control for effective pad conditioning
US8096852B2 (en) * 2008-08-07 2012-01-17 Applied Materials, Inc. In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
JP4682236B2 (ja) * 2008-08-29 2011-05-11 アプライド マテリアルズ インコーポレイテッド 軸動作検出機構およびコンディショナーヘッド
KR100985861B1 (ko) * 2008-09-24 2010-10-08 씨앤지하이테크 주식회사 반도체용 슬러리 공급장치 및 슬러리 공급방법
US20100107726A1 (en) * 2008-10-31 2010-05-06 Mitsubishi Materials Corporation Device for determining the coefficient of friction of diamond conditioner discs and a method of use thereof
US20100130107A1 (en) * 2008-11-24 2010-05-27 Applied Materials, Inc. Method and apparatus for linear pad conditioning
KR101004435B1 (ko) * 2008-11-28 2010-12-28 세메스 주식회사 기판 연마 장치 및 이를 이용한 기판 연마 방법
US8210021B2 (en) * 2009-01-16 2012-07-03 Christopher Bryan Crass Aromas kit
US20110104989A1 (en) * 2009-04-30 2011-05-05 First Principles LLC Dressing bar for embedding abrasive particles into substrates
KR101170760B1 (ko) * 2009-07-24 2012-08-03 세메스 주식회사 기판 연마 장치
JP5407693B2 (ja) * 2009-09-17 2014-02-05 旭硝子株式会社 ガラス基板の製造方法、研磨方法及び研磨装置、並びにガラス基板
WO2011139501A2 (en) * 2010-04-30 2011-11-10 Applied Materials, Inc. Pad conditioning sweep torque modeling to achieve constant removal rate
KR101126382B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계식 연마시스템의 컨디셔너
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8758085B2 (en) 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
CN102157413B (zh) * 2011-01-20 2012-08-15 大连理工大学 小尺寸晶片抛光摩擦力在线测量装置
JP5898420B2 (ja) * 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
CN102267095B (zh) * 2011-08-26 2013-04-03 宇环数控机床股份有限公司 一种砂轮在线监控与修整方法
CN102501187A (zh) * 2011-11-04 2012-06-20 厦门大学 区域压力调整抛光盘
WO2013183799A1 (ko) * 2012-06-07 2013-12-12 이화다이아몬드공업 주식회사 Cmp 장치
JP6113552B2 (ja) * 2013-03-29 2017-04-12 株式会社荏原製作所 研磨装置及び摩耗検知方法
JP6121795B2 (ja) * 2013-05-15 2017-04-26 株式会社荏原製作所 ドレッシング装置、該ドレッシング装置を備えた研磨装置、および研磨方法
JP6327958B2 (ja) * 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
JP6715153B2 (ja) 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
CN108581843A (zh) * 2018-04-28 2018-09-28 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) 抛光修整装置及研磨抛光设备
US11660722B2 (en) 2018-08-31 2023-05-30 Applied Materials, Inc. Polishing system with capacitive shear sensor
KR20200043214A (ko) * 2018-10-17 2020-04-27 주식회사 케이씨텍 화학 기계적 연마 장치의 컨디셔너
KR102629678B1 (ko) * 2018-11-08 2024-01-29 주식회사 케이씨텍 기판 처리 장치
JP7155035B2 (ja) * 2019-02-18 2022-10-18 株式会社荏原製作所 研磨装置および研磨方法
KR20200127328A (ko) * 2019-05-02 2020-11-11 삼성전자주식회사 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
CN115716237A (zh) * 2022-11-24 2023-02-28 西安奕斯伟材料科技有限公司 一种用于对硅片进行抛光的装置和方法

