DE10084938T1 - Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden - Google Patents

Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden

Info

Publication number
DE10084938T1
DE10084938T1 DE10084938T DE10084938T DE10084938T1 DE 10084938 T1 DE10084938 T1 DE 10084938T1 DE 10084938 T DE10084938 T DE 10084938T DE 10084938 T DE10084938 T DE 10084938T DE 10084938 T1 DE10084938 T1 DE 10084938T1
Authority
DE
Germany
Prior art keywords
conditioning
planarizing
planarizing medium
chemical mechanical
media used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10084938T
Other languages
English (en)
Other versions
DE10084938B4 (de
Inventor
Scott E Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE10084938T1 publication Critical patent/DE10084938T1/de
Application granted granted Critical
Publication of DE10084938B4 publication Critical patent/DE10084938B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Paper (AREA)
  • Lubricants (AREA)
DE10084938T 1999-08-31 2000-08-31 Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden Expired - Fee Related DE10084938B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/387,063 1999-08-31
US09/387,063 US6306008B1 (en) 1999-08-31 1999-08-31 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
PCT/US2000/024345 WO2001015865A1 (en) 1999-08-31 2000-08-31 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

Publications (2)

Publication Number Publication Date
DE10084938T1 true DE10084938T1 (de) 2002-09-12
DE10084938B4 DE10084938B4 (de) 2010-07-29

Family

ID=23528304

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10084938T Expired - Fee Related DE10084938B4 (de) 1999-08-31 2000-08-31 Vorrichtung und Verfahren zum Konditionieren und Überwachen von Medien, die für die chemisch-mechanische Planarisierung verwendet werden
DE60037438T Expired - Lifetime DE60037438D1 (de) 1999-08-31 2000-08-31 Verfahren und vorrichtung zum konditionieren und überwachen von gebrauchten medien aus chemisch-mechanischer planetierung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60037438T Expired - Lifetime DE60037438D1 (de) 1999-08-31 2000-08-31 Verfahren und vorrichtung zum konditionieren und überwachen von gebrauchten medien aus chemisch-mechanischer planetierung

Country Status (8)

Country Link
US (9) US6306008B1 (de)
EP (1) EP1222056B1 (de)
JP (1) JP4596228B2 (de)
KR (1) KR100708227B1 (de)
AT (1) ATE380628T1 (de)
AU (1) AU7114600A (de)
DE (2) DE10084938B4 (de)
WO (1) WO2001015865A1 (de)

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* Cited by examiner, † Cited by third party
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US6306008B1 (en) 2001-10-23
US6755718B2 (en) 2004-06-29
US20010006871A1 (en) 2001-07-05
EP1222056A4 (de) 2005-01-05
US7172491B2 (en) 2007-02-06
US20010006872A1 (en) 2001-07-05
US20010006873A1 (en) 2001-07-05
ATE380628T1 (de) 2007-12-15
DE60037438D1 (de) 2008-01-24
US6840840B2 (en) 2005-01-11
KR100708227B1 (ko) 2007-04-17
US20010006870A1 (en) 2001-07-05
US6572440B2 (en) 2003-06-03
US6773332B2 (en) 2004-08-10
US20030060128A1 (en) 2003-03-27
US20060003673A1 (en) 2006-01-05
US20010006874A1 (en) 2001-07-05
EP1222056B1 (de) 2007-12-12
KR20020041415A (ko) 2002-06-01
JP2003508904A (ja) 2003-03-04
DE10084938B4 (de) 2010-07-29
AU7114600A (en) 2001-03-26
US20040097169A1 (en) 2004-05-20
US6969297B2 (en) 2005-11-29
JP4596228B2 (ja) 2010-12-08
US7229336B2 (en) 2007-06-12
WO2001015865A1 (en) 2001-03-08
US6733363B2 (en) 2004-05-11

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