JP4584755B2 - 両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法 - Google Patents

両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法 Download PDF

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JP4584755B2
JP4584755B2 JP2005109990A JP2005109990A JP4584755B2 JP 4584755 B2 JP4584755 B2 JP 4584755B2 JP 2005109990 A JP2005109990 A JP 2005109990A JP 2005109990 A JP2005109990 A JP 2005109990A JP 4584755 B2 JP4584755 B2 JP 4584755B2
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surface plate
pad
roller
polishing pad
polishing
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JP2006289522A (ja
JP2006289522A5 (https=
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仁志 長山
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SpeedFam Co Ltd
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SpeedFam Co Ltd
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005109990A 2005-04-06 2005-04-06 両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法 Expired - Lifetime JP4584755B2 (ja)

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JP2005109990A JP4584755B2 (ja) 2005-04-06 2005-04-06 両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法

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JP2005109990A JP4584755B2 (ja) 2005-04-06 2005-04-06 両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法

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JP2006289522A JP2006289522A (ja) 2006-10-26
JP2006289522A5 JP2006289522A5 (https=) 2008-05-01
JP4584755B2 true JP4584755B2 (ja) 2010-11-24

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016222063A1 (de) * 2016-11-10 2018-05-17 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
JP7497614B2 (ja) * 2020-05-19 2024-06-11 信越半導体株式会社 両面研磨装置の研磨パッド貼り付け方法
CN117381596A (zh) * 2023-10-20 2024-01-12 合肥陶陶新材料科技有限公司 陶瓷基板双面同步抛光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939163U (ja) * 1982-09-06 1984-03-13 株式会社東芝 研摩布クリ−ニング装置
JPS62102974A (ja) * 1985-10-29 1987-05-13 Hoya Corp 加工用パツドと平面加工装置
JPH0642059U (ja) * 1992-11-16 1994-06-03 千代田株式会社 研磨機の研磨布貼付用定盤
JP4041577B2 (ja) * 1998-03-16 2008-01-30 スピードファム株式会社 ポリッシング装置の定盤及び研磨パッド貼着方法
JPH11300599A (ja) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd ワークの片面研磨方法及び装置
JP4023247B2 (ja) * 2002-03-27 2007-12-19 住友電気工業株式会社 研磨布の上定盤への取付方法
JP2004017188A (ja) * 2002-06-13 2004-01-22 Nikon Corp 研磨体の貼付装置及び方法、この装置もしくは方法により作られた研磨部材を用いた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス

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