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US561847A (en) * 1896-06-09 Automatic motor stop
US3031195A (en) 1961-01-10 1962-04-24 Clyne W Lunsford Phonograph stylus and record cleaner and protective apparatus
US4438601A (en) 1981-04-06 1984-03-27 Olson Alvin O Sandpaper cleaning device
US4462188A (en) 1982-06-21 1984-07-31 Nalco Chemical Company Silica sol compositions for polishing silicon wafers
US4841684A (en) 1986-08-05 1989-06-27 Hall Jr E Winthrop Surface-finishing member
US5078801A (en) * 1990-08-14 1992-01-07 Intel Corporation Post-polish cleaning of oxidized substrates by reverse colloidation
US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5154021A (en) 1991-06-26 1992-10-13 International Business Machines Corporation Pneumatic pad conditioner
US5245796A (en) 1992-04-02 1993-09-21 At&T Bell Laboratories Slurry polisher using ultrasonic agitation
JPH0693080A (ja) * 1992-09-10 1994-04-05 Asahi Chem Ind Co Ltd 焼付け変色が少ないブロックイソシアネート含有樹脂
US5384986A (en) 1992-09-24 1995-01-31 Ebara Corporation Polishing apparatus
US5216843A (en) 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
JP2622069B2 (ja) 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置
US5441598A (en) 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5536202A (en) 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
ATE186001T1 (de) 1994-08-09 1999-11-15 Ontrak Systems Inc Linear poliergerät und wafer planarisierungsverfahren
US5522965A (en) 1994-12-12 1996-06-04 Texas Instruments Incorporated Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
JP3438383B2 (ja) * 1995-03-03 2003-08-18 ソニー株式会社 研磨方法およびこれに用いる研磨装置
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US5578529A (en) 1995-06-02 1996-11-26 Motorola Inc. Method for using rinse spray bar in chemical mechanical polishing
TW334379B (en) * 1995-08-24 1998-06-21 Matsushita Electric Ind Co Ltd Compression mechanism for grinding machine of semiconductor substrate
US5938507A (en) * 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5658190A (en) 1995-12-15 1997-08-19 Micron Technology, Inc. Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5616069A (en) 1995-12-19 1997-04-01 Micron Technology, Inc. Directional spray pad scrubber
US5743784A (en) * 1995-12-19 1998-04-28 Applied Materials, Inc. Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
US5575706A (en) * 1996-01-11 1996-11-19 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) apparatus and polish method
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
US5618447A (en) 1996-02-13 1997-04-08 Micron Technology, Inc. Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers
US5645682A (en) 1996-05-28 1997-07-08 Micron Technology, Inc. Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
EP1704962B1 (de) * 1996-05-30 2008-10-08 Ebara Corporation Poliervorrichtung mit Verriegelungsfunktion
US5664990A (en) 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
US5833519A (en) * 1996-08-06 1998-11-10 Micron Technology, Inc. Method and apparatus for mechanical polishing
US6007696A (en) * 1996-09-28 1999-12-28 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic water
JP3568709B2 (ja) * 1996-09-30 2004-09-22 株式会社東芝 超純水の純化方法及び純化装置
JPH10144650A (ja) * 1996-11-11 1998-05-29 Mitsubishi Electric Corp 半導体材料の洗浄装置
JP3455035B2 (ja) * 1996-11-14 2003-10-06 株式会社東芝 電解イオン水生成装置及び半導体製造装置
US6139428A (en) * 1996-12-17 2000-10-31 Vsli Technology, Inc. Conditioning ring for use in a chemical mechanical polishing machine
JPH10315124A (ja) * 1997-05-16 1998-12-02 Hitachi Ltd 研磨方法および研磨装置
US6022400A (en) * 1997-05-22 2000-02-08 Nippon Steel Corporation Polishing abrasive grains, polishing agent and polishing method
US5934980A (en) * 1997-06-09 1999-08-10 Micron Technology, Inc. Method of chemical mechanical polishing
US5975994A (en) * 1997-06-11 1999-11-02 Micron Technology, Inc. Method and apparatus for selectively conditioning a polished pad used in planarizng substrates
US5961373A (en) * 1997-06-16 1999-10-05 Motorola, Inc. Process for forming a semiconductor device
US5885137A (en) 1997-06-27 1999-03-23 Siemens Aktiengesellschaft Chemical mechanical polishing pad conditioner
US6149512A (en) * 1997-11-06 2000-11-21 Aplex, Inc. Linear pad conditioning apparatus
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
JP2956694B1 (ja) * 1998-05-19 1999-10-04 日本電気株式会社 研磨装置及び研磨方法
JP3001054B1 (ja) * 1998-06-29 2000-01-17 日本電気株式会社 研磨装置及び研磨パッドの表面調整方法
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
US6042457A (en) * 1998-07-10 2000-03-28 Aplex, Inc. Conditioner assembly for a chemical mechanical polishing apparatus
JP3214467B2 (ja) * 1998-11-05 2001-10-02 日本電気株式会社 研磨材用ドレッシング方法及びその装置
JP3045236B1 (ja) * 1999-01-18 2000-05-29 株式会社東京精密 研磨布コンディショナを備えたウェハ研磨装置
JP2000311876A (ja) * 1999-04-27 2000-11-07 Hitachi Ltd 配線基板の製造方法および製造装置
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6213846B1 (en) * 1999-07-12 2001-04-10 International Business Machines Corporation Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers

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US7172491B2 (en) 2007-02-06
US20010006871A1 (en) 2001-07-05
EP1222056B1 (de) 2007-12-12
WO2001015865A1 (en) 2001-03-08
JP4596228B2 (ja) 2010-12-08
US7229336B2 (en) 2007-06-12
ATE380628T1 (de) 2007-12-15
US6572440B2 (en) 2003-06-03
US6969297B2 (en) 2005-11-29
KR100708227B1 (ko) 2007-04-17
US6306008B1 (en) 2001-10-23
US6755718B2 (en) 2004-06-29
US20010006874A1 (en) 2001-07-05
JP2003508904A (ja) 2003-03-04
KR20020041415A (ko) 2002-06-01
US6733363B2 (en) 2004-05-11
US20010006873A1 (en) 2001-07-05
DE10084938B4 (de) 2010-07-29
US6840840B2 (en) 2005-01-11
EP1222056A4 (de) 2005-01-05
EP1222056A1 (de) 2002-07-17
US20010006870A1 (en) 2001-07-05
US20030060128A1 (en) 2003-03-27
DE10084938T1 (de) 2002-09-12
US20060003673A1 (en) 2006-01-05
AU7114600A (en) 2001-03-26
US20040097169A1 (en) 2004-05-20
US20010006872A1 (en) 2001-07-05
US6773332B2 (en) 2004-08-10

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